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    LED package with multiple element light source and encapsulant having curved and/or planar surfaces
    32.
    发明授权
    LED package with multiple element light source and encapsulant having curved and/or planar surfaces 有权

    公开(公告)号：US10468565B2

    公开(公告)日：2019-11-05

    申请号：US14575805

    申请日：2014-12-18

    Applicant: CREE, INC.

    Inventor： Arthur Pun ,  Jeremy Nevins ,  Jesse Reiherzer ,  Joseph Clark

    IPC: H01L33/54 ,  H01L25/075 ,  H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L23/00

    Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The LED package are also directed to features or arrangements that allow for improved or tailored emission characteristic for LED packages according to the present invention. Some of these features or arrangements include, but are not limited to, higher ratio of light source size to submount size, the used of particular materials (e.g. different silicones) for the LED package layers, improved arrangement of a reflective layer, improved composition and arrangement of the phosphor layer, tailoring the shape of the encapsulant, and/or improving the bonds between the layers. There are only some of the improvements disclosed herein, with some of these resulting in LED packages the emit light with a higher luminous intensity over conventional LED packages.

    LIGHT-EMITTING DIODE PACKAGE WITH LIGHT-ALTERING MATERIAL
    33.
    发明申请
    LIGHT-EMITTING DIODE PACKAGE WITH LIGHT-ALTERING MATERIAL 审中-公开

    公开(公告)号：US20190326485A1

    公开(公告)日：2019-10-24

    申请号：US15957454

    申请日：2018-04-19

    Applicant: Cree, Inc.

    Inventor： Kyle Damborsky ,  Derek Miller ,  Jack Vu ,  Peter Scott Andrews ,  Jasper Cabalu ,  Colin Blakely ,  Jesse Reiherzer

    IPC: H01L33/52 ,  H01L33/50 ,  H01L33/60 ,  H01L33/26

    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.

    NON-MAGNIFIED LED FOR HIGH CENTER-BEAM CANDLE POWER
    36.
    发明申请
    NON-MAGNIFIED LED FOR HIGH CENTER-BEAM CANDLE POWER 审中-公开
    用于高中心光束焦距功率的非放大LED

    公开(公告)号：US20160254423A1

    公开(公告)日：2016-09-01

    申请号：US14633734

    申请日：2015-02-27

    Applicant: CREE, INC.

    Inventor： Michael John Bergmann ,  Jesse Reiherzer ,  Joseph Gates Clark ,  Benjamin Jacobson ,  Sung Chul Joo

    IPC: H01L33/54 ,  H01L33/50 ,  H01L33/60 ,  H01L33/48

    CPC classification number: H01L33/54 ,  H01L27/156 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: Light emitting diode components are disclosed that utilize a thin, substantially flat or undomed encapsulant in order to achieve the desired emission profile to increase luminance and/or center beam candle power. Some embodiments of the devices include encapsulants, which result in an apparent source image, which does not exceed 2× the source size. Different embodiments of the present invention can comprise different configurations of emitters within the component, such as monolithic chips. The LEDs can be wire bonded to a surface. This surface can be black, reflective or include a reflective coating. In some embodiments, conversion materials can be applied conformal to the LED.

    Abstract translation: 公开了使用薄的，基本上平坦的或未掺杂的密封剂的发光二极管组件，以便实现所需的发射分布，以增加亮度和/或中心光束烛光功率。 装置的一些实施例包括密封剂，其产生不超过2×源尺寸的明显源图像。 本发明的不同实施例可以包括组件内的发射器的不同配置，例如单片芯片。 LED可以引线键合到表面。 该表面可以是黑色的，反射的或包括反射涂层。 在一些实施例中，转换材料可以适用于LED。

    LED package with encapsulant having planar surfaces
    37.
    发明授权
    LED package with encapsulant having planar surfaces 有权
    LED封装具有平坦表面的密封剂

    公开(公告)号：US09048396B2

    公开(公告)日：2015-06-02

    申请号：US13649052

    申请日：2012-10-10

    Applicant: CREE, INC.

    Inventor： Theodore Lowes ,  Eric J. Tarsa ,  Sten Heikman ,  Bernd Keller ,  Jesse Reiherzer ,  Hormoz Benjamin

    IPC: F21V9/16 ,  H01L33/50 ,  H01L33/54 ,  F21V9/00

    CPC classification number: H01L33/54 ,  F21V9/00 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with one or more LEDs, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it is absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility with different applications.

    Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装可以包括具有一个或多个LED的底座，以及LED和底座上的毯子转换材料层。 密封剂可以位于底座上，在LED上，并且在密封剂内反射的光将到达转化材料，其中它被全向吸收和发射。 当与具有半球密封剂或透镜的传统包装相比时，反射光现在可以逃避密封剂，从而有效地发射和更宽的发射特征。 在某些实施例中，LED封装为LED封装面积比提供更高的芯片面积。 通过使用具有平面表面的密封剂，LED封装可以在各种特征和LED封装比之间提供独特的尺寸关系，从而在不同应用中实现更大的灵活性。

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