公开(公告)号：US20110042042A1

公开(公告)日：2011-02-24

申请号：US12581129

申请日：2009-10-17

申请人： Jong Man KIM ,  Seog Moon Choi ,  Sang Hyun Shin ,  Jin Su Kim

发明人： Jong Man KIM ,  Seog Moon Choi ,  Sang Hyun Shin ,  Jin Su Kim

IPC分类号： F28D15/04 ,  F28F7/00 ,  F28F13/18

CPC分类号： F28F1/08 ,  F21V29/51 ,  F21Y2115/10 ,  F21Y2115/30 ,  F28D15/0275 ,  F28F2275/025 ,  F28F2275/14 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a radiating package module for an exothermic element. The radiating package module includes a heat conducting plate which has a groove of an internal thread shape, with the exothermic element being mounted on a surface of the heat conducting plate. A heat pipe is inserted into the groove in a screw-type coupling manner and has a coupling part of an external thread shape. An adhesive is applied between the groove and the coupling part. A cooling unit is coupled to an end of the heat pipe. The radiating package module maintains the reliability with which the radiating package radiates heat and improves structural reliability.

摘要翻译： 本文公开了用于放热元件的辐射封装模块。 辐射封装模块包括具有内螺纹形状的槽的导热板，放热元件安装在导热板的表面上。 热管以螺旋式联接的方式插入凹槽中并具有外螺纹形状的联接部分。 在凹槽和耦合部分之间施加粘合剂。 冷却单元联接到热管的一端。 辐射封装模块保持辐射封装散热的可靠性，提高结构可靠性。

公开(公告)号：US20110095315A1

公开(公告)日：2011-04-28

申请号：US12632598

申请日：2009-12-07

申请人： Ji Hyun PARK ,  Seog Moon Choi ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Tae Hyun Kim

发明人： Ji Hyun PARK ,  Seog Moon Choi ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Tae Hyun Kim

IPC分类号： H01L33/00

CPC分类号： H01L33/56 ,  H01L24/45 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Disclosed herein is a package substrate for optical elements, including: a conductive substrate including an insulation layer formed thereon; a circuit layer which is formed on the conductive substrate 11 and has a cavity space therein; electrode pads which are formed on the conductive substrate and which are spaced apart from the circuit layer by predetermined intervals such that trenches are formed between the circuit layer and the electrode pads; an optical element which is mounted in the cavity space of the circuit layer and which is electrically connected with the electrode pads; and a fluorescent resin layer which is formed on the circuit layer and the optical element to allow the optical element to uniformly emit light. The package substrate is advantageous in that uniform white light can be realized.

摘要翻译： 本文公开了一种用于光学元件的封装基板，包括：导电基板，其上形成有绝缘层; 电路层，其形成在导电基板11上并具有空腔; 电极焊盘，其形成在导电衬底上并且与电路层隔开预定间隔，使得在电路层和电极焊盘之间形成沟槽; 光学元件，其安装在所述电路层的空腔中并与所述电极焊盘电连接; 以及形成在电路层和光学元件上以允许光学元件均匀发光的荧光树脂层。 封装基板的优点在于可以实现均匀的白光。

公开(公告)号：US20110316035A1

公开(公告)日：2011-12-29

申请号：US12897936

申请日：2010-10-05

申请人： Sang Hyun Shin ,  Tae Hoon Kim ,  Cheol Ho Heo ,  Young Ki Lee ,  Ji Hyun Park ,  Ki Ho Seo

发明人： Sang Hyun Shin ,  Tae Hoon Kim ,  Cheol Ho Heo ,  Young Ki Lee ,  Ji Hyun Park ,  Ki Ho Seo

IPC分类号： H01L33/48 ,  H01L33/64

CPC分类号： H05K3/0061 ,  H01L23/4006 ,  H01L33/641 ,  H01L33/642 ,  H01L2023/4062 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K1/05 ,  H05K2201/0209 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2203/0315 ,  H01L2924/00

摘要： Disclosed is a heat-dissipating substrate, which includes a base substrate including a metal layer, an insulating layer formed on one surface of the metal layer, and a circuit layer formed on the insulating layer, a heat sink layer formed on the other surface of the metal layer, a connector for connecting the base substrate and the heat sink layer to each other, an opening formed in a direction of thickness of the base substrate and into which the connector is inserted, and an anodized layer formed on either or both of the other surface and a lateral surface of the metal layer, and in which the metal layer and the heat sink layer are insulated from each other by means of the anodized layer, thus preventing transfer of static electricity or voltage shock to the metal layer. A method of manufacturing the heat-dissipating substrate is also provided.

