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公开(公告)号:US10882160B2
公开(公告)日:2021-01-05
申请号:US15873851
申请日:2018-01-17
Applicant: Applied Materials, Inc.
Inventor: Daniel Redfield , Jason Garcheung Fung , Mayu Felicia Yamamura
IPC: B24D11/00 , B29C64/112 , B29C64/393 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y80/00 , B29C64/282 , B29C64/40 , C09G1/16 , B24B37/20 , B29L31/00
Abstract: A method of fabricating a polishing pad using an additive manufacturing system includes depositing a first set of successive layers onto a support by droplet ejection. Depositing the first set of successive layers includes dispensing a polishing pad precursor to first regions corresponding to partitions of the polishing pad and dispensing a sacrificial material to second regions corresponding to grooves of the polishing pad. A second set of successive layers is deposited by droplet ejection over the first set of successive layers. The second set of successive layers corresponds to a lower portion of the polishing pad. The first set of successive layer and the second set of successive layers provide a body. The body is removed from the support. Removing the sacrificial material from the body provides the polishing pad with a polishing surface that has the partitions separated by the grooves.
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公开(公告)号:US10306708B2
公开(公告)日:2019-05-28
申请号:US15824489
申请日:2017-11-28
Applicant: Applied Materials, Inc.
Inventor: Kin Pong Lo , Paul Brillhart , Balasubramanian Ramachandran , Satheesh Kuppurao , Daniel Redfield , Joseph M. Ranish , James Francis Mack , Kailash Kiran Patalay , Michael Olsen , Eddie Feigel , Richard Halpin , Brett Vetorino
Abstract: Embodiments of the disclosure generally relate to a reflector for use in a thermal processing chamber. In one embodiment, the thermal processing chamber generally includes an upper dome, a lower dome opposing the upper dome, the upper dome and the lower dome defining an internal volume of the processing chamber, a substrate support disposed within the internal volume, and a reflector positioned above and proximate to the upper dome, wherein the reflector has a heat absorptive coating layer deposited on a side of the reflector facing the substrate support.
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公开(公告)号:US20160136787A1
公开(公告)日:2016-05-19
申请号:US15002384
申请日:2016-01-20
Applicant: Applied Materials, Inc.
Inventor: Rajeev Bajaj , Daniel Redfield , Mahendra C. Orilall , Boyi Fu , Ashwin Chockalingam
CPC classification number: B24D11/001 , B24B37/22 , B24B37/24 , B24B37/26 , B24D3/28 , B24D11/04 , B33Y10/00 , B33Y70/00 , B33Y80/00
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
Abstract translation: 本公开的实施例涉及具有可调节的化学,材料和结构特性的高级抛光垫及其制造方法。 根据本公开的一个或多个实施例,已经发现可以通过诸如三维(3D)印刷工艺的添加剂制造工艺来生产具有改进性能的抛光垫。 因此,本公开的实施例可以提供具有离散特征和几何形状的先进抛光垫,其由至少两种不同的材料形成,包括功能性聚合物,功能低聚物,反应性稀释剂和固化剂。 例如,先进的抛光垫可以由多个聚合物层形成,通过至少一种树脂前体组合物的自动顺序沉积,然后至少一个固化步骤,其中各层可代表至少一种聚合物组合物和/ 或不同组成的区域。
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公开(公告)号:US11911870B2
公开(公告)日:2024-02-27
申请号:US17472006
申请日:2021-09-10
Applicant: Applied Materials, Inc.
Inventor: Sivapackia Ganapathiappan , Rajeev Bajaj , Yingdong Luo , Aniruddh Jagdish Khanna , You Wang , Daniel Redfield
Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements. Each polishing element comprises an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface to define a plurality of channels disposed between the polishing elements. Each of the polishing elements has a plurality of pore-features formed therein. Each of the polishing elements is formed of a pre-polymer composition and a sacrificial material composition. In some cases, a sample of the cured pre-polymer composition has a glass transition temperature (Tg) of about 80° C. or greater. A storage modulus (E′) of the cured pre-polymer composition at a temperature of 80° C. (E′80) can be about 200 MPa or greater.
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公开(公告)号:US11685014B2
公开(公告)日:2023-06-27
申请号:US16529884
申请日:2019-08-02
Applicant: Applied Materials, Inc.
Inventor: Sivapackia Ganapathiappan , Ankit Vora , Boyi Fu , Venkat Hariharan , Mayu Yamamura , Mario Cornejo , Igor Abramson , Mo Yang , Daniel Redfield , Rajeev Bajaj , Nag B. Patibandla
IPC: B24B37/24 , C08F283/00 , B33Y10/00 , B29C64/112 , B33Y70/10 , B29L31/00 , B33Y80/00
CPC classification number: B24B37/24 , B29C64/112 , B33Y10/00 , B33Y70/10 , C08F283/008 , B29L2031/736 , B33Y80/00
Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.
