中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

148 records (took 0.013 seconds)

    Digital camera module packaging method
    31.
    发明授权
    Digital camera module packaging method 有权
    数码相机模块包装方式

    公开(公告)号：US07646429B2

    公开(公告)日：2010-01-12

    申请号：US11595297

    申请日：2006-11-10

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    IPC: H04N5/225

    CPC classification number: H04N5/2253 ,  H04N5/2254

    Abstract: A digital camera module packaging method includes: first, providing a carrier (20) including a base (21) defining a chamber (214) and a lead frame (23). The lead frame has a plurality of conduction pieces (233) embedded in the base. One end of each conduction piece is exposed at one surface of the base, and another end of the conduction piece is exposed at another surface of the base. An image sensor chip (30) with a photosensitive area (301) and a plurality of chip pads (302) is then mounted in the chamber. A plurality of wires (40) is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one exposed end of a corresponding conduction piece of the carrier. A holder (50) is then provided. The carrier is mounted to the holder. Finally, a lens module (70) is mounted on the holder.

    Abstract translation: 一种数字照相机模块封装方法，包括：首先，提供一个载体（20），其包括限定腔室（214）和引线框架（23）的底座（21）。 引线框具有嵌入基座中的多个导电片（233）。 每个导电件的一端在基座的一个表面露出，并且导电件的另一端暴露在基座的另一个表面。 然后将具有感光区域（301）和多个芯片焊盘（302）的图像传感器芯片（30）安装在室中。 然后提供多根电线（40）。 每条导线将图像传感器芯片的相应芯片焊盘和载体的相应导电片的一个暴露端部电连接。 然后提供支架（50）。 承载件安装在支架上。 最后，镜头模块（70）安装在支架上。

    COMPACT CAMERA MODULE
    32.
    发明申请
    COMPACT CAMERA MODULE 审中-公开

    公开(公告)号：US20090322929A1

    公开(公告)日：2009-12-31

    申请号：US12329616

    申请日：2008-12-07

    Applicant: STEVEN WEBSTER

    Inventor： STEVEN WEBSTER

    IPC: H04N5/225

    CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15184 ,  H01L2924/00014

    Abstract: A camera module includes an image sensor package and a lens module. The image sensor package includes a base having an interior surface and an opposite exterior surface, an image sensor, a carrier plate and a plurality of passive elements. A cavity is defined on the interior surface of the base. The image sensor chip having a sensitive region is received in the cavity of the base and is electrically connected to the base. The carrier plate, comprising a light transparent area and an electrode area surrounding the transparent area, is formed on the base. A plurality of electrodes attached on the electrode area of the carrier plate and electrically connected to the base. The passive elements are mechanically and electrically attached on the electrode area of the carrier plate. The lens module is attached on the carrier plate for receiving the passive elements therein.

    Abstract translation: 相机模块包括图像传感器封装和透镜模块。 图像传感器封装包括具有内表面和相对外表面的基底，图像传感器，载体板和多个无源元件。 在基座的内表面上限定空腔。 具有敏感区域的图像传感器芯片被接收在基座的空腔中并且电连接到基座。 包括透明区域的载体板和围绕透明区域的电极区域形成在基座上。 多个电极，其安装在承载板的电极区域上并电连接到基座。 无源元件机械地和电连接在载体板的电极区域上。 透镜模块附接在承载板上用于接收其中的无源元件。

    COMBINATION OF CHIP PACKAGE UNITS
    34.
    发明申请
    COMBINATION OF CHIP PACKAGE UNITS 有权
    芯片包装单元的组合

    公开(公告)号：US20090166837A1

    公开(公告)日：2009-07-02

    申请号：US12060106

    申请日：2008-03-31

    Applicant: STEVEN WEBSTER ,  YING-CHENG WU ,  CHAO-YUAN CHAN ,  SHIH-MIN LO

    Inventor： STEVEN WEBSTER ,  YING-CHENG WU ,  CHAO-YUAN CHAN ,  SHIH-MIN LO

    IPC: H01L23/488

    CPC classification number: H01L25/105 ,  H01L23/13 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1052 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: A combination includes a first chip package unit and a second chip package unit on which the first chip package unit is placed. Each of the first and second chip package units includes a substrate having a first surface, a second surface, a chip package electrically connected to the first surface, and a plurality of bonding pads formed on the first and second surfaces. The bonding pads on the first surface of the first chip package unit are respectively electrically connected with the bonding pads on the surface of the second chip package unit. The chip packages electrically connected to the first surfaces are enclosed by the substrates, and the bonding pads on the second surfaces are configured as interface terminals of the combination.

    Abstract translation: 组合包括第一芯片封装单元和放置第一芯片封装单元的第二芯片封装单元。 第一和第二芯片封装单元中的每一个包括具有第一表面，第二表面，电连接到第一表面的芯片封装的衬底和形成在第一表面和第二表面上的多个焊盘。 第一芯片封装单元的第一表面上的焊盘分别与第二芯片封装单元的表面上的焊盘电连接。 电连接到第一表面的芯片封装被基板封闭，并且第二表面上的焊盘被配置为该组合的接口端子。

    Digital camera module
    35.
    发明授权
    Digital camera module 失效
    数码相机模组

    公开(公告)号：US07408205B2

    公开(公告)日：2008-08-05

    申请号：US11525447

    申请日：2006-09-22

    Applicant: Steven Webster ,  Ying-Cheng Wu

    Inventor： Steven Webster ,  Ying-Cheng Wu

    IPC: H01L29/22 ,  H01L33/00 ,  H01L29/227 ,  H01L29/24 ,  H01L23/495 ,  H01L23/02

    CPC classification number: H01L27/14618 ,  H01L24/73 ,  H01L27/14625 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15311 ,  H04N5/2257 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: A digital camera module (200) includes a carrier (20), an image sensor chip (30), a number of wires (50), a holder (60), and a lens module (70). The carrier includes a base (21) and a leadframe (23) embedded in the base. The base includes a board (211), a sidewall (213) and a cavity (24). The leadframe includes a number of conductive leads (233) spaced from each other. Each lead has a first terminal portion (235), a second terminal portion (236), and an interconnecting portion (237) connecting the first and second terminal portions. The chip is mounted on the carrier, and has an active area (301). The wires electrically connect the chip and the leadframe. The holder is mounted to the carrier to close the cavity. The lens module is received in the holder and guides light to the active area of the chip.