摘要翻译： 本发明公开了一种散热基板，其特征在于，具备包括金属层的基底基板，在所述金属层的一个面上形成的绝缘层，以及在所述绝缘层上形成的电路层，形成在所述绝缘层的另一面的散热层 所述金属层，用于将所述基底基板和所述散热层彼此连接的连接器，形成在所述基底基板的厚度方向上并且所述连接器被插入的开口的开口以及形成在所述基底基板中的任一个或两者上的阳极氧化层 金属层的另一表面和侧表面，并且其中金属层和散热层通过阳极氧化层彼此绝缘，从而防止静电或电压冲击向金属层传递。 还提供了制造散热基板的方法。

公开(公告)号：US08624123B2

公开(公告)日：2014-01-07

申请号：US13102323

申请日：2011-05-06

申请人： Cheol Ho Heo ,  Young Ki Lee ,  Sang Hyun Shin

发明人： Cheol Ho Heo ,  Young Ki Lee ,  Sang Hyun Shin

IPC分类号： H05K1/00 ,  H05K7/20

CPC分类号： H05K7/205 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K3/0061 ,  H05K3/3452 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2201/0323 ,  H01L2924/00

摘要： The present invention relates to a printed circuit board. A heat radiation coating material is applied to a portion of a circuit layer formed on an outermost portion of the printed circuit board, thereby making it possible to improve heat radiation performance of the printed circuit board. The heat radiation coating material also serves as a solder resist, thereby making it possible to insulate and protect the printed circuit board without a separate solder resist.

摘要翻译： 印刷电路板技术领域本发明涉及印刷电路板。 将辐射涂层材料施加到形成在印刷电路板的最外部的电路层的一部分，从而可以提高印刷电路板的散热性能。 散热涂层材料也用作阻焊剂，从而可以在没有单独的阻焊剂的情况下绝缘和保护印刷电路板。

公开(公告)号：US20120085574A1

公开(公告)日：2012-04-12

申请号：US13064364

申请日：2011-03-21

申请人： Ji Hyun Park ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Ki Ho Seo ,  Cheol Ho Heo ,  Young Ki Lee

发明人： Ji Hyun Park ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Ki Ho Seo ,  Cheol Ho Heo ,  Young Ki Lee

IPC分类号： H05K1/14 ,  H05K3/42

CPC分类号： H05K3/44 ,  H05K1/0203 ,  H05K1/053 ,  H05K3/202 ,  H05K3/4053 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0315 ,  Y10T29/49165

摘要： Provided are a heat radiating substrate and a method of manufacturing the same. The heat radiating substrate includes a substrate having a via-hole, an anode oxide layer formed on the entire surface of the substrate having the via-hole through an anodizing process, a first circuit pattern formed on the substrate on which the anode oxide layer is formed, and a second circuit pattern formed at a lower part of the via-hole to be connected to the via-hole. Therefore, it is possible to simplify a circuit forming process and readily manufacture the heat radiating substrate by applying a metal anodic bonding process, without using a conventional adhesion layer and metal seed when the heat radiating substrate is manufactured.

摘要翻译： 提供一种散热基板及其制造方法。 散热基板包括具有通孔的基板，通过阳极氧化处理形成在具有通孔的基板的整个表面上的阳极氧化层，形成在基板上的阳极氧化物层为阳极氧化层 以及形成在通孔的下部以连接到通孔的第二电路图案。 因此，通过在制造散热基板时不使用常规的粘合层和金属种子，通过施加金属阳极接合工艺来简化电路形成工艺并容易地制造散热基板。

公开(公告)号：US20120043875A1

公开(公告)日：2012-02-23

申请号：US12964285

申请日：2010-12-09

申请人： Ki Ho Seo ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Cheol Ho Heo ,  Young Ki Lee ,  Ji Hyun Park

发明人： Ki Ho Seo ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Cheol Ho Heo ,  Young Ki Lee ,  Ji Hyun Park

IPC分类号： H01J7/24 ,  H01R43/00

CPC分类号： H01L33/641 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/3736 ,  H01L33/642 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2933/0075 ,  H01S5/02276 ,  H01S5/02476 ,  Y10T29/49117

摘要： The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element.

摘要翻译： 本发明提供了一种辐射热衬底，包括：导电衬底，其由金属材料形成并且包括具有安装在其上的发光元件的前表面和与前表面相对的后表面; 覆盖导电性基板的前表面的绝缘膜; 覆盖导电性基板的背面的金属氧化物膜; 以及覆盖绝缘膜的金属图案，其中所述金属图案包括：传热垫，其接合到所述发光元件; 以及电路线，其设置在除了所述发光元件的安装区域以外的区域，并且与所述发光元件电连接。

公开(公告)号：US08368291B2

公开(公告)日：2013-02-05

申请号：US12964285

申请日：2010-12-09

申请人： Ki Ho Seo ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Cheol Ho Heo ,  Young Ki Lee ,  Ji Hyun Park

发明人： Ki Ho Seo ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Cheol Ho Heo ,  Young Ki Lee ,  Ji Hyun Park

IPC分类号： H01L33/64 ,  H01L33/48

CPC分类号： H01L33/641 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/3736 ,  H01L33/642 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2933/0075 ,  H01S5/02276 ,  H01S5/02476 ,  Y10T29/49117

摘要： The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element.

