公开(公告)号：US6142195A

公开(公告)日：2000-11-07

申请号：US285144

申请日：1999-04-01

申请人： Yu-Liang Lin

发明人： Yu-Liang Lin

IPC分类号： B65B39/08 ,  B65B11/04 ,  B65B1/04 ,  B67C3/00

CPC分类号： B65B39/08

摘要： A quick release device clamps a conventional threaded bottle or similar container on structure such as processing equipment mounting head to allow rapid replacement of the bottle. The clamp includes a U-shaped clamping member in the form of a plate which slides under a flange or lip of the threaded bottle neck. A pair of hold-downs hinged to the clamping plate by overcenter linkages are adapted to respectively receive a pair of ears on the mounting head. The linkages include levers which when manually operated to an overcenter position, lock the bottle into tight sealing engagement with the processing equipment head.

摘要翻译： 快速释放装置将传统的螺纹瓶或类似容器夹在诸如加工设备安装头的结构上，以允许快速更换瓶子。 夹具包括板形的U形夹紧构件，其在带螺纹的瓶颈的凸缘或唇缘下方滑动。 通过中心连接件铰接到夹紧板上的一对压紧件适于分别在安装头上容纳一对耳朵。 连杆包括手动操作到超中心位置的杠杆，将瓶子与加工设备头部紧密地密封接合。

公开(公告)号：US20120021604A1

公开(公告)日：2012-01-26

申请号：US12841874

申请日：2010-07-22

申请人： Yu-Liang Lin ,  Weng-Jin Wu ,  Jing-Cheng Lin

发明人： Yu-Liang Lin ,  Weng-Jin Wu ,  Jing-Cheng Lin

IPC分类号： H01L21/306 ,  H01L21/302 ,  H01L21/3065

CPC分类号： H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834

摘要： A method includes bonding a wafer on a carrier through an adhesive, and performing a thinning process on the wafer. After the step of performing the thinning process, a portion of the adhesive not covered by the wafer is removed, while the portion of the adhesive covered by the wafer is not removed.

摘要翻译： 一种方法包括通过粘合剂将晶片接合在载体上，并在晶片上进行稀化处理。 在进行稀化处理的步骤之后，去除未被晶片覆盖的粘合剂的一部分，同时由晶片覆盖的粘合剂部分未被除去。

公开(公告)号：US07665319B2

公开(公告)日：2010-02-23

申请号：US11283749

申请日：2005-11-22

申请人： Tsung-Jung Hsieh ,  Yu-Liang Lin ,  Yueh-Lung Huang ,  Ming-Shi Tsai

发明人： Tsung-Jung Hsieh ,  Yu-Liang Lin ,  Yueh-Lung Huang ,  Ming-Shi Tsai

IPC分类号： F25D17/00 ,  G05B11/28 ,  H02P23/00 ,  H05K7/20 ,  G06F1/20

CPC分类号： H05K7/20209 ,  F04D27/004

摘要： A fan control device receives a target revolution signal to control a rotation speed of a fan. The device includes a temperature measuring module, a revolution modulating module and a driving module. The temperature measuring module generates a temperature value according to an ambient temperature of the fan. The revolution modulating module is electrically connected with the temperature measuring module, receives the temperature value, and generates a control signal according to the temperature value and the target revolution signal. The driving module is electrically connected with the revolution modulating module, and generates a driving signal to drive the fan according to the control signal. In addition, a fan control method, which is applied to the fan control device, is also provided.

摘要翻译： 风扇控制装置接收目标转速信号以控制风扇的转速。 该装置包括温度测量模块，转速调制模块和驱动模块。 温度测量模块根据风扇的环境温度生成温度值。 转速调制模块与温度测量模块电连接，接收温度值，并根据温度值和目标转速信号产生控制信号。 驱动模块与旋转调制模块电连接，并根据控制信号生成驱动风扇的驱动信号。 此外，还提供了应用于风扇控制装置的风扇控制方法。

公开(公告)号：US07633184B2

公开(公告)日：2009-12-15

申请号：US11812655

申请日：2007-06-20

申请人： Yu-Lung Dung ,  Yu-Liang Lin ,  Yueh-Lung Huang

发明人： Yu-Lung Dung ,  Yu-Liang Lin ,  Yueh-Lung Huang

IPC分类号： H01H35/06 ,  H02P1/04

CPC分类号： H02P29/0241 ,  Y10T307/793 ,  Y10T307/858

摘要： A switch control device receives an input signal and a power signal and includes a control unit and a switch unit. The control unit has a predetermined value and receives the input signal and the power signal. When the input signal is lower than the predetermined value, the control unit outputs a control signal. The switch unit is electrically connected with the control unit, receives the control signal, and stops outputting the power signal according to the control signal.