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公开(公告)号:US11642757B2
公开(公告)日:2023-05-09
申请号:US17137304
申请日:2020-12-29
Applicant: Applied Materials, Inc.
Inventor: Daniel Redfield , Jason Garcheung Fung , Mayu Felicia Yamamura
IPC: B24D11/00 , B29C64/112 , B29C64/393 , B33Y30/00 , B33Y80/00 , B33Y50/02 , B33Y10/00 , B29C64/282 , B29C64/40 , C09G1/16 , B24B37/20 , B29L31/00
CPC classification number: B24D11/006 , B29C64/112 , B29C64/282 , B29C64/393 , B29C64/40 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y80/00 , C09G1/16 , B24B37/20 , B29L2031/736
Abstract: A method of fabricating a polishing pad using an additive manufacturing system includes depositing a first set successive layers by droplet ejection to form a. Depositing the successive layers includes dispensing a polishing pad precursor to first regions corresponding to partitions of the polishing pad and dispensing a sacrificial material to second regions corresponding to grooves of the polishing pad. Removing the sacrificial material provides the polishing pad with a polishing surface that has the partitions separated by the grooves.
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公开(公告)号:US11612978B2
公开(公告)日:2023-03-28
申请号:US16897184
申请日:2020-06-09
Applicant: Applied Materials, Inc.
Inventor: Uma Sridhar , Sivapackia Ganapathiappan , Ashwin Murugappan Chockalingam , Mayu Felicia Yamamura , Daniel Redfield , Rajeev Bajaj , Yingdong Luo , Nag B. Patibandla
IPC: B24B37/24 , B33Y10/00 , C09D11/101 , C09D11/102 , B33Y70/00 , B29C64/112 , B33Y80/00 , H01L21/306 , B29L31/00 , B29K63/00 , B29K75/00
Abstract: Interpenetrating polymer networks (IPNs) for a forming polishing pad for a semiconductor fabrication operation are disclosed. Techniques for forming the polishing pads are provided. In an exemplary embodiment, a polishing pad includes an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.
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公开(公告)号:US11597054B2
公开(公告)日:2023-03-07
申请号:US17478836
申请日:2021-09-17
Applicant: Applied Materials, Inc.
Inventor: Mayu Felicia Yamamura , Jason Garcheung Fung , Daniel Redfield , Rajeev Bajaj , Hou T. Ng
IPC: B24B37/26 , B24D18/00 , B29C64/393 , B29C64/112 , B29C64/165 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y80/00 , B24B37/20 , B29L31/00
Abstract: A method of fabricating an object using an additive manufacturing system includes receiving data indicative of a desired shape of the object to be fabricated by droplet ejection. The desired shape defines a profile including a top surface and one or more recesses. Data indicative of a pattern of dispensing feed material is generated to at least partially compensate for distortions of the profile caused by the additive manufacturing system, and a plurality of layers of the feed material are dispensed by droplet ejection in accordance to the pattern.
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公开(公告)号:US11471999B2
公开(公告)日:2022-10-18
申请号:US16042016
申请日:2018-07-23
Applicant: Applied Materials, Inc.
Inventor: Ashavani Kumar , Ashwin Chockalingam , Sivapackia Ganapathiappan , Rajeev Bajaj , Boyi Fu , Daniel Redfield , Nag B. Patibandla , Mario Dagio Cornejo , Amritanshu Sinha , Yan Zhao , Ranga Rao Arnepalli , Fred C. Redeker
IPC: B24B37/24 , B24D11/04 , B24B37/26 , B24D18/00 , B24B37/16 , B24B37/20 , B33Y80/00 , B33Y10/00 , B29C64/112 , B33Y30/00 , H01L21/306
Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.
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公开(公告)号:US20220055181A1
公开(公告)日:2022-02-24
申请号:US17407052
申请日:2021-08-19
Applicant: Applied Materials, Inc.
Inventor: Aniruddh Jagdish Khanna , Daniel Redfield , Ehud Chatow , Kenneth Mason , Steven Turner , Rajeev Bajaj , Kieran Joseph Rynne , Periya G. Gopalan
IPC: B24B37/32
Abstract: The present disclosure relates to retaining rings that include tunable chemical, material and structural properties, improved structural and fluid transport configurations and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a retaining ring with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure provide an advanced retaining ring that has discrete features and geometries, formed from at least two different materials that are formed from one or more polymers. The layers and/or regions of the advanced retaining ring may include a composite material structure, such as a polymer that contains at least one filler, such as metals, semimetal oxides, carbides, nitrides and/or polymer particles.
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