Abstract:
A method and apparatus for storing a broadcast program are provided. The apparatus includes: a signal processing unit which generates an audio/video (A/V) file, an application file, and a first electronic program guide (EPG) file by appropriately processing a plurality of A/V signals, application information, and EPG information, respectively, which are included in an input broadcast program transport stream; a synchronization unit which receives the A/V file, the application file, and the first EPG file from the signal processing unit, generates storage information for the A/V file and storage information for the application file, and converts the first EPG file into a second EPG file comprising the storage information for the A/V file and the storage information for the application file; and a storage unit which stores the A/V file, the application file, and the second EPG file.
Abstract:
A multi-touch input processing method performed by a multi-touch input device and a multi-touch recognition apparatus, the method including: recognizing a touch input from at least one input device; connecting the at least one input device via a radio communication; receiving touch input data from the at least one input device; and executing an application based on the touch input and the touch input data. The apparatus includes a multi-touch processing unit for recognizing a touch input from at least one input device; a radio communicating unit for connecting the at least one input device with the multi-touch processing unit via a radio communication; a touch input data receiving unit for receiving touch input data from the at least one input device, and an application executing unit for executing an application based on the touch input and the touch input data.
Abstract:
Disclosed is a package substrate, which includes an insulating layer including a circuit layer having a via for connecting layers and an insulating member formed in the insulating layer so as to separate the insulating layer, thus preventing the package substrate from warping and reducing land co-planarity of the substrate. A method of fabricating the package substrate is also provided, including (a) forming a first circuit layer on a carrier, (b) forming an insulating layer on the carrier having the first circuit layer, (c) forming an insulating member in the insulating layer so as to separate the insulating layer, (d) forming a second circuit layer including a via on the insulating layer and the insulating member, and (e) removing the carrier.
Abstract:
Provided are a method and apparatus for transmitting section data and a method and apparatus for receiving section data. The method of receiving updated additional data from among additional data related to a broadcasting service includes: receiving an update information list including information regarding updates of the additional data; and receiving at least one of updated additional data based on the received update information list.
Abstract:
A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.
Abstract:
A board having buried patterns is disclosed. The board may include an insulation panel, a first pattern buried in one side of the insulation panel, a second pattern buried in the other side of the insulation panel with a predetermined insulating thickness between the first pattern and the second pattern, and a via which electrically connects the first pattern and the second pattern. The board having buried patterns according to certain embodiments of the invention can have greater rigidity compared to a board having exposed patterns, for the same insulating thickness. Also, a carrier-insulation set having a particular amount of thickness can be utilized to satisfy the thickness requirement in employing an existing roller apparatus intended for thicker boards.
Abstract:
Disclosed herein is a carrier member for transmitting circuits, which is a component of a coreless printed circuit board having circuit patterns embedded therein, and which can be used to provide a high-density and highly reliable printed circuit board by forming protrusions only on the lower ends of the circuit patterns, a coreless printed circuit board using the carrier member, and methods of manufacturing the carrier member and the coreless printed circuit board.
Abstract:
An apparatus and method for backing up broadcast files are provided. The apparatus includes a received file information analysis unit which analyzes package information included in a metadata file received from the digital broadcast apparatus and extracts storage location information and/or file name information regarding a broadcast file corresponding to the metadata file from the package information; a file request unit which transmits a message to the digital broadcast apparatus requesting the broadcast data file obtained by the received file information analysis unit; and a storage unit which receives the broadcast data file from the digital broadcast apparatus and stores the broadcast data file together with the metadata file in response to the message. Accordingly, it is possible to back up broadcast data files on a storage medium with a large storage capacity by referencing respective corresponding metadata files that are packaged together with the broadcast data files.
Abstract:
A printed circuit board with embedded electronic components and fabrication method thereof are disclosed. The printed circuit board with embedded electronic components having outer electrodes comprising a substrate on which insertion holes are formed for containing the electronic components, a filler for filling the gap between the electronic component and the insertion hole to secure the electronic components, and attachment layers laminated onto the substrate in contact with the electrodes, with circuits formed on the attachment layers, may provide superior electrical reliability, as the outer electrodes of the electronic components are in contact with the attachment layers, and may reduce fabrication cost and time, as it is not necessary to form via holes.
Abstract:
A method and apparatus for synchronizing metadata of different assets referencing the same contents, using a backward-link information file of an asset when metadata of the asset is edited, the method including: editing a metadata of a first asset; detecting a second asset referencing the same content as the first asset using a backward-link information file of content which the first asset refers to; and synchronizing metadata of the second asset with the edited metadata of the first asset. Therefore, it is possible to easily synchronize metadata of assets in a plurality of MPV files referencing the same content.