公开(公告)号：US20080088001A1

公开(公告)日：2008-04-17

申请号：US11898226

申请日：2007-09-11

Applicant: Tae-hun Kim ,  Sung-yong Park

Inventor： Tae-hun Kim ,  Sung-yong Park

IPC: H01L23/488 ,  H01L21/58

CPC classification number: H01L23/4985 ,  H01L23/49805 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06562 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package on package (POP) and method thereof are provided. The example POP may include a first semiconductor package including a first substrate, the first substrate being a flexible substrate having at least one folded portion, a first semiconductor chip mounted on and electrically connected to the first substrate and a second semiconductor package including a second substrate, at least one second semiconductor chip mounted on and electrically connected to the first substrate, the first and second semiconductor packages being electrically connected between the at least one folded portion of the first substrate and a portion of the second substrate.

Abstract translation: 提供了一种封装（POP）及其方法。 示例POP可以包括包括第一基板的第一半导体封装，第一基板是具有至少一个折叠部分的柔性基板，安装在第一基板上并与之电连接的第一半导体芯片，以及包括第二基板 至少一个第二半导体芯片，其安装在第一基板上并与之电连接，第一和第二半导体封装电连接在第一基板的至少一个折叠部分和第二基板的一部分之间。

公开(公告)号：US20080082217A1

公开(公告)日：2008-04-03

申请号：US11905383

申请日：2007-09-28

Applicant: Han Jun Sung ,  Dae Sung Han ,  Yong Hyun Kwon ,  Seok Weon Hong ,  Tae Uk Lee ,  Pung Yeun Cho ,  Han Seong Kang ,  Sung Soo Park ,  Sung Kwang Kim ,  Tae Hun Kim

Inventor： Han Jun Sung ,  Dae Sung Han ,  Yong Hyun Kwon ,  Seok Weon Hong ,  Tae Uk Lee ,  Pung Yeun Cho ,  Han Seong Kang ,  Sung Soo Park ,  Sung Kwang Kim ,  Tae Hun Kim

IPC: G05D23/19 ,  G05D23/00

CPC classification number: F24C7/082

Abstract: Disclosed are a cooking apparatus and a method of controlling the same, which are capable of easily recognizing change in temperature of one of an oven and a cooktop through change in color corresponding to the temperature change at a position remote from the cooking apparatus, and which are capable of easily recognizing the temperature of the cooktop through a temperature display unit at a position that is somewhat lower than the cooktop by installing a temperature display unit at a position higher than the cooktop. To this end, the cooking apparatus includes a main body having at least one heating unit, a control panel installed on an upper surface of the main body, and a temperature display unit that is provided on the control panel, which displays a temperature of the heating unit through change in color.

Abstract translation: 公开了一种烹调设备及其控制方法，其能够通过与远离烹饪设备的位置处的温度变化相对应的颜色变化来容易地识别烤箱和炉灶灶中的一个的温度变化，并且其中 能够通过将温度显示单元安装在高于炉灶面的位置，通过温度显示单元容易地识别在比炉灶稍低的位置的温度。 为此，烹饪设备包括具有至少一个加热单元的主体，安装在主体的上表面上的控制面板和设置在控制面板上的温度显示单元，该温度显示单元显示温度 加热单元通过颜色变化。

公开(公告)号：US20080067659A1

公开(公告)日：2008-03-20

申请号：US11806589

申请日：2007-06-01

Applicant: Tae-hun Kim ,  Heung-kyu Kwon

Inventor： Tae-hun Kim ,  Heung-kyu Kwon

IPC: H01L23/12 ,  H01L21/50 ,  H01L21/66

CPC classification number: H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/851 ,  H01L2224/859 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2225/06596 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01093 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A stacked semiconductor package may include a wiring substrate. A first semiconductor chip may be disposed on the wiring substrate and wire-bonded to the wiring substrate. An interposer chip may be disposed on the wiring substrate and sire bonded to the wiring substrate. The interposer chip may include a circuit element and a bonding pad being electrically connected. A second semiconductor chip may be disposed on the interposer chip and wire-bonded to the interposer chip. The second semiconductor chip may be electrically connected to the wiring substrate through the interposer chip.

Abstract translation: 堆叠的半导体封装可以包括布线​​基板。 第一半导体芯片可以布置在布线基板上并且引线接合到布线基板。 可以在布线基板上布置插入件芯片，并将其连接到布线基板。 插入器芯片可以包括电连接的电路元件和接合焊盘。 第二半导体芯片可以设置在插入器芯片上并引线接合到插入器芯片。 第二半导体芯片可以通过插入器芯片电连接到布线基板。

公开(公告)号：US20080067167A1

公开(公告)日：2008-03-20

申请号：US11826657

申请日：2007-07-17

Applicant: Han Jun Sung ,  Dae Sung Han ,  Yong Hyun Kwon ,  Seok Weon Hong ,  Tae Uk Lee ,  Pung Yeun Cho ,  Han Seong Kang ,  Sung Soo Park ,  Sung Kwang Kim ,  Tae Hun Kim

