公开(公告)号：US20130069399A1

公开(公告)日：2013-03-21

申请号：US13520437

申请日：2010-01-08

申请人： Hisashi Ishida ,  Yutaka Suzuki ,  Daisuke Takezaki ,  Shohei Ezaki

发明人： Hisashi Ishida ,  Yutaka Suzuki ,  Daisuke Takezaki ,  Shohei Ezaki

IPC分类号： A47C7/74 ,  B60N2/24

CPC分类号： A47C7/744 ,  A47C7/742 ,  B60N2/24 ,  B60N2/5635 ,  B60N2/5657 ,  B60N2/5692 ,  B60N2/686

摘要： To provide a racing bucket seat and a cooling system for racing cars capable of effectively suppressing the rise of a driver's body, meeting the safety regulations. A racing bucket seat includes a plurality of shell through holes formed in a seat shell, an outer shell fixed on the seat shell to cover the shell through holes from a rear side of the seat shell and formed with a layer-like flow passage between the outer shell and a rear surface of the seat shell, and an air intake port introducing the air into the flow passage.

摘要翻译： <本发明要解决的问题>提供一种能够有效地抑制驾驶员身体上升的赛车的赛车座和冷却系统，从而达到安全规定。 <解决问题的手段>赛车座位具有形成在座椅壳体上的多个壳体通孔，固定在座椅壳体上的外壳，通过座椅壳体后侧的孔覆盖壳体，并形成有 外壳和座壳的后表面之间的层状流动通道，以及将空气引入到流路中的进气口。

公开(公告)号：US07884520B2

公开(公告)日：2011-02-08

申请号：US12264453

申请日：2008-11-04

申请人： Hisashi Ishida ,  Tohru Yumoto ,  Masaki Ishizeki ,  Susumu Miyazaki ,  Kazushi Hamaya

发明人： Hisashi Ishida ,  Tohru Yumoto ,  Masaki Ishizeki ,  Susumu Miyazaki ,  Kazushi Hamaya

IPC分类号： H02K1/00

CPC分类号： H02K1/148

摘要： A brushless motor according to the present invention is provided with a tubular stator case, a stator core fitted into the stator case, and a rotor rotatably supported via a bearing inside the stator core. The stator core includes a tubular yoke portion and a plurality of split cores which are detachably mounted on the tubular yoke portion. A plurality of commutating-pole teeth which extend radially inward are integrally formed on an inner peripheral surface of the tubular yoke portion at regular intervals in the peripheral direction of the tubular yoke portion; and a root portion of each of the commutating-pole teeth has inclined shoulders which are gradually enlarged radially outward.

摘要翻译： 根据本发明的无刷电动机设置有管状定子壳体，嵌合到定子壳体中的定子芯体和通过定子芯体内部的轴承可旋转地支撑的转子。 定子铁芯包括管状磁轭部分和可拆卸地安装在管状磁轭部分上的多个分裂磁芯。 在筒状轭部的圆周方向上以规则的间隔一体地形成有多个径向向内延伸的换向齿， 并且每个整流齿的根部具有逐渐向径向外侧逐渐增大的倾斜肩部。

公开(公告)号：US20090127953A1

公开(公告)日：2009-05-21

申请号：US12264307

申请日：2008-11-04

申请人： Tohru YUMOTO ,  Masaki ISHIZEKI ,  Hisashi ISHIDA ,  Susumu MIYAZAKI ,  Kazushi HAMAYA ,  Yuichi UEBAYASHI

发明人： Tohru YUMOTO ,  Masaki ISHIZEKI ,  Hisashi ISHIDA ,  Susumu MIYAZAKI ,  Kazushi HAMAYA ,  Yuichi UEBAYASHI

IPC分类号： H02K5/22

CPC分类号： H02K5/15

摘要： A brushless motor according to the present invention is provided with: a tubular stator case; a stator core fitted into the stator case; and a rotor rotatably supported via a bearing inside the stator core, wherein: an inner flange portion which extends radially inward is formed at a peripheral edge of an opening of one end of the stator case; and a bracket is fixed to the inner flange portion while contacting therewith so as to close the opening.

