公开(公告)号：US08223442B2

公开(公告)日：2012-07-17

申请号：US12021516

申请日：2008-01-29

Applicant: Naoki Yamagata ,  Shuichi Takeuchi

Inventor： Naoki Yamagata ,  Shuichi Takeuchi

IPC: G02B13/18 ,  G02B3/02

CPC classification number: G11B7/13922 ,  G11B7/1374

Abstract: There is provided an objective lens for an optical pick-up. The objective lens is formed to be a single-element plastic lens having a first surface and a second surface. The first surface is configured to have, within an effective diameter, an inflection point at which a second derivative of a sag of the first surface takes a value of 0. Further, the objective lens having a numerical aperture larger than or equal to 0.75.

Abstract translation: 提供了用于光学拾取器的物镜。 物镜形成为具有第一表面和第二表面的单元塑料透镜。 第一表面被配置为在有效直径内具有第一表面的下垂的二次导数取值为0的拐点。此外，具有大于或等于0.75的数值孔径的物镜。

公开(公告)号：US08189448B2

公开(公告)日：2012-05-29

申请号：US12949023

申请日：2010-11-18

Applicant: Daisuke Koreeda ,  Shuichi Takeuchi

Inventor： Daisuke Koreeda ,  Shuichi Takeuchi

IPC: G11B7/00

CPC classification number: G11B7/13922 ,  G02B5/1895 ,  G11B7/1353 ,  G11B7/1374 ,  G11B2007/0006

Abstract: An objective optical system for an optical information recording/reproducing apparatus for recording/reproducing for first, second and third optical discs by selectively using three types of substantially collimated light beams including first, second and third light beams respectively having first, second and third wavelengths, wherein at least one of optical surfaces of the objective optical system comprises a diffraction surface having a diffraction structure, the diffraction surface includes a first region defined by first and second optical path difference functions, a second region defined by at least one type of optical path difference function, and a third region defined by at least one type of optical path difference function, the first region satisfies a condition: −0.15

Abstract translation: 一种用于光信息记录/再现装置的物镜光学系统，用于通过选择性地使用分别具有第一，第二和第三波长的第一，第二和第三光束的三种基本上准直的光束来记录/再现第一，第二和第三光盘 其中所述物镜光学系统的至少一个光学表面包括具有衍射结构的衍射表面，所述衍射表面包括由第一和第二光程差函数限定的第一区域，由至少一种类型的光学 路径差分函数和由至少一种类型的光程差函数定义的第三区域，第一区域满足条件：-0.15

公开(公告)号：US08169075B2

公开(公告)日：2012-05-01

申请号：US12402881

申请日：2009-03-12

Applicant: Tetsuya Takahashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

Inventor： Tetsuya Takahashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

IPC: H01L29/40

CPC classification number: B81B3/0078 ,  B81B2201/042 ,  B81B2203/0109 ,  B81B2203/0307 ,  B81C1/00126 ,  H01L24/14 ,  H01L2224/1134 ,  H01L2224/1403 ,  H01L2224/73204 ,  H01L2924/07811 ,  H01L2924/1461 ,  H01L2924/00

Abstract: According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip.

Abstract translation: 根据本发明的一个方面，电子部件包括具有第一平坦表面的基板，固定到基板的第一平面表面的第一凸起，固定到基板的第一平面表面的第二凸起，距离基板的预定距离 第一凸块，包括元件的MEMS芯片，耦合到第一凸块和第二凸块的MEMS芯片，与第一平坦表面分开的MEMS芯片，与第一凸块，基板和MEMS芯片结合的粘合区域。

公开(公告)号：US20120080220A1

公开(公告)日：2012-04-05

申请号：US13196317

申请日：2011-08-02

Applicant: Kimio NAKAMURA ,  Shuichi TAKEUCHI ,  Yoshiyuki SATOH ,  Kenji KOBAE

Inventor： Kimio NAKAMURA ,  Shuichi TAKEUCHI ,  Yoshiyuki SATOH ,  Kenji KOBAE

IPC: H05K1/18 ,  H05K13/00

CPC classification number: H05K1/113 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13019 ,  H01L2224/16105 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81385 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/0367 ,  H05K2201/10977 ,  Y10T29/49124 ,  H01L2924/00

Abstract: An electronic device includes a circuit board including a first electrode and a second electrode; and an electronic component including a first terminal and a second terminal, wherein the first electrode includes a first pad portion to which the first terminal is connected and a first protrusion portion disposed in a first direction in parallel with a straight line passing through the first electrode and the second electrode with respect to the first pad portion and being into contact with the first terminal, the second electrode includes a second pad portion to which the second terminal is connected and a second protrusion portion disposed in a second direction opposite to the first direction with respect to the second pad portion and being into contact with the second terminal.

