公开(公告)号：US20080164619A1

公开(公告)日：2008-07-10

申请号：US12007188

申请日：2008-01-08

Applicant: Cheol-Woo Lee ,  Bo-Seong Kim ,  Kwang-Ryul Lee ,  Tae-Young Lee

Inventor： Cheol-Woo Lee ,  Bo-Seong Kim ,  Kwang-Ryul Lee ,  Tae-Young Lee

IPC: H01L23/538 ,  H01L21/56

CPC classification number: H01L25/0657 ,  H01L23/3121 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Provided are a semiconductor chip package and a method of manufacturing the semiconductor package. The semiconductor chip package may include at least one semiconductor chip, whose upper surface includes a plurality of electrode pads on a substrate including a conductive pattern, and the conductive pattern and the electrode pads of the chip are connected electrically using a bonding wire. After a first insulation member is provided to an upper surface of the at least one semiconductor chip, the semiconductor chip package may be formed by providing a second insulation member in contact with the first insulation member, the bonding wires, and the at least one semiconductor chip.

Abstract translation: 提供半导体芯片封装和制造半导体封装的方法。 半导体芯片封装可以包括至少一个半导体芯片，其上表面包括在包括导电图案的基板上的多个电极焊盘，并且导体图案和芯片的电极焊盘使用接合线电连接。 在将至少一个半导体芯片的上表面设置第一绝缘构件之后，可以通过提供与第一绝缘构件，接合线和至少一个半导体接触的第二绝缘构件来形成半导体芯片封装 芯片。

公开(公告)号：US20070158901A1

公开(公告)日：2007-07-12

申请号：US11650483

申请日：2007-01-08

Applicant: Tae-young Lee

Inventor： Tae-young Lee

IPC: B65H3/06 ,  B65H1/00

CPC classification number: B65H3/0661 ,  B65H1/02 ,  B65H2220/09 ,  B65H2403/41 ,  B65H2404/742 ,  B65H2511/12 ,  B65H2511/20 ,  B65H2220/01 ,  B65H2220/08 ,  B65H2220/11

Abstract: A document feeder of an image forming apparatus includes a guide that arranges a width of a recording medium. A recording medium pickup module picks up the recording medium. A recording medium pickup module shifting unit shifts the recording medium pickup module in association with the movement of the guide. The recording medium pickup module includes a guide rack connected to the guide at one end. A pinion unit supports reciprocating motion of the guide rack. A pickup rack engaged with the pinion unit linearly reciprocates in parallel with the guide rack, and is connected to the recording medium pickup module.

Abstract translation: 图像形成装置的文件进给器包括布置记录介质的宽度的引导件。 记录介质拾取模块拾取记录介质。 记录介质拾取模块移位单元与引导件的运动相关联地移动记录介质拾取模块。 记录介质拾取模块包括在一端连接到引导件的导向架。 小齿轮单元支撑导向架的往复运动。 与小齿轮单元接合的拾取架与引导架平行地往复运动，并连接到记录介质拾取模块。

公开(公告)号：US20060239763A1

公开(公告)日：2006-10-26

申请号：US11384543

申请日：2006-03-21

Applicant: Tae-young Lee

Inventor： Tae-young Lee

IPC: B42F13/00

CPC classification number: B41J13/103 ,  B65H1/04 ,  B65H2403/41 ,  B65H2511/12 ,  B65H2511/20 ,  B65H2511/22 ,  B65H2511/222 ,  B65H2220/01 ,  B65H2220/11 ,  B65H2220/02 ,  B65H2220/04

Abstract: A paper-guiding device, an image forming apparatus having the same, and a method thereof. The paper-guiding device includes at least one paper guide movably disposed at a paper tray to line up and hold printing papers, a guide conveying unit to convey the at least one paper guide, and a position adjusting unit to control operations of the guide conveying unit, to detect a position of the at least one paper guide and to control a stop position of the at least one paper guide based on the detected position of the at least one paper guide.

