公开(公告)号：US07195987B2

公开(公告)日：2007-03-27

申请号：US11141275

申请日：2005-05-31

Applicant: Geum-jong Bae ,  Tae-hee Choe ,  Sang-su Kim ,  Hwa-sung Rhee ,  Nae-in Lee ,  Kyung-wook Lee

Inventor： Geum-jong Bae ,  Tae-hee Choe ,  Sang-su Kim ,  Hwa-sung Rhee ,  Nae-in Lee ,  Kyung-wook Lee

IPC: H01L21/76

CPC classification number: H01L29/66916 ,  H01L21/76254 ,  H01L21/76256 ,  H01L21/76259 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/1054 ,  H01L29/66742 ,  H01L29/78609 ,  H01L29/78612 ,  H01L29/78621 ,  H01L29/78687 ,  H01L29/802

Abstract: CMOS integrated circuit devices include an electrically insulating layer and an unstrained silicon active layer on the electrically insulating layer. An insulated gate electrode is also provided on a surface of the unstrained silicon active layer. A Si1-xGex layer is also disposed between the electrically insulating layer and the unstrained silicon active layer. The Si1-xGex layer forms a first junction with the unstrained silicon active layer and has a graded concentration of Ge therein that decreases monotonically in a first direction extending from a peak level towards the surface of the unstrained silicon active layer. The peak Ge concentration level is greater than x=0.15 and the concentration of Ge in the Si1-xGex layer varies from the peak level to a level less than about x=0.1 at the first junction. The concentration of Ge at the first junction may be abrupt. More preferably, the concentration of Ge in the Si1-xGex layer varies from the peak level where 0.2

Abstract translation: CMOS集成电路器件包括电绝缘层和电绝缘层上的非限制性硅有源层。 绝缘栅电极也设置在未应变硅有源层的表面上。 Si 1-x Ge Ge层还设置在电绝缘层和未应变硅有源层之间。 Si 1-x N Ge x S层与未应变的硅有源层形成第一结，并且其中的Ge的分级浓度在从第一方向延伸的第一方向上单调减小 峰值电平朝向未应变硅活性层的表面。 峰值Ge浓度水平大于x = 0.15，并且Si 1-x Ga x层中的Ge浓度从峰值水平变化到小于约 x = 0.1。 Ge在第一结处的浓度可能是突然的。 更优选的是，Si 1-x Ge 2 x层中的Ge的浓度从0.2

公开(公告)号：US20070059923A1

公开(公告)日：2007-03-15

申请号：US11445458

申请日：2006-06-02

Applicant: Hyo-jong Lee ,  Ui-hyoung Lee ,  Hong-jae Shin ,  Nae-in Lee ,  Soo-geun Lee

Inventor： Hyo-jong Lee ,  Ui-hyoung Lee ,  Hong-jae Shin ,  Nae-in Lee ,  Soo-geun Lee

IPC: H01L21/4763

CPC classification number: H01L21/76885 ,  H01L21/76802 ,  H01L21/76834 ,  H01L21/76843

Abstract: Methods of fabricating an interconnection line in a semiconductor device and a semiconductor device including such an interconnection line. The method involves forming a lower interconnection line on a semiconductor substrate, forming a mold pattern that defines an opening through which the lower interconnection line is exposed, filling the opening with a conductive material to form a via, removing the mold pattern to make the via remain on the lower interconnection line, forming an interlevel dielectric (ILD) layer that covers the lower interconnection line and the via, patterning the ILD layer, exposing the via, forming a trench that defines a region in which an interconnection line is to be formed, and filling the trench to fabricate a damascene interconnection line connected to the via.

