公开(公告)号：US20090230409A1

公开(公告)日：2009-09-17

申请号：US12050082

申请日：2008-03-17

Applicant: Grigoriy Basin ,  Frederic Diana ,  Paul S. Martin ,  Dima Simonian

Inventor： Grigoriy Basin ,  Frederic Diana ,  Paul S. Martin ,  Dima Simonian

IPC: H01L33/00

CPC classification number: H01L33/54 ,  H01L24/97 ,  H01L33/0079 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

Abstract: An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.

Abstract translation: 用于LED的底部填充技术使用压缩成型来同时封装安装在底座晶片上的倒装芯片LED管芯阵列。 成型工艺使液体底部填充材料（或软化的底部填充材料）填充LED管芯和底座晶片之间的间隙。 然后将底部填充材料硬化，例如通过固化。 使用微珠喷砂除去在LED管芯的顶部和侧面上固化的底部填充材料。 然后通过激光剥离从所有LED管芯去除暴露的生长衬底，并且底部填充物在剥离过程中支持每个LED管芯的脆性外延层。 然后将底座晶片分离。 许多LED的晶片级处理同时大大减少了制造时间，并且可以使用各种各样的材料用于底部填充，因为宽范围的粘度是可以容忍的。

公开(公告)号：US20090017566A1

公开(公告)日：2009-01-15

申请号：US11775059

申请日：2007-07-09

Applicant: Grigoriy Basin ,  Robert S. West ,  Paul S. Martin

Inventor： Grigoriy Basin ,  Robert S. West ,  Paul S. Martin

IPC: H01L33/00

CPC classification number: H01L33/0079 ,  H01L24/97 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A light emitting diode (LED) is fabricated using an underfill layer that is deposited on either the LED or the submount prior to mounting the LED to a submount. The deposition of the underfill layer prior to mounting the LED to the submount provides for a more uniform and void free support, and increases underfill material options to permit improved thermal characteristics. The underfill layer may be used as support for the thin and brittle LED layers during the removal of the growth substrate prior to mounting the LED to the submount. Additionally, the underfill layer may be patterned to and/or polished back so that only the contact areas of the LED and/or submount are exposed. The patterns in the underfill may also be used as a guide to assist in the singulating of the devices.

Abstract translation: 在将LED安装到底座之前，使用底层填充层制造发光二极管（LED），其沉积在LED或者底座上。 在将LED安装到底座之前，底部填充层的沉积提供了更均匀和无空隙的支撑，并且增加了底部填充材料选项以允许改进的热特性。 在将LED安装到底座之前，底层填充层可以用作移除生长衬底期间的薄且脆性LED层的支撑。 此外，底部填充层可以被图案化和/或抛光，使得只有LED和/或副安装座的接触区域被暴露。 底部填充物中的图案也可以用作辅助单元的设备的指导。

公开(公告)号：US07452737B2

公开(公告)日：2008-11-18

申请号：US10990208

申请日：2004-11-15

Applicant: Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin

Inventor： Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin

IPC: H01L21/00

CPC classification number: H01L33/52 ,  B29C33/0022 ,  B29C39/006 ,  B29C39/025 ,  B29C43/021 ,  B29C43/18 ,  B29L2011/0016 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0071 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01049 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor.

Abstract translation: 一个或多个LED骰子安装在支撑结构上。 支撑结构可以是具有LED芯片的基座，其已经电连接到底座上的引线。 模具中的凹槽对应于支撑结构上的LED骰子的位置。 凹痕中填充有液体光学透明材料，例如硅树脂，其在固化时形成透镜材料。 压痕的形状将是镜片的形状。 模具和LED骰子/支撑结构被聚集在一起，使得每个LED管芯位于相关压痕内的液体硅胶内。 然后将模具加热以固化（硬化）硅树脂。 然后将模具和支撑结构分离，在每个LED管芯上留下完整的硅胶透镜。 可以用不同的模具重复该过模制过程以产生透镜的同心壳。 每个同心透镜可以具有不同的性质，例如含有荧光体。