Abstract translation: 电子装置包括：电路板，包括第一电极和第二电极; 以及包括第一端子和第二端子的电子部件，其中所述第一电极包括与所述第一端子连接的第一焊盘部分和与通过所述第一电极的直线平行的第一方向设置的第一突出部分 所述第二电极相对于所述第一焊盘部分与所述第一端子接触，所述第二电极包括第二焊盘部分，所述第二端子连接到所述第二焊盘部分，所述第二突出部分设置在与所述第一方向相反的第二方向上 相对于第二焊盘部分并与第二端子接触。

公开(公告)号：US07990831B2

公开(公告)日：2011-08-02

申请号：US12146883

申请日：2008-06-26

Applicant: Daisuke Koreeda ,  Shuichi Takeuchi

Inventor： Daisuke Koreeda ,  Shuichi Takeuchi

IPC: G11B7/00

CPC classification number: G11B7/13925 ,  G11B7/1367 ,  G11B7/1369 ,  G11B7/1374 ,  G11B7/13927 ,  G11B2007/0006

Abstract: An optical pickup device includes a first light source emitting first light with a first wavelength, a second light source emitting second light with a second wavelength, a third light source emitting third light with a third wavelength, an objective lens having a step structure, the objective lens being disposed to satisfy predetermined conditions, at least one first coupling lens making the first light and the second light incident onto the objective lens as converged light, a second coupling lens making the third light incident onto the objective lens as diverging light, and a liquid crystal aberration correcting element.

Abstract translation: 一种光学拾取装置包括：发射具有第一波长的第一光的第一光源，发射具有第二波长的第二光的第二光源;发射具有第三波长的第三光的第三光源;具有阶梯结构的物镜; 将物镜设置为满足预定条件，使作为会聚光入射到物镜上的第一光和第二光的至少一个第一耦合透镜，使作为发散光入射到物镜上的第三光的第二耦合透镜，以及 液晶像差校正元件。

公开(公告)号：US07960215B2

公开(公告)日：2011-06-14

申请号：US12559219

申请日：2009-09-14

Applicant: Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

Inventor： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/02 ,  H01L23/24 ,  H01L23/28 ,  H01L23/04

CPC classification number: H01L23/16 ,  G06K19/077 ,  G06K19/07728 ,  H01L23/3121 ,  H01L23/3135 ,  H01L2224/16

Abstract: An electronic device includes: a base; a conductor pattern formed on the base; and a circuit chip electrically connected to the conductor pattern. The electronic device further includes a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes layers stacked in the thickness direction of the base. The lowermost layer of the layers is closest to the base and softer than the layer that is at least one of the remaining layers. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base.

Abstract translation: 电子设备包括：基座; 形成在基座上的导体图案; 以及与导体图形电连接的电路芯片。 该电子设备还包括一个加强件，该加强件设置在基座上以围绕电路芯片，其外形像环形，并且包括沿基座的厚度方向堆叠的层。 层的最下层最靠近基底并且比作为剩余层中的至少一层的层更柔软。 电子装置还包括密封构件，其在覆盖电路芯片的顶部的同时填充加强构件的内部，从而将电路芯片密封在基座上。

公开(公告)号：US07880615B2

公开(公告)日：2011-02-01

申请号：US11966375

申请日：2007-12-28

Applicant: Hiroshi Kobayashi ,  Shuichi Takeuchi

Inventor： Hiroshi Kobayashi ,  Shuichi Takeuchi

IPC: G08B13/14 ,  H01L21/00 ,  H01P11/00 ,  B44C1/17 ,  G06K19/06

CPC classification number: G06K19/07749 ,  G06K19/07718 ,  G06K19/0775 ,  H01L21/67144 ,  H01L2224/16 ,  H01L2224/75252 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H05K1/0393 ,  H05K3/0097 ,  H05K2201/09227 ,  H05K2203/1545 ,  Y10T29/49016 ,  H01L2224/0401

Abstract: A tag manufacturing system includes an antenna forming apparatus which forms multiple antennas in such a way that the antennas are formed in a point-symmetrical arrangement including antenna orientations, on a long base sheet large enough to place multiple bases, and winds the base sheet into a roll body; an IC chip mounting apparatus which pulls the base sheet out of the roll body, mounts an IC chip on each of the antennas formed on the pulled base sheet in an orientation corresponding to an orientation of each antenna, and electrically connects the IC chip with the antenna; and a post-processing apparatus which performs post-processing of the base sheet with the IC chips mounted on the antennas to work up the base sheet into finished RFID tags.