Abstract translation: 在半导体器件中制造互连线的方法和包括这种互连线的半导体器件。 该方法包括在半导体衬底上形成下部互连线，形成限定下部互连线暴露的开口的模具图案，用导电材料填充开口以形成通孔，去除模具图案以形成通孔 保持在下互连线上，形成覆盖下互连线和通孔的层间电介质（ILD）层，图案化ILD层，暴露通孔，形成限定要形成互连线的区域的沟槽 ，并填充沟槽以制造连接到通孔的镶嵌互连线。

公开(公告)号：US20060157775A1

公开(公告)日：2006-07-20

申请号：US11378295

申请日：2006-03-20

Applicant: Sung-ho Kim ,  Nae-in Lee ,  Kwang-wook Koh ,  Geum-jong Bae ,  Ki-chul Kim ,  Jin-hee Kim ,  In-wook Cho ,  Sang-su Kim

Inventor： Sung-ho Kim ,  Nae-in Lee ,  Kwang-wook Koh ,  Geum-jong Bae ,  Ki-chul Kim ,  Jin-hee Kim ,  In-wook Cho ,  Sang-su Kim

IPC: H01L29/788

CPC classification number: H01L27/11568 ,  G11C16/0416 ,  G11C16/0466 ,  H01L27/0207 ,  H01L27/115 ,  H01L27/11519 ,  H01L27/11521 ,  H01L27/11524 ,  H01L29/40114 ,  H01L29/40117 ,  H01L29/66825 ,  H01L29/66833 ,  H01L29/792

Abstract: Byte-operational nonvolatile semiconductor memory devices are capable of erasing stored data one byte at a time. A byte memory cell may include a memory cell array of 1-byte memory transistors. The 1-byte memory transistors may be arranged in one direction, each including a junction region and a channel region formed in an active region. A byte memory cell may include a byte select transistor. The select transistor may be disposed in the active region and including a junction region that is directly adjacent to a junction of each of the 1-byte memory transistors. The byte select transistor may be disposed over or under the 1-byte memory transistors perpendicular to the arranged direction of the 1-byte memory transistors.

公开(公告)号：US20050186734A1

公开(公告)日：2005-08-25

申请号：US10786239

申请日：2004-02-24

Applicant: In-Wook Cho ,  Nae-In Lee ,  Kwang-Wook Koh ,  Geun-Jong Bae ,  Sang-Su Kim ,  Jin-Hee Kim ,  Sung-Ho Kim ,  Ki-Chul Kim

Inventor： In-Wook Cho ,  Nae-In Lee ,  Kwang-Wook Koh ,  Geun-Jong Bae ,  Sang-Su Kim ,  Jin-Hee Kim ,  Sung-Ho Kim ,  Ki-Chul Kim

IPC: H01L27/10 ,  H01L21/336 ,  H01L21/8246 ,  H01L21/8247 ,  H01L27/115 ,  H01L29/788 ,  H01L29/792

CPC classification number: H01L27/115 ,  H01L27/11568 ,  Y10S438/954

Abstract: A method of manufacturing a non-volatile semiconductor memory device begins by forming a dielectric layer pattern having an ONO composition on a substrate. A polysilicon layer is formed on the substrate including over the dielectric layer pattern. The polysilicon layer is patterned to form a split polysilicon layer pattern that exposes part of the dielectric layer pattern. The exposed dielectric layer is etched, and then impurities are implanted into portions of the substrate using the split polysilicon layer pattern as a mask to thereby form a source region having a vertical profile in the substrate.

Abstract translation: 制造非易失性半导体存储器件的方法是通过在衬底上形成具有ONO组成的电介质层图案而开始的。 在包括在电介质层图案上的衬底上形成多晶硅层。 图案化多晶硅层以形成暴露部分介电层图案的分裂多晶硅层图案。 暴露的电介质层被蚀刻，然后使用分离多晶硅层图案作为掩模将杂质注入到衬底的部分中，从而在衬底中形成具有垂直轮廓的源区。

公开(公告)号：US20050122783A1

公开(公告)日：2005-06-09

申请号：US10916716

申请日：2004-08-12

Applicant: Ki-Chul Kim ,  Nae-In Lee ,  Geum-Jong Bae

Inventor： Ki-Chul Kim ,  Nae-In Lee ,  Geum-Jong Bae

IPC: G11C16/04 ,  G11C16/14 ,  H01L21/28 ,  H01L21/336 ,  H01L29/423

CPC classification number: G11C16/14 ,  G11C16/0416 ,  G11C16/0425 ,  G11C16/0466 ,  H01L21/28282 ,  H01L29/42332 ,  H01L29/66833

Abstract: Methods of erasing a non-volatile memory device having discrete charge trap sites between a semiconductor substrate and a gate include applying a negative voltage to a gate at least partially spaced apart from a semiconductor substrate by a charge storage layer providing discrete charge trap sites. A first positive voltage is applied to a source formed in the semiconductor substrate adjacent to one sidewall of the gate. A second positive voltage, which is equal to or less than the first positive voltage, is applied to a drain formed in the semiconductor substrate adjacent to the gate and located opposite the source.