公开(公告)号：US07352011B2

公开(公告)日：2008-04-01

申请号：US11093961

申请日：2005-03-29

Applicant: Willem H. Smits ,  Robert F. M. Hendriks ,  Grigoriy Basin ,  Frans H. Konijn ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers

Inventor： Willem H. Smits ,  Robert F. M. Hendriks ,  Grigoriy Basin ,  Frans H. Konijn ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers

IPC: H01L29/22

CPC classification number: H01L33/58 ,  G02B19/0028 ,  G02B19/0066 ,  G02B19/0071 ,  H01L33/46 ,  H01L33/504 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: Lenses and certain fabrication techniques are described. A wide-emitting lens refracts light emitted by an LED die to cause a peak intensity to occur within 50-80 degrees off the center axis and an intensity along the center axis to be between 5% and 33% of the peak intensity. The lens is particularly useful in a LCD backlighting application. In one embodiment, the lens is affixed to the backplane on which the LED die is mounted and surrounds the LED die. The lens has a hollow portion that forms an air gap between the LED die and the lens, where the light is bent towards the sides both at the air gap interface and the outer lens surface interface. The lens may be a secondary lens surrounding an interior lens molded directly over the LED die.

Abstract translation: 描述镜片和某些制造技术。 宽发射透镜折射由LED管芯发射的光，使峰强度发生在离中心轴50-80度以内，沿着中心轴的强度在峰值强度的5％至33％之间。 镜头在LCD背光应用中特别有用。 在一个实施例中，透镜固定到其上安装有LED管芯的背板上，并且围绕LED管芯。 透镜具有中空部分，其在LED管芯和透镜之间形成气隙，其中光在气隙界面和外透镜表面界面处朝向侧面弯曲。 透镜可以是围绕直接模制在LED芯片上的内部透镜的次级透镜。

公开(公告)号：US20080048200A1

公开(公告)日：2008-02-28

申请号：US11679143

申请日：2007-02-26

Applicant: Gerd Mueller ,  Regina Mueller-Mach ,  Grigoriy Basin ,  Robert West ,  Paul Martin ,  Tze-Sen Lim ,  Stefan Eberle

Inventor： Gerd Mueller ,  Regina Mueller-Mach ,  Grigoriy Basin ,  Robert West ,  Paul Martin ,  Tze-Sen Lim ,  Stefan Eberle

IPC: H01L29/201 ,  H01L21/02 ,  H01L29/22

CPC classification number: H01L33/505 ,  B29C41/14 ,  B29C41/20 ,  B29C41/22 ,  B29K2995/0031 ,  B29L2011/00 ,  H01L24/97 ,  H01L25/167 ,  H01L33/504 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/00012

Abstract: Overmolded lenses and certain fabrication techniques are described for LED structures. In one embodiment, thin YAG phosphor plates are formed and affixed over blue LEDs mounted on a submount wafer. A clear lens is then molded over each LED structure during a single molding process. The LEDs are then separated from the wafer. The molded lens may include red phosphor to generate a warmer white light. In another embodiment, the phosphor plates are first temporarily mounted on a backplate, and a lens containing a red phosphor is molded over the phosphor plates. The plates with overmolded lenses are removed from the backplate and affixed to the top of an energizing LED. A clear lens is then molded over each LED structure. The shape of the molded phosphor-loaded lenses may be designed to improve the color vs. angle uniformity. Multiple dies may be encapsulated by a single lens. In another embodiment, a prefabricated collimating lens is glued to the flat top of an overmolded lens.