摘要翻译： 根据本发明的无刷电动机设有：管状定子壳体; 安装在定子壳体中的定子芯体; 以及通过所述定子铁心内的轴承可旋转地支撑的转子，其中：径向向内延伸的内凸缘部分形成在所述定子壳体的一端的开口的周边边缘处; 并且托架在与其接触的同时固定在内凸缘部分上以便关闭开口。

公开(公告)号：US06813830B2

公开(公告)日：2004-11-09

申请号：US09791016

申请日：2001-02-22

申请人： Kazuki Saito ,  Osamu Hashiguchi ,  Hisashi Ishida ,  Shin Kamiyamane

发明人： Kazuki Saito ,  Osamu Hashiguchi ,  Hisashi Ishida ,  Shin Kamiyamane

IPC分类号： H01R4304

CPC分类号： H01R12/592 ,  H01R12/596 ,  H01R12/772 ,  H01R12/778 ,  Y10T29/49172 ,  Y10T29/49181 ,  Y10T29/49192 ,  Y10T29/49194 ,  Y10T29/5193

摘要： In a cable connector (1) in which a core wire (81a, 81c) of a cable (81) is pressed against a base contact (3) in a predetermined direction (a) intersecting the core wire, a support contact (5) is cooperated with the base contact to clamp the core wire therebetween in the predetermined direction. The base contact is coupled to a base insulator (2). The support contact is coupled to a cover insulator (4) movable against the base insulator in the predetermined direction. A partition wall (42) is formed integral with the cover insulator and positions the core wire to make the core wire face the base contact. When the cover insulator is moved towards the base insulator, the core wire becomes in press contact with the base contact.

摘要翻译： 在电缆连接器（1）中，电缆（81）的芯线（81a，81c）沿与芯线相交的预定方向（a）压靠在基座触点（3）上，支撑触点（5） 与基部触点配合，以在预定的方向夹紧芯线。 基极触点耦合到基极绝缘体（2）。 支撑触点耦合到能够沿预定方向抵靠基底绝缘体移动的覆盖绝缘体（4）。 分隔壁（42）与盖绝缘体一体地形成，并且定位芯线以使芯线面向基部接触。 当盖绝缘体向基底绝缘体移动时，芯线与基座触点压接。

公开(公告)号：US5611322A

公开(公告)日：1997-03-18

申请号：US565651

申请日：1995-11-29

申请人： Tatsuya Matsuzaki ,  Hisashi Ishida

发明人： Tatsuya Matsuzaki ,  Hisashi Ishida

IPC分类号： A63B69/40 ,  F41B4/00

CPC分类号： F41B4/00 ,  A63B2208/12 ,  A63B69/406

摘要： A disc discharging toy for discharging discs is provided which comprises a plurality of resilient discs, a magazine for holding the discs in a stacked position, a forcibly feeding device for forcibly feeding the discs so held in the supply portion piece by piece toward a discharging position, and a discharging device for discharging the disc so fed. The discharging device includes two rollers and a motor for rotating at least one of the two rollers in a direction in which the disc is discharged.

摘要翻译： 提供了一种用于排放盘的盘排放玩具，其包括多个弹性盘，用于将盘保持在堆叠位置的仓，用于强制地将被保持在供给部中的盘一个接一个地朝向排出位置供给的盘的强制进给装置 以及用于排出如此馈送的盘的放电装置。 排出装置包括两个辊和用于沿盘排出的方向旋转两个辊中的至少一个的电动机。

公开(公告)号：US5590461A

公开(公告)日：1997-01-07

申请号：US467809

申请日：1995-06-06

申请人： Hisashi Ishida

发明人： Hisashi Ishida

IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/28 ,  H05K3/46 ,  H05K3/36

CPC分类号： H05K3/462 ,  H01L21/4857 ,  H01L23/5383 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15312 ,  H05K1/0306 ,  H05K1/0313 ,  H05K2201/0195 ,  H05K3/28 ,  H05K3/4605 ,  H05K3/4623 ,  Y10S428/901 ,  Y10T29/49126

摘要： A multi-layer wiring board has at least one stacking block with an insulating hard substrate, a grounding layer being provided in the insulating hard substrate. A plurality of wiring layers are provided over upper and lower major surfaces of the insulating hard substrate. A plurality of throughholes are provided in the insulating hard substrate for connecting wiring layers on the top and bottom surfaces of the substrate. A base block has an insulating base board, and at least one wiring layer provided over one major surface of the insulating base board. Connections electrically and mechanically connect the at least one stacking block and the base block. The stacking block and the base block may be simultaneously manufactured in parallel with others. The stacking block and the base block may be adhered to each other by an adhesive layer. Each electrical connection between the stacking block and the base block may be achieved with bumps and pads.