Abstract translation: 擦除在半导体衬底和栅极之间具有离散电荷陷阱位置的非易失性存储器件的方法包括通过提供离散电荷陷阱位置的电荷存储层将至少部分地与半导体衬底间隔开的栅极施加负电压。 第一正电压施加到与栅极的一个侧壁相邻的半导体衬底中形成的源。 将等于或小于第一正电压的第二正电压施加到与栅极相邻并位于与源相对的半导体衬底中形成的漏极。

公开(公告)号：US20050074982A1

公开(公告)日：2005-04-07

申请号：US10999608

申请日：2004-11-29

Applicant: Jongho Lee ,  Nae-In Lee

Inventor： Jongho Lee ,  Nae-In Lee

IPC: H01L21/8247 ,  H01L21/02 ,  H01L21/28 ,  H01L21/31 ,  H01L21/316 ,  H01L21/822 ,  H01L21/8242 ,  H01L21/8246 ,  H01L27/04 ,  H01L27/105 ,  H01L27/108 ,  H01L27/115 ,  H01L29/51 ,  H01L29/78 ,  H01L29/788 ,  H01L29/792 ,  H01L29/94 ,  H01L21/00

CPC classification number: H01L21/28185 ,  H01L21/28194 ,  H01L21/28202 ,  H01L28/56 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518 ,  H01L29/7881 ,  H01L29/94

Abstract: A multi-layer dielectric layer structure for a semiconductor device. The multi-layer dielectric layer structure comprises a silicate interface layer having a dielectric constant greater than that of silicon nitride and a high-k dielectric layer overlying the silicate interface layer. The high-k dielectric layer comprises one or more ordered pairs of first and second layers. With the present invention, the dielectric constant of the high-k dielectric layer can be optimized while improving interface characteristics. With a higher crystallization temperature realized by forming the multi-layer structure, each of whose layers is not more than the critical thickness, leakage current can be reduced, thereby improving device performance.

公开(公告)号：US20050048702A1

公开(公告)日：2005-03-03

申请号：US10953553

申请日：2004-09-30

Applicant: Geum-Jong Bae ,  Nae-In Lee ,  Sang Kim ,  Ki Kim ,  Jin-Hee Kim ,  In-Wook Cho ,  Sung-Ho Kim ,  Kwang-Wook Koh

Inventor： Geum-Jong Bae ,  Nae-In Lee ,  Sang Kim ,  Ki Kim ,  Jin-Hee Kim ,  In-Wook Cho ,  Sung-Ho Kim ,  Kwang-Wook Koh

IPC: H01L21/8246 ,  H01L21/8247 ,  H01L27/115 ,  H01L29/423 ,  H01L29/788 ,  H01L29/792 ,  H01L21/335

CPC classification number: H01L29/792 ,  H01L29/7923 ,  Y10S438/954

Abstract: A local SONOS structure having a two-piece gate and a self-aligned ONO structure includes: a substrate; an ONO structure on the substrate; a first gate layer on and aligned with the ONO structure; a gate insulator on the substrate aside the ONO structure; and a second gate layer on the first gate layer and on the gate insulator. The first and second gate layers are electrically connected together. Together, the ONO structure and first and second gate layers define at least a 1-bit local SONOS structure. A corresponding method of manufacture includes: providing a substrate; forming an ONO structure on the substrate; forming a first gate layer on and aligned with the ONO structure; forming a gate insulator on the substrate aside the ONO structure; forming a second gate layer on the first gate layer and on the gate insulator; and electrically connecting the first and second gate layers.