Abstract translation: LED结构描述了包覆成型透镜和某些制造技术。 在一个实施例中，薄的YAG磷光体板被形成并固定在安装在底座晶片上的蓝色LED上。 然后在单个模制过程中在每个LED结构上模制透明透镜。 然后将LED从晶片分离。 模制的透镜可以包括红色磷光体以产生较暖的白光。 在另一个实施例中，荧光板首先临时安装在背板上，并且在荧光体板上模制含有红色荧光体的透镜。 具有二次模制的透镜的板从背板上移除并固定到通电LED的顶部。 然后在每个LED结构上模制透明透镜。 模制的含磷光体的透镜的形状可以被设计成改善颜色与角度均匀性。 多个管芯可以由单个透镜封装。 在另一个实施例中，将预制的准直透镜胶合到包覆成型透镜的平坦顶部。

公开(公告)号：US20070096130A1

公开(公告)日：2007-05-03

申请号：US11611775

申请日：2006-12-15

Applicant: Stefano Schiaffino ,  Daniel Steigerwald ,  Mari Holcomb ,  Grigoriy Basin ,  Paul Martin ,  John Epler

Inventor： Stefano Schiaffino ,  Daniel Steigerwald ,  Mari Holcomb ,  Grigoriy Basin ,  Paul Martin ,  John Epler

IPC: H01L33/00

CPC classification number: H01L33/0079 ,  H01L33/22 ,  H01L33/32 ,  H01L33/382 ,  H01L33/40 ,  H01L33/62 ,  H01L2224/73204 ,  H01L2924/01322 ,  H01L2924/00

Abstract: Described is a process for forming an LED structure using a laser lift-off process to remove the growth substrate (e.g., sapphire) after the LED die is bonded to a submount. The underside of the LED die has formed on it anode and cathode electrodes that are substantially in the same plane, where the electrodes cover at least 85% of the back surface of the LED structure. The submount has a corresponding layout of anode and cathode electrodes substantially in the same plane. The LED die electrodes and submount electrodes are ultrasonically welded together such that virtually the entire surface of the LED die is supported by the electrodes and submount. Other bonding techniques may also be used. No underfill is used. The growth substrate, forming the top of the LED structure, is then removed from the LED layers using a laser lift-off process. The extremely high pressures created during the laser lift-off process do not damage the LED layers due to the large area support of the LED layers by the electrodes and submount.

Abstract translation: 描述了在将LED管芯接合到基座之后，使用激光剥离工艺形成LED结构以去除生长衬底（例如，蓝宝石）的工艺。 LED芯片的下侧形成有基本上在同一平面中的阳极和阴极电极，其中电极覆盖LED结构的后表面的至少85％。 底座具有基本上在同一平面中的阳极和阴极电极的相应布局。 LED芯片电极和基座电极被超声波焊接在一起，使得LED芯片的整个表面几乎被电极和底座支撑。 也可以使用其它粘合技术。 没有使用底层填料。 然后使用激光剥离工艺从LED层去除形成LED结构顶部的生长衬底。 在激光剥离过程中产生的极高的压力不会由于电极和基座的LED层的大面积支撑而损坏LED层。

公开(公告)号：US20070045761A1

公开(公告)日：2007-03-01

申请号：US11212280

申请日：2005-08-26

Applicant: Grigoriy Basin ,  Paul Martin ,  Robert West ,  Yasumasa Morita ,  Tewe Heemstra

Inventor： Grigoriy Basin ,  Paul Martin ,  Robert West ,  Yasumasa Morita ,  Tewe Heemstra

IPC: H01L31/00

CPC classification number: H01L33/504 ,  H01L24/97 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2933/0041 ,  H01L2224/81

Abstract: A technique for forming a white light LED is disclosed. In one embodiment, the LED emits blue light. A first phosphor for producing red, yellow, yellow-green, or green light is formed to conformably coat the LED die. One suitable deposition technique is electrophoretic deposition (EPD). Over the resulting LED structure is deposited another phosphor (to add the remaining color component) in a binder (e.g., silicone) for encapsulating the die. The blue LED light combines with the two phosphor colors to create white light. Since the two different deposition techniques are independent and easily controllable, the resulting white light temperature is highly controllable and the color emission is substantially uniform.