摘要翻译： 本发明提供了一种辐射热衬底，包括：导电衬底，其由金属材料形成并且包括具有安装在其上的发光元件的前表面和与前表面相对的后表面; 覆盖导电性基板的前表面的绝缘膜; 覆盖导电性基板的背面的金属氧化物膜; 以及覆盖绝缘膜的金属图案，其中所述金属图案包括：传热垫，其接合到所述发光元件; 以及电路线，其设置在除了所述发光元件的安装区域以外的区域，并且与所述发光元件电连接。

公开(公告)号：US20120199381A1

公开(公告)日：2012-08-09

申请号：US13102323

申请日：2011-05-06

申请人： Cheol Ho Heo ,  Young Ki Lee ,  Sang Hyun Shin

发明人： Cheol Ho Heo ,  Young Ki Lee ,  Sang Hyun Shin

IPC分类号： H05K7/20

CPC分类号： H05K7/205 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K3/0061 ,  H05K3/3452 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2201/0323 ,  H01L2924/00

摘要： The present invention relates to a printed circuit board. A heat radiation coating material is applied to a portion of a circuit layer formed on an outermost portion of the printed circuit board, thereby making it possible to improve heat radiation performance of the printed circuit board. The heat radiation coating material also serves as a solder resist, thereby making it possible to insulate and protect the printed circuit board without a separate solder resist.

摘要翻译： 印刷电路板技术领域本发明涉及印刷电路板。 将辐射涂层材料施加到形成在印刷电路板的最外部的电路层的一部分，从而可以提高印刷电路板的散热性能。 散热涂层材料也用作阻焊剂，从而可以在没有单独的阻焊剂的情况下绝缘和保护印刷电路板。

公开(公告)号：US08471481B2

公开(公告)日：2013-06-25

申请号：US13081616

申请日：2011-04-07

申请人： Sang Hyun Shin ,  Seon Ho Kim

发明人： Sang Hyun Shin ,  Seon Ho Kim

IPC分类号： H05B37/00 ,  H05B39/00 ,  H05B41/00

CPC分类号： H05B33/0806 ,  F21V5/04 ,  F21V23/005 ,  F21V29/507 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05B33/0815 ,  H05B33/0821

摘要： The present disclosure discloses a dimming method of a lighting apparatus using a PN junction light-emitting element, the method including: supplying AC controlled by a dimmer; causing a first group, which has one PN junction light-emitting element positioned within a first boundary and one PN junction light-emitting element positioned within a second boundary, to emit light at a first voltage by the supplied AC when a first switch is in the ON state; and causing a second group, which has another PN junction light-emitting element positioned within the first boundary and another PN junction light-emitting element positioned within the second boundary and which is connected in series to the first group, to emit light at a second voltage higher than the first voltage by the supplied current when the first switch positioned between the first group and the second group is in the OFF state.

摘要翻译： 本公开公开了一种使用PN结发光元件的照明装置的调光方法，所述方法包括：提供由调光器控制的AC; 引起第一组，其具有位于第一边界内的一个PN结发光元件和位于第二边界内的一个PN结发光元件，当第一开关处于第一组时，通过所提供的AC发射第一电压的光 ON状态; 并且引起第二组，其具有位于第一边界内的另一个PN结发光元件，以及位于第二边界内并与第一组串联连接的另一个PN结发光元件，以在第二组中发射光 当位于第一组和第二组之间的第一开关处于关闭状态时，供给电流高于第一电压的电压。

公开(公告)号：US20120217891A1

公开(公告)日：2012-08-30

申请号：US13081625

申请日：2011-04-07

申请人： Sang Hyun Shin ,  Seon Ho Kim

发明人： Sang Hyun Shin ,  Seon Ho Kim

IPC分类号： H05B41/16

CPC分类号： H05B33/083 ,  H05B33/0809

摘要： The present disclosure discloses a lighting apparatus using a PN junction light-emitting element, the apparatus including: a power transmitting substrate having a plurality of boundaries defined thereon; a plurality of PN junction light-emitting elements positioned within each boundary and divided into a plurality of groups; and a first switch provided on the power transmitting substrate, wherein the first switch goes into the ON state by a supplied AC having a first voltage to cause PN junction light-emitting elements of a first group positioned within each boundary to emit light, and the first switch is in the OFF state when PN junction light-emitting elements of a second group, which is positioned within each boundary and connected in series to the first group, emit light by a supplied AC having a second voltage higher than the first voltage.

摘要翻译： 本公开公开了一种使用PN结发光元件的照明装置，该装置包括：具有限定在其上的多个边界的电力传输基板; 多个PN结发光元件，其位于每个边界内并分成多个组; 以及设置在所述电力传输基板上的第一开关，其中所述第一开关通过具有第一电压的所提供的AC进入导通状态，以使位于每个边界内的第一组的PN结发光元件发光，并且 位于每个边界内且与第一组串联连接的第二组的PN结发光元件通过具有高于第一电压的第二电压的提供的AC发光，第一开关处于关闭状态。