Abstract translation: 具有两件式门和自对准ONO结构的本地SONOS结构包括：衬底; 基底上的ONO结构; 在ONO结构上并与ONO结构对准的第一栅极层; 衬底上的栅极绝缘体旁边的ONO结构; 以及在第一栅极层上和栅极绝缘体上的第二栅极层。 第一和第二栅极层电连接在一起。 ONO结构和第一和第二栅极层一起定义至少1位本地SONOS结构。 相应的制造方法包括：提供衬底; 在基板上形成ONO结构; 在ONO结构上形成第一栅极层并与其结合; 在衬底上形成栅极绝缘体，除了ONO结构; 在第一栅极层和栅极绝缘体上形成第二栅极层; 并且电连接第一和第二栅极层。

公开(公告)号：US06794306B2

公开(公告)日：2004-09-21

申请号：US10463554

申请日：2003-06-17

Applicant: Sang-Su Kim ,  Tae-Hee Choe ,  Hwa-Sung Rhee ,  Geum-Jong Bae ,  Nae-In Lee

Inventor： Sang-Su Kim ,  Tae-Hee Choe ,  Hwa-Sung Rhee ,  Geum-Jong Bae ,  Nae-In Lee

IPC: H01L2100

CPC classification number: H01L29/78696 ,  H01L29/42384 ,  H01L29/42392 ,  H01L29/66772 ,  H01L29/78654 ,  Y10S438/933

Abstract: A semiconductor device having a transistor of gate all around (GAA) type and a method of fabricating the same are disclosed. A SOI substrate composed of a SOI layer, a buried oxide layer and a lower substrate is prepared. The SOI layer has at least one unit dual layer of a silicon germanium layer and a silicon layer. The SOI layer is patterned to form an active layer pattern to a certain direction. An insulation layer is formed to cover the active layer pattern. An etch stop layer is stacked on the active layer pattern covered with the insulation layer. The etch stop layer is patterned and removed at a gate region crossing the active layer pattern at the channel region. The insulation layer is removed at the gate region. The silicon germanium layer is isotropically etched and selectively removed to form a cavity at the channel region of the active layer pattern. In the state that the silicon germanium layer is selectively removed, a gate insulation layer is formed to cover the exposed surface of the active layer pattern. A gate conductivity layer is stacked on the substrate by a chemical vapor deposition (CVD) to fill the gate region including the cavity. The middle part of the channel region of the active layer pattern can be patterned to be divided by multiple patterns that are formed in a line.

Abstract translation: 公开了具有栅极全部（GAA）型晶体管的半导体器件及其制造方法。 制备由SOI层，掩埋氧化物层和下基板构成的SOI衬底。 SOI层具有硅锗层和硅层的至少一个单元双层。 图案化SOI层，以形成一定方向的有源层图案。 形成绝缘层以覆盖有源层图案。 在覆盖有绝缘层的有源层图案上堆叠蚀刻停止层。 蚀刻停止层被图案化并在沟道区域与有源层图案交叉的栅极区域去除。 绝缘层在栅极区域被去除。 硅锗层被各向同性地蚀刻并选择性地去除以在有源层图案的沟道区域形成空腔。 在选择性地去除硅锗层的状态下，形成栅极绝缘层以覆盖有源层图案的暴露表面。 通过化学气相沉积（CVD）将栅极导电层层叠在基板上，以填充包括空腔的栅极区域。 有源层图案的沟道区域的中间部分可以被图案化以被划分成一行形成的多个图案。

公开(公告)号：US06693013B2

公开(公告)日：2004-02-17

申请号：US10103759

申请日：2002-03-25

Applicant: Geum-Jong Bae ,  Nae-In Lee ,  Hwa-Sung Rhee ,  Young-Gun Ko ,  Tae-Hee Choe ,  Sang-Su Kim

Inventor： Geum-Jong Bae ,  Nae-In Lee ,  Hwa-Sung Rhee ,  Young-Gun Ko ,  Tae-Hee Choe ,  Sang-Su Kim

IPC: H01L21336

CPC classification number: H01L29/66598 ,  H01L29/66507 ,  H01L29/66515 ,  H01L29/6653 ,  H01L29/6656 ,  H01L29/6659