Abstract translation: 纸引导装置，具有该导纸装置的图像形成装置及其方法。 纸引导装置包括至少一个可移动地设置在纸盘上以便排列和保持打印纸的纸张引导件，用于输送至少一个纸张引导件的引导输送单元和用于控制引导输送的操作的位置调整单元 单元，用于检测所述至少一个纸张引导件的位置，并且基于所述检测到的所述至少一个纸张引导件的位置来控制所述至少一个纸张引导件的停止位置。

公开(公告)号：US09894818B2

公开(公告)日：2018-02-13

申请号：US13542277

申请日：2012-07-05

Applicant: Jun Keun Song ,  Tae Young Lee

Inventor： Jun Keun Song ,  Tae Young Lee

IPC: H05K13/02 ,  H05K13/04

CPC classification number: H05K13/021 ,  H05K13/0434

Abstract: Provided are a tray feeder which provides parts to a part mounting device and parts providing method using the same. The tray feeder includes: a magazine which houses at least one tray for accommodating parts; an inserting/extracting member which inserts a tray into the magazine or extracts a tray from the magazine; a buffer member which is positioned above the magazine and supports a standby tray from which parts accommodated therein are to be mounted on a board by a part mounting device; and a feeding member which is positioned above the inserting/extracting member and provides a tray supported by the feeding member so that parts accommodated in the supported tray are adhered by the part mounting device, wherein the inserting/extracting member is elevated or lowered to insert a tray into the magazine or extract a tray from the magazine.

公开(公告)号：US09705075B2

公开(公告)日：2017-07-11

申请号：US14403058

申请日：2012-06-26

Applicant: Sang Ho Lim ,  Tae Young Lee ,  Seong Rae Lee ,  Dong-Su Son

Inventor： Sang Ho Lim ,  Tae Young Lee ,  Seong Rae Lee ,  Dong-Su Son

IPC: H01L43/10 ,  G01R33/09 ,  H01L43/02 ,  H01L43/12 ,  H01F10/32 ,  H01F10/12

CPC classification number: H01L43/10 ,  G01R33/098 ,  G11C11/161 ,  H01F10/123 ,  H01F10/3286 ,  H01L43/02 ,  H01L43/12

Abstract: The present invention relates to a cobalt (Co) and platinum (Pt)-based multilayer thin film having a novel structure and perpendicular magnetic anisotropy, and to a fabrication method thereof. More specifically, the invention relates to a cobalt and platinum-based multilayer thin film having perpendicular magnetic anisotropy (PMA), which includes thin cobalt layers and thin platinum layers alternately deposited over a substrate, and has an inverted structure in which a thickness of the thin cobalt layers is greater than that of the thin platinum layers, and to a fabrication method thereof. The cobalt and platinum-based multilayer thin film has a new structure in which the thickness of a magnetic thin layer is greater than that of a non-magnetic thin layer. The multilayer thin film may be easily applied as a free layer and a pinned layer in a magnetic tunnel junction by controlling the perpendicular magnetic anisotropy energy depending on the thickness ratio of the layers. Also, the multilayer thin film has excellent thermal stability, and thus maintains its PMA energy density even after being subjected to a heat treatment process. In addition, it enables a fine amount of in-plane magnetic anisotropy to be formed by heat treatment so as to reduce the critical current density required for magnetization switching. Therefore, it may be advantageously used for high-performance and high-density MRAM.