摘要翻译： 多层布线基板具有至少一层具有绝缘性硬质基板的堆叠块，在绝缘性硬质基板上设置有接地层。 在绝缘性硬质基板的上下表面设置有多个布线层。 绝缘性硬质基板上设有多个通孔，用于连接基板的顶面和底面上的布线层。 基块具有绝缘基板，以及设置在绝缘基板的一个主表面上的至少一个布线层。 连接件电气和机械连接至少一个堆叠块和基座块。 堆叠块和基座可以与其他平行同时制造。 堆叠块和基块可以通过粘合剂层彼此粘合。 堆叠块和基座之间的每个电连接可以用凸块和焊盘实现。

公开(公告)号：US5360988A

公开(公告)日：1994-11-01

申请号：US903202

申请日：1992-06-23

申请人： Takayuki Uda ,  Toshiro Hiramoto ,  Nobuo Tamba ,  Hisashi Ishida ,  Kazuhiro Akimoto ,  Masanori Odaka ,  Tasuku Tanaka ,  Jun Hirokawa ,  Masayuki Ohayashi

发明人： Takayuki Uda ,  Toshiro Hiramoto ,  Nobuo Tamba ,  Hisashi Ishida ,  Kazuhiro Akimoto ,  Masanori Odaka ,  Tasuku Tanaka ,  Jun Hirokawa ,  Masayuki Ohayashi

IPC分类号： H01L21/60 ,  H01L23/055 ,  H01L23/525 ,  H01L27/118 ,  H01L23/48 ,  F42C19/12 ,  G06F15/60 ,  H01L21/285

CPC分类号： H01L24/81 ,  H01L23/055 ,  H01L23/5256 ,  H01L24/11 ,  H01L27/118 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L23/3171 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0107 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/3025

摘要： Disclosed are a semiconductor integrated circuit device and methods for production thereof. An embodiment of the invention is a semiconductor chip that comprises fuses constituting part of redundancy circuits formed therein, the fuses being made of the same ingredients as those of a CCB bump substrate metal. The fuses are patterned simultaneously during the patterning of the CCB bump substrate metal. This involves forming the fuses using at least part of the ingredients of an electrode conductor pattern in the chip. The cutting regions of the fuses are made of only one of the metal layers constituting the substrate. The principal plane of the semiconductor chip has a fuse protective film formed over at least the cutting regions of the fuses for protection of the latter. In operation, a switch MOSFET under switching control of a redundancy signal is used to select one of two transmission paths, one carrying an address signal or a decode signal, the other carrying a reference voltage. This allows a faulty circuit to be replaced with the corresponding redundancy circuit.

摘要翻译： 公开了半导体集成电路装置及其制造方法。 本发明的实施例是一种半导体芯片，其包括构成其中形成的冗余电路的一部分的熔丝，该熔丝由与CCB凸块基板金属相同的部件制成。 在CCB凸块基板金属的图案化期间，熔丝同时被图案化。 这涉及使用芯片中的电极导体图案的成分的至少一部分来形成保险丝。 保险丝的切割区域仅由构成基板的金属层中的一个构成。 半导体芯片的主平面具有至少形成在保险丝的切割区域上的保险丝保护膜，用于保护保险丝。 在操作中，使用冗余信号的开关控制下的开关MOSFET来选择两个传输路径中的一个，一个传送地址信号或解码信号，另一个传送参考电压。 这样可以将故障电路替换为相应的冗余电路。