Inventor： Han Jun Sung ,  Dae Sung Han ,  Yong Hyun Kwon ,  Seok Weon Hong ,  Tae Uk Lee ,  Pung Yeun Cho ,  Han Seong Kang ,  Sung Soo Park ,  Sung Kwang Kim ,  Tae Hun Kim

IPC: H05B3/68

CPC classification number: F24C15/101

Abstract: Provided is a heating cooker which includes a body constituting an appearance thereof, an upper panel on which a cooking container is laid, a heater positioned under the upper panel to heat the cooking container laid on the upper panel, a fan housing liftably positioned at one side of the body to be raised above the upper panel and having an air intake port and an air discharge port, a blast fan and a fan motor positioned in the fan housing to forcibly blow air toward a surface of the upper panel, a fan housing lifter to raise and lower the fan housing, a temperature sensor to detect the temperature of the upper panel, and a controller to control the heater, the fan motor, and the fan housing lifter. The upper panel heated by the heater can be forcibly cooled by air from the fan housing.

Abstract translation: 本发明提供一种加热烹调器，其包括构成其外观的主体，放置烹饪容器的上面板，位于上面板下方的加热器，用于加热放置在上面板上的烹饪容器的加热烹调器， 在所述主体的上方升起，具有进气口和排气口，鼓风机和位于所述风扇壳体中的风扇马达，以强制地朝向所述上板的表面吹气;风扇壳体 升降机，用于升高和降低风扇壳体，温度传感器以检测上面板的温度，以及控制器来控制加热器，风扇电机和风扇壳体升降器。 由加热器加热的上面板可以通过风扇外壳的空气强制冷却。

公开(公告)号：US20070045828A1

公开(公告)日：2007-03-01

申请号：US11509641

申请日：2006-08-25

Applicant: Heung-kyu Kwon ,  Se-nyun Kim ,  Tae-hun Kim ,  Jeong-o Ha ,  Hak-kyoon Byun ,  Sung-yong Park

Inventor： Heung-kyu Kwon ,  Se-nyun Kim ,  Tae-hun Kim ,  Jeong-o Ha ,  Hak-kyoon Byun ,  Sung-yong Park

IPC: H01L23/34

CPC classification number: H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Disclosed is a semiconductor device packaging technique that is capable of resolving a problem of instability of bonding wires when stacking a plurality of semiconductor chips. The technique is also capable of realizing a slim, light and small package. The semiconductor device package includes a substrate having a substrate pad on a surface thereof, one or more memory chips stacked on the substrate with each memory chip having a pad connected to a common pin receiving a common signal applied to all the memory chips, an interposer chip stacked on the substrate and having an interconnection wire connected to the memory chip pad, the common pin of each of the memory chips being electrically connected to the interconnection wire via the memory chip pad, and a logic chip stacked on the substrate and having a bypass circuit which electrically connects or disconnects the interconnection wire to or from the substrate pad.

Abstract translation: 公开了一种半导体器件封装技术，其能够在堆叠多个半导体芯片时解决接合线不稳定的问题。 该技术还能够实现纤细，轻巧和小包装。 半导体器件封装包括其表面上具有衬底焊盘的衬底，堆叠在衬底上的一个或多个存储器芯片，每个存储器芯片具有连接到接收施加到所有存储器芯片的公共信号的公共引脚的焊盘，插入器 芯片堆叠在基板上并具有连接到存储器芯片焊盘的互连线，每个存储器芯片的公共引脚经由存储器芯片焊盘电连接到互连线，以及堆叠在基板上的逻辑芯片， 旁路电路，其将互连线电连接到基板焊盘或从基板焊盘断开。

公开(公告)号：US5155699A

公开(公告)日：1992-10-13

申请号：US550503

申请日：1990-07-10

Applicant: Ho-sun Chung ,  Sin-jin Kim ,  Tae-hun Kim

Inventor： Ho-sun Chung ,  Sin-jin Kim ,  Tae-hun Kim

IPC: G06F7/52 ,  G06F7/535

CPC classification number: G06F7/535 ,  G06F2207/4802 ,  G06F2207/5353

Abstract: A divider using neural network configurations comprises a subtractor, a selecting means, a first latch means, a second latch means, a shift register and a control means. The subtractor of the divider comprises plural inverters and plural 3-bit full-adders which are composed of four output lines, an input synapse group, a first bias synapse group, a second bias synapse group, a feedback synapse group, a neuron group and an inverter group.

Abstract translation: 使用神经网络配置的分频器包括减法器，选择装置，第一锁存装置，第二锁存装置，移位寄存器和控制装置。 除法器的减法器包括多个反相器和多个3位全加器，它们由四条输出线，输入突触组，第一偏压突触组，第二偏压突触组，反馈突触组，神经元组和 逆变器组。

公开(公告)号：US10109644B2

公开(公告)日：2018-10-23

申请号：US15385152

申请日：2016-12-20

Applicant: Yoo Cheol Shin ,  Tae Hun Kim

Inventor： Yoo Cheol Shin ,  Tae Hun Kim

IPC: H01L27/11582 ,  H01L23/535 ,  H01L29/36 ,  H01L29/423 ,  H01L27/11565 ,  H01L27/1157 ,  H01L27/11573 ,  H01L27/11575

Abstract: In one embodiment, the semiconductor device includes a substrate having an impurity region, and the substrate and the impurity region have a different impurity characteristic. The semiconductor device further includes a stack of alternating first interlayer insulating layers and gate electrode layers on the substrate; at least one second interlayer insulating layer formed on the stack; a plurality of bit lines formed on the second interlayer insulating layer; and a first plurality of channel structures formed through the stack on the substrate. The first plurality of channel structures are electrically connected to respective ones of the plurality of bit lines. A second plurality of channel structures are formed through the stack on the impurity region, and the second plurality of channel structures are electrically insulated from the plurality of bit lines.

