Abstract:
Optical bond-wire interconnections between microelectronic chips, wherein optical wires are bonded onto microelectronic chips. Such optical connections offer numerous advantages compared to traditional electrical connections. Among other things, these interconnections are insensitive to electromagnetic interference and need not be located at the edges of a chip but rather can be placed for optimal utility to the circuit function. In addition, such interconnections can be given the same or other pre-specified lengths regardless of the placement in the module and they are capable of signal bandwidths up to 20 Gigahertz without causing a cross-talk problem. A method of fabrication of such optical interconnections using optical fiber, a laser or photodetector and etched mirror and etched V-shaped grooves.
Abstract:
A limiter for limiting selected frequency components by generating Stokes waves in a stimulated Brillouin scattering medium. The generated Stokes waves create a seed that is provided to another stimulated Brillouin scattering medium. The seed selecting the undesired frequency components to be attenuated.
Abstract:
An antenna beamformer consisting of optical irises coupled to Wavelength Division Multiplexers (WDMs). The ports of the WDMs are coupled to lens ports, where each lens port corresponds to a different antenna beam. The optical irises are optical filters with selectable center frequencies and selectable passband widths. Selection of different center frequencies and passband widths enables the selection of different ports of the WDMs, which allows the selection of one or more antenna beams. The beamformer may also have controllable delay lines to provide for additional beam steering.
Abstract:
A Delta-Sigma Analog-to-Digital Converter (ADC) that can have a very high sampling rate (over 100 GHz) and which is preferably optically sampled to help achieve its very high sampling rate. The sampling rate can be many times higher than the regeneration speed of the electronic quantizers used in the ADC.
Abstract:
A merged dual flipped White Cell including a White Cell having upper and lower cell regions; an optical deflector array for selectively deflecting light to either an upper image plane associated with said upper region or to a lower image plane associated with said lower region; a plurality of optical delay lines for receiving and returning delayed light at said upper image plane; and a plurality of reference mirrors and optical input and output ports in optical communication with said deflector array and with said plurality of delay lines. A wavelength tapped delay White Cell including a White Cell optical cavity having a flat mirror plane on a first side thereof and curved mirrors on a second side thereof, the flat mirror plane having an array of frequency-selective taps. Also disclosed are cascaded antenna beamforming systems comprising one or more merged dual flipped White Cells and/or one or more wavelength tapped delay White Cells.
Abstract:
A lead-frame for connecting and supporting an integrated circuit having an apertured frame with dimensions smaller than the corresponding dimensions of the chip so that chip-pad shoulder can be eliminated and the chip attach fillet is made remote from the chip corner.
Abstract:
A photonically sampled analog-to-digital converter using parallel channels of sampling and quantizing. The parallel combination achieves cancellation of the spurs that result from the nonlinear transfer function of the samplers. The samplers feed a dual-detector optoelectronic receiver that has differential inputs for suppression of laser intensity noise. The outputs of the multiple photonic samplers are averaged to reduce the effects of shot or thermal noise from the optoelectronic receiver of a sampler. The errors produced by the quantization process can be reduced by using a delta-sigma modulator-based analog-to-digital convertor as the quantizer which provides noise-spectrum shaping and filtering.
Abstract:
An application-specific rf optoelectronic integrated circuit having a generic chip member and a defining substrate in communication with at least one generic chip member. The generic chip member contains passive building block components that are independent from each other and being connected by paths external to the generic chip member. The external connection paths are defined by a defining substrate member having passive components for providing optical and electrical interconnection between selected building block components on the generic chip member to define the specific function of the integrated circuit. It is possible to use the same design of the generic chip for several applications merely by altering the interconnect paths on a defining substrate.
Abstract:
An integrated optical transmitter includes a modulator drive circuit in communication with a modulator, and a laser drive circuit in communication with a laser. The modulator receives laser light from the laser and modulation control signals from the modulator drive circuit, and outputs modulated optical signals in a direction normal to the substrate surface. The transmitter is integrated by securing the laser to the modulator using flip chip technology. The laser includes a vertical cavity, and is optically aligned with the horizontal coupling surface of the modulator during the flip chip process.
Abstract:
A surface-emitting laser system includes a laser that emits a vertically divergent beam generally parallel to the substrate on which it is formed, and a turning mirror in the path of the beam that extends up from the substrate to a level well above the laser height. The extended mirror area reflects a greater portion of the beam than prior planar designs, increasing the output efficiency and providing a smoother beam pattern. One fabrication method employs a masking and ion beam milling technique that uses an accumulation of redeposited material to form the additional mirror area, with a thick mask layer that is later removed guiding the redeposition. An alternate fabrication method involves epitaxial growth of an additional layer of material above the conventional laser epilayers, with the additional layer subsequently removed from the laser region but retained in the mirror region.