公开(公告)号：US4764804A

公开(公告)日：1988-08-16

申请号：US15019

申请日：1987-02-17

申请人： Kunizo Sahara ,  Kanji Otsuka ,  Hisashi Ishida

发明人： Kunizo Sahara ,  Kanji Otsuka ,  Hisashi Ishida

IPC分类号： H01L23/36 ,  H01L23/24 ,  H01L23/373 ,  H01L25/07 ,  H01L23/26

CPC分类号： H01L23/24 ,  H01L23/3732 ,  H01L25/072 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195

摘要： A semiconductor device having improved heat-dissipating characteristics employs a thin insulator film made of diamond, which has excellent thermal conductivity, as an insulator film which is formed on a chip immediately below a heat-dissipating bump electrode. Since the thin diamond film has excellent insulating properties and high thermal conductivity, it is possible to improve heat-dissipating characteristics of even a high-power semiconductor device such as a multichip module. In the case of, particularly, a multichip module, the insulation between a mother chip and a child chip can also be ensured by the presence of the thin diamond film.

摘要翻译： 具有改善的散热特性的半导体器件采用由金刚石制成的薄绝缘膜，绝缘膜具有优良的导热性，作为绝缘膜，其形成在紧靠散热凸块电极下方的芯片上。 由于薄金刚石膜具有优异的绝缘性能和高导热性，因此即使是诸如多芯片模块的大功率半导体器件也可以提高散热特性。 在特别是多芯片模块的情况下，也可以通过存在薄金刚石膜来确保母芯片和子芯片之间的绝缘。

公开(公告)号：US08921711B2

公开(公告)日：2014-12-30

申请号：US13813629

申请日：2011-07-07

申请人： Hisashi Ishida

发明人： Hisashi Ishida

IPC分类号： H05K9/00 ,  H05K1/02

CPC分类号： H05K9/00 ,  H05K1/0236 ,  H05K2201/0715

摘要： Leakage of electromagnetic noise from a wiring substrate is suppressed. A wiring substrate (1) includes a multilayered wiring layer, a structure (8) of a conductor, and an electromagnetic wave absorber (5). An electronic component (2) which is an example of an electromagnetic noise generation source is mounted on the wiring substrate (1). The electronic component (2) has a high-frequency circuit. The structure (8) is formed using the multilayered wiring layer, and is arranged so as to enclose the electronic component (2) in plan view with an opening (4) in the enclosure. The electromagnetic wave absorber (5) is arranged so as to cover the opening (4).

摘要翻译： 抑制来自布线基板的电磁噪声的泄漏。 布线基板（1）包括多层布线层，导体的结构（8）和电磁波吸收体（5）。 作为电磁噪声产生源的一例的电子部件（2）安装在布线基板（1）上。 电子部件（2）具有高频电路。 结构（8）使用多层布线层形成，并且被布置成在平面图中将电子部件（2）与壳体中的开口（4）封闭。 电磁波吸收体（5）配置成覆盖开口（4）。

公开(公告)号：US20130126227A1

公开(公告)日：2013-05-23

申请号：US13813629

申请日：2011-07-07

申请人： Hisashi Ishida

发明人： Hisashi Ishida

IPC分类号： H05K9/00

CPC分类号： H05K9/00 ,  H05K1/0236 ,  H05K2201/0715

摘要： Leakage of electromagnetic noise from a wiring substrate is suppressed. A wiring substrate (1) includes a multilayered wiring layer, a structure (8) of a conductor, and an electromagnetic wave absorber (5). An electronic component (2) which is an example of an electromagnetic noise generation source is mounted on the wiring substrate (1). The electronic component (2) has a high-frequency circuit. The structure (8) is formed using the multilayered wiring layer, and is arranged so as to enclose the electronic component (2) in plan view with an opening (4) in the enclosure. The electromagnetic wave absorber (5) is arranged so as to cover the opening (4).

摘要翻译： 抑制来自布线基板的电磁噪声的泄漏。 布线基板（1）包括多层布线层，导体的结构（8）和电磁波吸收体（5）。 作为电磁噪声产生源的一例的电子部件（2）安装在布线基板（1）上。 电子部件（2）具有高频电路。 结构（8）使用多层布线层形成，并且被布置成在平面图中将电子部件（2）与壳体中的开口（4）封闭。 电磁波吸收体（5）配置成覆盖开口（4）。