公开(公告)号：US09412720B2

公开(公告)日：2016-08-09

申请号：US14184951

申请日：2014-02-20

Applicant: Tae-Duk Nam ,  Jin-Ho Kim ,  Hyuk-Su Kim ,  Hyoung-Suk Kim ,  Tae-Young Lee

Inventor： Tae-Duk Nam ,  Jin-Ho Kim ,  Hyuk-Su Kim ,  Hyoung-Suk Kim ,  Tae-Young Lee

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/31 ,  H01L23/00 ,  H01L25/18

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32265 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2924/01013 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/014 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A semiconductor package may include a packaging substrate, a first semiconductor chip on the packaging substrate, and a support plate on the packaging substrate. The support plate may be spaced apart from the first semiconductor chip in a direction parallel with respect to a surface of the packaging substrate. A second semiconductor chip may be provided on the first semiconductor chip and on the support plate so that the first semiconductor chip is between the second semiconductor chip and the packaging substrate and so that the support plate is between the second semiconductor chip and the packaging substrate. An adhesion layer may bond the second semiconductor chip to the first semiconductor chip and may bond the second semiconductor chip to the support plate. In addition, an electrical coupling may be provided between the first semiconductor chip and the packaging substrate.

Abstract translation: 半导体封装可以包括封装衬底，封装衬底上的第一半导体芯片，以及封装衬底上的支撑板。 支撑板可以在相对于包装基板的表面平行的方向上与第一半导体芯片间隔开。 可以在第一半导体芯片和支撑板上设置第二半导体芯片，使得第一半导体芯片在第二半导体芯片和封装基板之间，并且支撑板位于第二半导体芯片和封装基板之间。 粘合层可以将第二半导体芯片接合到第一半导体芯片，并且可以将第二半导体芯片接合到支撑板。 此外，可以在第一半导体芯片和封装基板之间设置电耦合。

公开(公告)号：US08787223B2

公开(公告)日：2014-07-22

申请号：US13234589

申请日：2011-09-16

Applicant: Lawrence Edward Watson ,  John Michael Chapeskie ,  Lawrence Tae Young Lee ,  Phillip Man Wai Chan ,  Phing Chu Chang

Inventor： Lawrence Edward Watson ,  John Michael Chapeskie ,  Lawrence Tae Young Lee ,  Phillip Man Wai Chan ,  Phing Chu Chang

IPC: H04B7/00 ,  H04W88/14

CPC classification number: H04W88/14 ,  H04H20/78

Abstract: A system and method for distributing signals from a first communications network and a second communications network to a location, including a base transceiver station configured to receive a signal from the first communications network and convert the signal into an RF signal for transmission to a mobile terminal, the RF signal having an RF frequency above a threshold frequency, and a coupling module configured to: receive the RF signal from the base transceiver station and receive a data signal from the second communications network, the data signal having an RF frequency below the threshold frequency; combine the RF signal and the data signal into a combined signal with the RF signal and data signal each retaining their respective frequencies; and provide the combined signal over a coaxial cable link to the location.

Abstract translation: 一种用于将信号从第一通信网络和第二通信网络分发到位置的系统和方法，包括基站收发器站，其被配置为从第一通信网络接收信号并将该信号转换成RF信号以便传输到移动终端 RF信号具有高于阈值频率的RF频率，并且耦合模块被配置为：从基站收发器接收RF信号并从第二通信网络接收数据信号，该数据信号具有低于阈值的RF频率 频率; 将RF信号和数据信号组合成具有RF信号和数据信号的组合信号，每个信号保持它们各自的频率; 并通过同轴电缆链路提供组合信号到该位置。

公开(公告)号：US08276267B2

公开(公告)日：2012-10-02

申请号：US12247277

申请日：2008-10-08

Applicant: Hyung-soo Choi ,  Tae-young Lee

Inventor： Hyung-soo Choi ,  Tae-young Lee

IPC: H05K3/30

CPC classification number: H05K13/0419 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53261 ,  Y10T29/53465

Abstract: Provided are a tape feeder for use in chip mounters that can reduce a chip feeding duration and prevent chips from being turned over or assuming wrong postures to feed the chips stably, and a chip mounting method. The tape feeder includes a second link having one end linked to a link shaft through which a first link and a pivot lever are combined and the other end in which a slot curved at a predetermined inclination is formed. The velocity at which a carrier tape is fed changes according to the inclination of the curve of the slot with respect to the moving direction of the first link, the curve contacting the contact unit upon the movement of the first link in a direction helping to rotate a ratchet gear.