Abstract: The present invention provides a semiconductor transistor using an L-shaped spacer and a method of fabricating the same. The semiconductor transistor includes a gate pattern formed on a semiconductor substrate and an L-shaped third spacer formed beside the gate pattern and having a horizontal protruding portion. An L-shaped fourth spacer is formed between the third spacer and the gate pattern, and between the third spacer and the substrate. A high-concentration junction area is positioned in the substrate beyond the third spacer, and a low-concentration junction area is positioned under the horizontal protruding portion of the third spacer. A medium-concentration junction area is positioned between the high- and low-concentration junction areas. A method of fabricating the semiconductor transistor includes a process, where the high- and medium-concentration junction areas are formed simultaneously by the same ion-implantation step and the substrate is annealed before forming the low-concentration junction area.

Abstract translation: 本发明提供一种使用L形间隔物的半导体晶体管及其制造方法。 半导体晶体管包括形成在半导体衬底上的栅极图案和形成在栅极图案旁边并具有水平突出部分的L形第三间隔物。 在第三间隔物和栅极图案之间以及在第三间隔物和基底之间形成L形的第四间隔物。 高浓度接合区域位于第三间隔物之外的基板中，并且低浓度接合区域位于第三间隔物的水平突出部分的下方。 中等浓度接合区域位于高浓度和低浓度接合区域之间。 制造半导体晶体管的方法包括一个过程，其中通过相同的离子注入步骤同时形成高浓度和中等浓度的结区，并且在形成低浓度结区之前将衬底退火。

公开(公告)号：US06633066B1

公开(公告)日：2003-10-14

申请号：US09711706

申请日：2000-11-13

Applicant: Geum-jong Bae ,  Tae-hee Choe ,  Sang-su Kim ,  Hwa-sung Rhee ,  Nae-in Lee ,  Kyung-wook Lee

Inventor： Geum-jong Bae ,  Tae-hee Choe ,  Sang-su Kim ,  Hwa-sung Rhee ,  Nae-in Lee ,  Kyung-wook Lee

IPC: H01L310392

CPC classification number: H01L29/66916 ,  H01L21/76254 ,  H01L21/76256 ,  H01L21/76259 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/1054 ,  H01L29/66742 ,  H01L29/78609 ,  H01L29/78612 ,  H01L29/78621 ,  H01L29/78687 ,  H01L29/802

Abstract: CMOS integrated circuit devices include an electrically insulating layer and an unstrained silicon active layer on the electrically insulating layer. An insulated gate electrode is also provided on a surface of the unstrained silicon active layer. A Si1−xGex layer is also disposed between the electrically insulating layer and the unstrained silicon active layer. The Si1−xGex layer forms a first junction with the unstrained silicon active layer and has a graded concentration of Ge therein that decreases monotonically in a first direction extending from a peak level towards the surface of the unstrained silicon active layer. The peal Ge concentration level is greater than x=0.15 and the concentration of Ge in the Si1−xGex layer varies from the peak level to a level less than about x=0.1 at the first junction. The concentration of Ge at the first junction may be abrupt. More preferably, the concentration of Ge in the Si1−xGex layer varies from the peak level where 0.2

Abstract translation: CMOS集成电路器件包括电绝缘层和电绝缘层上的非限制性硅有源层。 绝缘栅电极也设置在未应变硅有源层的表面上。 还可以在电绝缘层和未应变硅活性层之间设置Si 1-x Ge x 层。 Si 1-x Ge x 层与未应变硅活性层形成第一结，并具有梯度浓度 Ge在从峰值电平向未应变硅有源层的表面延伸的第一方向上单调减小。 Peal Ge浓度水平大于x = 0.15，并且Si 1-x Ge x 层在峰值电平变化到在第一结处小于约x = 0.1的电平。 Ge在第一结处的浓度可能是突然的。 更优选的是，Si >

层中的Ge的浓度， x <0.4到第一结处x = 0的水平。 相对于表面，Si 1-x Ge x 层也具有退化的砷掺杂特性。 >