Abstract translation: 公开了一种用于形成白光LED的技术。 在一个实施例中，LED发射蓝光。 形成产生红色，黄色，黄绿色或绿色光的第一荧光体以适形地涂覆LED管芯。 一种合适的沉积技术是电泳沉积（EPD）。 在所得到的LED结构之外，将另一种荧光体（以将剩余的颜色成分添加）沉积在用于封装模具的粘合剂（例如硅树脂）中。 蓝色LED灯与两种荧光粉相结合，产生白光。 由于两种不同的沉积技术是独立且易于控制的，所得到的白光温度是高度可控的，并且颜色发射基本上是均匀的。

公开(公告)号：US20060105485A1

公开(公告)日：2006-05-18

申请号：US11069418

申请日：2005-02-28

Applicant: Grigoriy Basin ,  Robert West ,  Paul Martin ,  Gerard Harbers ,  Willem Smits ,  Robert Hendriks ,  Frans Konijn

Inventor： Grigoriy Basin ,  Robert West ,  Paul Martin ,  Gerard Harbers ,  Willem Smits ,  Robert Hendriks ,  Frans Konijn

IPC: H01L21/00

CPC classification number: G02B19/0066 ,  G02B19/0028 ,  G02B19/0071 ,  H01L24/73 ,  H01L24/97 ,  H01L33/46 ,  H01L33/507 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/1815 ,  H01L2924/19107 ,  H05K3/284 ,  H05K2201/10106 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor, providing a special radiation pattern, having a different hardness value, or curable by a different technique (e.g., UV vs. heat).

Abstract translation: 一个或多个LED骰子安装在支撑结构上。 支撑结构可以是具有LED芯片的基座，其已经电连接到底座上的引线。 模具中的凹槽对应于支撑结构上的LED骰子的位置。 凹痕中填充有液体光学透明材料，例如硅树脂，其在固化时形成透镜材料。 压痕的形状将是镜片的形状。 模具和LED骰子/支撑结构被聚集在一起，使得每个LED管芯位于相关压痕内的液体硅胶内。 然后将模具加热以固化（硬化）硅树脂。 然后将模具和支撑结构分离，在每个LED管芯上留下完整的硅胶透镜。 可以用不同的模具重复该过模制过程以产生透镜的同心壳。 每个同心透镜可以具有不同的性质，例如包含荧光体，提供具有不同硬度值的特殊辐射图，或者可通过不同技术（例如，UV与热）固化。

公开(公告)号：US20060105484A1

公开(公告)日：2006-05-18

申请号：US10990208

申请日：2004-11-15

Applicant: Grigoriy Basin ,  Robert West ,  Paul Martin

Inventor： Grigoriy Basin ,  Robert West ,  Paul Martin

IPC: H01L21/00

CPC classification number: H01L33/52 ,  B29C33/0022 ,  B29C39/006 ,  B29C39/025 ,  B29C43/021 ,  B29C43/18 ,  B29L2011/0016 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0071 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01049 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor.

Abstract translation: 一个或多个LED骰子安装在支撑结构上。 支撑结构可以是具有LED芯片的基座，其已经电连接到底座上的引线。 模具中的凹槽对应于支撑结构上的LED骰子的位置。 凹痕中填充有液体光学透明材料，例如硅树脂，其在固化时形成透镜材料。 压痕的形状将是镜片的形状。 模具和LED骰子/支撑结构被聚集在一起，使得每个LED管芯位于相关压痕内的液体硅胶内。 然后将模具加热以固化（硬化）硅树脂。 然后将模具和支撑结构分离，在每个LED管芯上留下完整的硅胶透镜。 可以用不同的模具重复该过模制过程以产生透镜的同心壳。 每个同心透镜可以具有不同的性质，例如含有荧光体。