摘要翻译： 开关控制装置接收输入信号和电力信号，并且包括控制单元和开关单元。 控制单元具有预定值并接收输入信号和功率信号。 当输入信号低于预定值时，控制单元输出控制信号。 开关单元与控制单元电连接，接收控制信号，并根据控制信号停止输出功率信号。

公开(公告)号：US20090195127A1

公开(公告)日：2009-08-06

申请号：US12107712

申请日：2008-04-22

申请人： Yu-Liang Lin

发明人： Yu-Liang Lin

IPC分类号： H02K16/04 ,  H02K1/12 ,  B62J6/08 ,  H02K23/36

CPC分类号： H02K1/146 ,  H02K16/00 ,  H02K21/222

摘要： An electric generator includes at least first and second stator units aligned along a stator axis, and a rotor. Each stator unit includes a stator core having a plurality of angularly spaced-apart coil mounting arms that extend in radial outward directions relative to the stator axis, a plurality of field coils each wound on a respective one of the coil mounting arms, and an insulator unit disposed between the field coils and the stator core so as to provide electrical insulation therebetween while permitting electromagnetic coupling therebetween. The first and second stator units are arranged side by side along the stator axis such that the coil mounting arms of the first stator unit are angularly displaced with respect to the coil mounting arms of the second stator unit. The rotor is coupled rotatably to the first and second stator units for inducing electrical currents in the field coils.

摘要翻译： 发电机包括沿定子轴线对准的至少第一和第二定子单元和转子。 每个定子单元包括定子芯，该定子芯具有多个相对于定子轴线沿径向向外方向延伸的角度间隔开的线圈安装臂，多个励磁线圈分别卷绕在线圈安装臂中的相应一个上，绝缘体 设置在励磁线圈和定子铁芯之间的单元，以便在它们之间提供电绝缘，同时允许它们之间的电磁耦合。 第一和第二定子单元沿着定子轴线并排布置，使得第一定子单元的线圈安装臂相对于第二定子单元的线圈安装臂成角度地移位。 转子可旋转地耦合到第一和第二定子单元，用于感应励磁线圈中的电流。

公开(公告)号：US20080074275A1

公开(公告)日：2008-03-27

申请号：US11898899

申请日：2007-09-17

申请人： Yu-Liang Lin ,  Tsung-Jung Hsieh ,  Yueh-Lung Huang ,  Ming-Shi Tsai

发明人： Yu-Liang Lin ,  Tsung-Jung Hsieh ,  Yueh-Lung Huang ,  Ming-Shi Tsai

IPC分类号： G08B17/00

CPC分类号： G06F1/206 ,  H05K7/20209 ,  Y10S388/934

摘要： A control device of a fan system includes a temperature sensing module, a comparing module and a driving module. The temperature sensing module senses an external temperature and generates a sensing signal according to the external temperature. The comparing module receives the sensing signal and outputs a comparing signal according to the sensing signal and a reference voltage signal. The driving module, which is electrically connected with the temperature sensing module and the comparing module, supplies a working voltage to the temperature sensing module and the comparing module, and outputs a rotating speed control signal according to the sensing signal or the comparing signal.

摘要翻译： 风扇系统的控制装置包括温度感测模块，比较模块和驱动模块。 温度检测模块检测外部温度，并根据外部温度产生感应信号。 比较模块接收感测信号，并根据感测信号和参考电压信号输出比较信号。 与温度检测模块和比较模块电连接的驱动模块向温度感测模块和比较模块提供工作电压，并根据感测信号或比较信号输出转速控制信号。

公开(公告)号：US07267600B1

公开(公告)日：2007-09-11

申请号：US11423553

申请日：2006-06-12

申请人： Yu-Liang Lin ,  Jerry Hwang

发明人： Yu-Liang Lin ,  Jerry Hwang

IPC分类号： B24B49/00

CPC分类号： B24B37/30 ,  B24B49/003 ,  B24B49/16 ,  Y10S451/91

摘要： Apparatus for polishing are provided. An apparatus comprises a fluid controller, a polishing apparatus and a fluid interface membrane. The fluid controller is fluidly coupled to the polishing apparatus by way of at least one conduit. The fluid interface membrane is disposed within at least one of the fluid controller, the conduit and the polishing apparatus to separate a first fluid and a second fluid and to transfer pressure from the first fluid to the second fluid.