    Abstract translation: 数字照相机模块（200）包括载体（20），图像传感器芯片（30），多个电线（50），保持器（60）和透镜模块（70）。 载体包括嵌入基座中的基座（21）和引线框架（23）。 基座包括板（211），侧壁（213）和空腔（24）。 引线框架包括彼此间隔开的多个导电引线（233）。 每个引线具有连接第一和第二端子部分的第一端子部分（235），第二端子部分（236）和互连部分（237）。 芯片安装在载体上，并具有有效区域（301）。 导线将芯片和引线框架电连接。 保持器安装到载体以封闭空腔。 透镜模块被容纳在保持器中并将光引导到芯片的有效区域。

    Image sensor chip package
    37.
    发明申请
    Image sensor chip package 审中-公开
    图像传感器芯片封装

    公开(公告)号：US20070108561A1

    公开(公告)日：2007-05-17

    申请号：US11525446

    申请日：2006-09-22

    Applicant: Steven Webster ,  Ying-Cheng Wu

    Inventor： Steven Webster ,  Ying-Cheng Wu

    IPC: H01L23/495

    CPC classification number: H01L27/14618 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

    Abstract: An image sensor chip package (200) includes a carrier (20), an image sensor chip (30), a number of wires (50) and a holder (60). The carrier includes a base (21) and a leadframe (23) embedded in the base. The base includes a board (211), a sidewall (213) and a cavity (24). The leadframe includes a plurality of conductive leads (233) spaced from each other. Each lead has a first terminal portion (236), and an interconnecting portion (237) connecting the first and second terminal portions. The chip is mounted on the carrier, and has an active area (301) and a number of contacts (302). The wires electrically connect the contacts of the chip and the first terminal portions of the leadframe. The holder is mounted to the carrier to close the cavity, and allows light to pass therethrough to reach the active area of the chip.

    Abstract translation: 图像传感器芯片封装（200）包括载体（20），图像传感器芯片（30），多个导线（50）和保持器（60）。 载体包括嵌入基座中的基座（21）和引线框架（23）。 基座包括板（211），侧壁（213）和空腔（24）。 引线框架包括彼此间隔开的多个导电引线（233）。 每个引线具有第一端子部分（236）和连接第一和第二端子部分的互连部分（237）。 芯片安装在载体上，并具有有效区域（301）和多个触点（302）。 导线将芯片的触点与引线框架的第一端子部分电连接。 保持器安装到载体上以封闭空腔，并允许光通过，以到达芯片的有效区域。

    Digital camera module
    38.
    发明申请
    Digital camera module 有权
    数码相机模组

    公开(公告)号：US20070057150A1

    公开(公告)日：2007-03-15

    申请号：US11478503

    申请日：2006-06-28

    Applicant: Steven Webster

    Inventor： Steven Webster

    IPC: H01L27/00

    CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14634 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16151 ,  H05K1/118 ,  H05K3/326 ,  H01L2924/00014

    Abstract: A digital camera module (100) includes a holder, an image sensor chip package (30), a number of conductive elements (24) and a circuit board (40). The holder defines a receiving portion. The holder is mounted on the image sensor chip package. The image sensor chip package has a number of outer pads. The outer pads are positioned in the receiving portion of the holder. The conductive elements are received in the receiving portion. One end of each of the conductive elements is connected to the inner pads, the other end of each of the conductive elements is connected to the circuit board.

    Abstract translation: 数字照相机模块（100）包括保持器，图像传感器芯片封装（30），多个导电元件（24）和电路板（40）。 保持器限定接收部分。 保持器安装在图像传感器芯片封装上。 图像传感器芯片封装具有多个外部焊盘。 外垫位于保持器的接收部分中。 导电元件被接收在接收部分中。 每个导电元件的一端连接到内部焊盘，每个导电元件的另一端连接到电路板。

    Digital camera module package fabrication method
    39.
    发明申请
    Digital camera module package fabrication method 有权
    数码相机模块封装制造方法

    公开(公告)号：US20070057148A1

    公开(公告)日：2007-03-15

    申请号：US11453454

    申请日：2006-06-14

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    IPC: H01J5/02 ,  H01L27/00

    CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/16195 ,  H01L2924/00014

    Abstract: A digital camera module package method includes the steps of: firstly, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces (322); Secondly, mounting an image sensor chip (34) on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires (36), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means (3262) around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover (38) on the carrier, where an adhesive means fixes the cover in place.

    Abstract translation: 数字照相机模块封装方法包括以下步骤：首先，提供一种包括基座（24）和引线框架（320）的载体（30）。 基座在其中具有空腔，引线框架包括多个导电片（322）; 其次，将图像传感器芯片（34）安装在基座上并容纳在空腔中，图像传感器具有感光区域。 第三，提供多个电线（36），每个电线电连接图像传感器芯片和载体的相应导电片之一。 第四，在图像传感器芯片周围施加至少部分地覆盖所有电线的粘合装置（3262）。 最后，将透明盖（38）安装在载体上，其中粘合剂将盖固定到位。

Patent Agency Ranking