公开(公告)号：US20170352680A1

公开(公告)日：2017-12-07

申请号：US15385152

申请日：2016-12-20

Applicant: Yoo Cheol SHIN ,  Tae Hun KIM

Inventor： Yoo Cheol SHIN ,  Tae Hun KIM

IPC: H01L27/11582 ,  H01L23/535 ,  H01L29/36 ,  H01L29/423

CPC classification number: H01L27/11582 ,  H01L23/535 ,  H01L27/11565 ,  H01L27/1157 ,  H01L27/11573 ,  H01L27/11575 ,  H01L29/36 ,  H01L29/4234

Abstract: In one embodiment, the semiconductor device includes a substrate having an impurity region, and the substrate and the impurity region have a different impurity characteristic. The semiconductor device further includes a stack of alternating first interlayer insulating layers and gate electrode layers on the substrate; at least one second interlayer insulating layer formed on the stack; a plurality of bit lines formed on the second interlayer insulating layer; and a first plurality of channel structures formed through the stack on the substrate. The first plurality of channel structures are electrically connected to respective ones of the plurality of bit lines. A second plurality of channel structures are formed through the stack on the impurity region, and the second plurality of channel structures are electrically insulated from the plurality of bit lines.

公开(公告)号：US09196487B2

公开(公告)日：2015-11-24

申请号：US14336082

申请日：2014-07-21

Applicant: Tae Hun Kim ,  Sung Joon Kim ,  Young Kyu Sung ,  Wan Ho Lee ,  Tae Sung Jang ,  Tae Young Park ,  Wan Tae Lim

Inventor： Tae Hun Kim ,  Sung Joon Kim ,  Young Kyu Sung ,  Wan Ho Lee ,  Tae Sung Jang ,  Tae Young Park ,  Wan Tae Lim

IPC: H01L21/00 ,  H01L21/223 ,  H01L21/285

CPC classification number: H01L21/2236 ,  H01L21/28575 ,  H01L29/2003 ,  H01L29/452 ,  H01L33/32 ,  H01L33/40 ,  H01L2933/0016

Abstract: According to an example embodiment, a method includes forming a nitrogen vacancy surface layer by treating a surface of an n-type nitride semiconductor with inert gas plasma, and forming an oxygen-added nitride film by treating a surface of the nitrogen vacancy surface layer with oxygen-containing gas plasma, and forming an electrode on the oxygen-added nitride film. The nitrogen vacancy surface layer lacks a nitrogen element.

Abstract translation: 根据示例性实施例，一种方法包括通过用惰性气体等离子体处理n型氮化物半导体的表面来形成氮空位表面层，并且通过用氮气空隙表面层的表面处理形成添加氧的氮化物膜 含氧气体等离子体，并在氧加成氮化物膜上形成电极。 氮空位表层缺少氮元素。

公开(公告)号：US09032332B2

公开(公告)日：2015-05-12

申请号：US12358579

申请日：2009-01-23

Applicant: Jae Young Chae ,  Tae Hun Kim ,  Sang Woon Lee ,  Young Sook Kim

Inventor： Jae Young Chae ,  Tae Hun Kim ,  Sang Woon Lee ,  Young Sook Kim

IPC: G06F3/048 ,  G06F3/0482 ,  G06F3/0481 ,  H04M1/725 ,  H04M1/2745

CPC classification number: H04M1/72583 ,  G06F3/04817 ,  G06F3/0482 ,  G06F3/04842 ,  G06F3/0488 ,  G06F2221/2109 ,  H04M1/274508 ,  H04M1/27455 ,  H04M1/72547

Abstract: A mobile terminal comprising a display unit; and a controller configured to selectively display one or more menu icons associated with an object displayed on the display unit, in response to the object being selected, wherein the one or more menu icons have a functional or informational association with the selected object, such that further selection of the menu icons provides additional information about the selected object or establishment of a dynamic relationship between the selected object and the one or more menu icons results in performance of an operation related to the selected object.

Abstract translation: 一种移动终端，包括显示单元; 以及控制器，被配置为响应于所选择的对象，选择性地显示与显示在显示单元上的对象相关联的一个或多个菜单图标，其中所述一个或多个菜单图标具有与所选择的对象的功能或信息关联，使得 菜单图标的进一步选择提供关于所选择的对象的附加信息或所选择的对象与一个或多个菜单图标之间的动态关系的建立导致执行与所选对象相关的操作。