Abstract translation: 标签制造系统包括天线形成装置，其形成多个天线，使得天线以包括天线取向的点对称布置形成，在长的基片上，足以放置多个基底，并将基片卷绕成 卷体; 将基片从辊体拉出的IC芯片安装装置以与每个天线的取向对应的取向安装在形成在拉动基片上的每个天线上的IC芯片，并将IC芯片与 天线; 以及后处理装置，其利用安装在天线上的IC芯片对基片执行后处理，以将基片加工成成品的RFID标签。

公开(公告)号：US07868437B2

公开(公告)日：2011-01-11

申请号：US11936332

申请日：2007-11-07

Applicant: Shuichi Takeuchi

Inventor： Shuichi Takeuchi

IPC: H01L23/02 ,  H01L23/20

CPC classification number: G06K19/07749 ,  G06K19/0775 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/4847 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3426 ,  H05K2201/10386 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A mounting structure for an IC tag where an IC chip for mounting (10) is mounted so as to be electrically connected to antenna patterns (44a), (44b). The assembly process that mounts the IC chip for mounting (10) on the antenna patterns (44a), (44b) is simplified, which makes it possible to reduce the manufacturing cost of IC tags. The IC chip for mounting 10 is formed by winding conductive wires (12a), (12b) so as to encircle an outer surface of an IC chip (20) between two opposite edges of the IC chip (20) in a state where the conductive wires (12a), (12b) mechanically contact electrodes formed on the IC chip (20) and are electrically connected to the electrodes, so that the IC chip for mounting (10) is joined to the antenna patterns (44a), (44b) via the conductive wires (12a), (12b).

Abstract translation: 一种用于安装IC芯片（10）的IC标签的安装结构，以电连接到天线图案（44a），（44b）。 将用于安装（10）的IC芯片安装在天线图案（44a），（44b）上的组装过程被简化，这使得可以降低IC标签的制造成本。 用于安装的IC芯片10通过在导电（12a），（12b）之间缠绕以在IC芯片（20）的两个相对边缘之间环绕IC芯片（20）的外表面的方式形成，其中导电 电线（12a），（12b）机械地接触形成在IC芯片（20）上的电极，并与电极电连接，使得安装用IC芯片（10）与天线图案（44a），（44b） 经由导线（12a），（12b）。

公开(公告)号：US07843792B2

公开(公告)日：2010-11-30

申请号：US11765498

申请日：2007-06-20

Applicant: Daisuke Koreeda ,  Shuichi Takeuchi

Inventor： Daisuke Koreeda ,  Shuichi Takeuchi

IPC: G11B7/135

CPC classification number: G11B7/1374 ,  G11B7/1353 ,  G11B2007/0006

Abstract: There is provided an objective lens including a first optical member and a second optical member which are made of materials different from each other and are cemented together at a cementing surface. The cementing surface includes a first phase shift structure having a plurality of refractive surface zones concentrically formed about an optical axis of the objective lens. The first phase shift structure satisfies conditions (1) and (2): 0.85

Abstract translation: 提供了一种包括第一光学构件和第二光学构件的物镜，其由彼此不同的材料制成并且在固结表面处粘合在一起。 固定表面包括具有围绕物镜的光轴同心地形成的多个折射表面区的第一相移结构。 第一相移结构满足条件（1）和（2）：0.85 <Φ2/Φ1<1.15（1）0.10 <|（Φ3-Φ2）/Φ1| <0.50（2）其中Φ1= m（λ1）× λ1/（n2（λ1）-n1（λ1））），Φ2= m（λ2）×（λ2/（n2（λ2）-n1（λ2））），Φ3= m（λ3）×（λ3/（n2 （λ3）-n1（λ3））），m（λ1），m（λ2）和m（λ3）分别为第一至第三光束的衍射效率最大化的衍射级，n1（λ1） n1（λ2），n1（λ3）分别为第一光学部件的折射率，n2（λ1），n2（λ2），n2（λ3）分别为第二光学部件的折射率。

公开(公告)号：US20100258640A1

公开(公告)日：2010-10-14

申请号：US12756487

申请日：2010-04-08

Applicant: Shuichi Takeuchi ,  Kenji Kobae ,  Takayoshi Matsumura ,  Tetsuya Takahashi

Inventor： Shuichi Takeuchi ,  Kenji Kobae ,  Takayoshi Matsumura ,  Tetsuya Takahashi

IPC: G06K19/077 ,  B29C65/00

CPC classification number: G06K19/07749 ,  G06K19/07724 ,  G06K19/07728 ,  Y10T156/10

Abstract: An RFID tag includes an inlet on which an antenna pattern serving as an antenna for communication and an IC chip electrically connected to the antenna pattern are mounted. The RFID tag also includes an exterior body that encloses the inlet from outside and a hollow space that is formed by the inlet and the exterior body and that is filled with gas or a gel material.

Abstract translation: RFID标签包括其上安装用作通信用天线的天线图案和与天线图案电连接的IC芯片的入口。 RFID标签还包括从外部包围入口的外部主体和由入口和外部主体形成并且填充有气体或凝胶材料的中空空间。