Abstract translation: 提供了一种用于芯片安装器的带式馈送器，其可以减少芯片馈送持续时间，并且防止芯片转过或假定错误的姿势以稳定地馈送芯片，以及芯片安装方法。 带式给送器包括一个第二连杆，其一端连接到一个连接轴，一个第一连杆和一个枢转杠杆组合在一起，另一端形成一个预定倾斜角的槽。 载带的速度根据槽相对于第一连杆的移动方向的曲线的倾斜度而变化，该曲线在第一连杆沿有助于旋转的方向移动时接触接触单元 棘轮。

公开(公告)号：US20120052847A1

公开(公告)日：2012-03-01

申请号：US13191363

申请日：2011-07-26

Applicant: Tae Young LEE ,  Daegil KIM ,  Tae Yong KIM ,  Hwan Hee LEE ,  Kwansik CHO

Inventor： Tae Young LEE ,  Daegil KIM ,  Tae Yong KIM ,  Hwan Hee LEE ,  Kwansik CHO

IPC: H04W88/02 ,  H04W4/00

CPC classification number: H04W4/06 ,  G06F3/1423 ,  G06F3/1454 ,  H04L12/2809 ,  H04L12/2812 ,  H04L12/2814 ,  H04L2012/2849 ,  H04M1/72527 ,  H04M1/72544

Abstract: A mobile terminal and control method to share content with a device and control the device are provide. The mobile terminal includes a communication unit to communicate with a host and the device; a search unit to receive content information and device information; an input unit to receive a content selection signal and a device selection signal; and a control unit to control the mobile terminal. The mobile terminal receives content information from a host and selects content to be outputted to a device selected from device information from the host. The mobile terminal controls the selected device using control commands transmitted to the selected device based on a control mode. If the control mode is not stored in the mobile terminal, the mobile terminal may receive the control mode from the host.

Abstract translation: 提供了一种与设备共享内容并控制设备的移动终端和控制方法。 移动终端包括与主机和设备通信的通信单元; 搜索单元，用于接收内容信息和设备信息; 输入单元，用于接收内容选择信号和设备选择信号; 以及控制单元来控制移动终端。 移动终端从主机接收内容信息，并从主机中选择要从设备信息中选择的设备输出要输出的内容。 移动终端使用基于控制模式发送到所选择的设备的控制命令来控制所选择的设备。 如果控制模式未被存储在移动终端中，则移动终端可以从主机接收控制模式。

公开(公告)号：US20100164106A1

公开(公告)日：2010-07-01

申请号：US12647612

申请日：2009-12-28

Applicant: Tae Young LEE ,  In Kyung LEE ,  Byoung Ho CHOI ,  Yong Soon PARK

Inventor： Tae Young LEE ,  In Kyung LEE ,  Byoung Ho CHOI ,  Yong Soon PARK

IPC: H01L23/52 ,  H01L21/306 ,  C09K13/06

CPC classification number: H01L21/3212 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  H01L21/7684

Abstract: Provided is a CMP slurry composition for barrier polishing for manufacturing copper interconnects, the composition including abrasive particles, a copper surface protective agent, a copper corrosion inhibitor, an oxidizing agent, and a pH adjustor, wherein the abrasive particles are non-spherical colloidal silica having a ratio of an average primary particle size to an average secondary particle size of about 0.6 or less and the copper surface protective agent is a carboxyl-functionalized water-soluble polymer.

Abstract translation: 本发明提供一种用于制造铜互连的屏障抛光的CMP浆料组合物，其包含磨料颗粒，铜表面保护剂，铜腐蚀抑制剂，氧化剂和pH调节剂的组合物，其中磨料颗粒是非球形胶体二氧化硅 平均一次粒径与平均二次粒径的比例为约0.6以下，铜表面保护剂为羧基官能化水溶性聚合物。