摘要翻译： 提供用于抛光的装置。 一种装置包括流体控制器，抛光装置和流体界面膜。 流体控制器通过至少一个管道流体地联接到抛光装置。 流体界面膜设置在至少一个流体控制器，管道和抛光装置内，以分离第一流体和第二流体，并将压力从第一流体转移到第二流体。

公开(公告)号：US20070032180A1

公开(公告)日：2007-02-08

申请号：US11199607

申请日：2005-08-08

申请人： Chien Hwang ,  Yu-Liang Lin ,  Chia-Ming Yang ,  Cheng Chan ,  Jean Wang ,  Chen-Hua Yu

发明人： Chien Hwang ,  Yu-Liang Lin ,  Chia-Ming Yang ,  Cheng Chan ,  Jean Wang ,  Chen-Hua Yu

IPC分类号： B24B29/00

CPC分类号： B24B57/02 ,  B24B37/04

摘要： A slurry residence time enhancement system for a chemical mechanical polishing apparatus having a base, a platen on the base, a polishing pad on the platen and a polishing head over the polishing pad is disclosed. The system includes at least one slurry distribution unit having a slurry distribution member for positioning on the polishing pad. In operation of the CMP apparatus, the slurry distribution member redirects polishing slurry on the polishing pad to the polishing head. The system may alternatively or additionally include a rim for upward extension from the base and a seal for insertion between the platen and the polishing pad adjacent to the rim.

摘要翻译： 公开了一种用于化学机械抛光设备的浆料停留时间增强系统，其具有底座，底座上的压板，压板上的抛光垫和抛光垫上的抛光头。 该系统包括至少一个浆料分配单元，其具有用于定位在抛光垫上的浆料分配构件。 在CMP装置的操作中，浆料分配构件将抛光垫上的抛光浆料重新定向到抛光头。 系统可以可选地或另外地包括用于从基座向上延伸的边缘和用于插入在压板和与边缘相邻的抛光垫之间的密封件。

公开(公告)号：US20060091567A1

公开(公告)日：2006-05-04

申请号：US11163131

申请日：2005-10-06

申请人： Yu-Liang Lin ,  Chih-Cheng Hung

发明人： Yu-Liang Lin ,  Chih-Cheng Hung

IPC分类号： H01L23/28

CPC分类号： H01L21/52 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for fabricating a cavity-down package is provided. A chip carrier includes a chip cavity. A chip is disposed inside the cavity, and a plurality of bonding materials is formed at the corners of the chip. The bonding materials are cured to protect the corners of the chip. Next, an encapsulant is formed in the cavity to seal the chip and the bonding materials to prevent stress concentration caused by thermal expansion mismatch on the chip corners and eliminate delamination between the encapsulant and the chip.

摘要翻译： 提供了一种制造腔体封装的方法。 芯片载体包括芯片腔。 芯片设置在空腔内，并且在芯片的角部形成多个接合材料。 固化粘合材料以保护芯片的角部。 接下来，在空腔中形成密封剂以密封芯片和接合材料，以防止由芯片角部的热膨胀失配引起的应力集中，并消除封装剂和芯片之间的分层。

公开(公告)号：US09299594B2

公开(公告)日：2016-03-29

申请号：US12844113

申请日：2010-07-27

申请人： Yu-Liang Lin ,  Weng-Jin Wu ,  Jing-Cheng Lin

发明人： Yu-Liang Lin ,  Weng-Jin Wu ,  Jing-Cheng Lin

IPC分类号： H01L21/67 ,  H01L21/683 ,  H01L21/66 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L21/6835 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/6836 ,  H01L22/12 ,  H01L22/26 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16146 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05552

摘要： The embodiments described provide apparatus and methods for bonding wafers to carriers with the surface contours of plates facing the substrates or carriers are modified either by re-shaping, by using height adjusters, by adding shim(s), or by zoned temperature control. The modified surface contours of such plates compensate the effects that may cause the non-planarity of bonded substrates.

摘要翻译： 所描述的实施例提供了将晶片接合到载体上的装置和方法，其中面向基板或载体的板的表面轮廓通过重新成形，通过使用高度调节器，通过添加垫片或通过分区的温度控制来改变。 这种板的改进的表面轮廓补偿可能导致键合衬底的非平面性的影响。