公开(公告)号：US5104944A

公开(公告)日：1992-04-14

申请号：US381627

申请日：1989-07-18

申请人： Martin J. Goldberg ,  Daniel P. Morris ,  Alfred Viehbeck

发明人： Martin J. Goldberg ,  Daniel P. Morris ,  Alfred Viehbeck

IPC分类号： C25B3/04 ,  C08G73/10 ,  C08G85/00 ,  G03F7/038 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38

CPC分类号： G03F7/0387 ,  C08G73/10 ,  C08G73/1007 ,  C08G85/00 ,  H05K1/0346 ,  H05K3/181 ,  H05K3/381

摘要： A process for the synthesis of derivatives of materials containing an imide group conjugated to an aromatic moiety to form an ester, a thioester, an amide, a ketone, and silylesters. Electrons are supplied to redox sites to form a reduced imide material. The reduced imide material is contacted with a nucleophile which opens the imide ring of the reduced imide and chemically combines with a carbonyl carbon atom of the open imide ring to form an imide derivative.

公开(公告)号：US06379865B1

公开(公告)日：2002-04-30

申请号：US09547390

申请日：2000-04-11

申请人： Guoping Mao ,  Hany B. Eitouni ,  Alphonsus V. Pocius ,  John B. Scheibner ,  Nanayakkara L. D. Somasiri ,  Nicholas A. Stacey ,  Alfred Viehbeck

发明人： Guoping Mao ,  Hany B. Eitouni ,  Alphonsus V. Pocius ,  John B. Scheibner ,  Nanayakkara L. D. Somasiri ,  Nicholas A. Stacey ,  Alfred Viehbeck

IPC分类号： G03F709

CPC分类号： C08G73/1007 ,  C08G73/1025 ,  G03F7/0387 ,  G03F7/164 ,  H05K3/287 ,  H05K2203/135 ,  Y10S430/136

摘要： A photoimageable, aqueous acid soluble polyimide polymer comprising an anhydride, including a substituted benzophenone nucleus, a diamine reacted with the anhydride to form a photosensitive polymer intermediate, and at least 60 Mole % of solubilizing amine reacted with the photosensitive polymer intermediate to form the photoimageable, aqueous acid soluble polyimide polymer. An emulsion for electrophoretic deposition of a coating of a photoimageable, aqueous acid soluble polyimide polymer comprises a dispersed phase, including the photoimageable aqueous acid soluble polyimide polymer, dissolved in an organic solvent and a dispersion phase including a coalescence promoter and water. The emulsion may be applied, by electrophoretic deposition, to a conductive structure to provide a photoimageable coating on the conductive structure. After exposing the coating to a pattern of radiation for photocrosslinking exposed parts of the photoimageable aqueous acid soluble polyimide polymer, an aqueous acid developer solution removes unexposed photoimageable aqueous acid soluble polyimide polymer to reveal a crosslinked polyimide polymer image of the radiation pattern.

摘要翻译： 包含酸酐的可光成像的含水酸性聚酰亚胺聚合物，包括取代的二苯甲酮核，与酸酐反应形成光敏聚合物中间体的二胺和至少60摩尔的增溶胺与感光性聚合物中间体反应形成可光成像 ，水溶性聚酰亚胺聚合物水溶液。 用于电泳沉积可光成像的含水酸性聚酰亚胺聚合物涂层的乳液包括溶解在有机溶剂中的分散相，包括可光成像的含水溶性聚酰亚胺聚合物，以及包含聚结促进剂和水的分散相。 可以通过电泳沉积将乳液施加到导电结构上，以在导电结构上提供可光成像的涂层。 在将涂层暴露于辐照图案之后，将可光成像的含水溶性聚酰亚胺聚合物的曝光部分光致交联，酸性显影剂水溶液除去未曝光的可光成像的酸性水溶性聚酰亚胺聚合物，以露出辐射图案的交联聚酰亚胺聚合物图像。

公开(公告)号：US5863447A

公开(公告)日：1999-01-26

申请号：US833612

申请日：1997-04-08

申请人： Paul William Coteus ,  Stephen Leo Tisdale ,  Alfred Viehbeck

发明人： Paul William Coteus ,  Stephen Leo Tisdale ,  Alfred Viehbeck

IPC分类号： H05K3/07 ,  H05K3/42 ,  H05K3/44 ,  B44C1/22

CPC分类号： H05K3/445 ,  H05K3/429 ,  H05K2201/09581 ,  H05K2201/09718 ,  H05K2201/09881 ,  H05K2203/0323 ,  H05K2203/1184 ,  H05K2203/135 ,  H05K2203/1438 ,  H05K3/07 ,  Y10T428/24917

摘要： This invention describes a new process for the selective isolation of through holes in the production of a multi-layer printed circuit card which allows for substantially smaller holes through reference layers to be built, leading to substantially better electrical isolation of signal traces on adjacent wiring layers, and for substantially improved current carrying capacity in the reference layers. This invention also describes a process to allow reference layers of different thickness from adjacent signal layers, even if they are part of the same `core`. Several different process flows are disclosed, leading to substantially the same structure but with varying degrees of complexity and quality of the finished product.

摘要翻译： 本发明描述了一种用于在制造多层印刷电路卡中选择性隔离通孔的新方法，其允许构建通过参考层的基本上较小的孔，从而导致相邻布线层上的信号迹线的显着更好的电绝缘 并且用于基准层中的大大改善的载流能力。 本发明还描述了允许来自相邻信号层的不同厚度的参考层的方法，即使它们是相同“核心”的一部分。 公开了几种不同的工艺流程，导致基本上相同的结构，但是具有不同程度的成品的复杂性和质量。

公开(公告)号：US5660921A

公开(公告)日：1997-08-26

申请号：US447350

申请日：1995-05-23

申请人： Kie Yeung Ahn ,  James Lupton Hedrick, Jr. ,  Jeffrey William Labadie ,  Kang-Wook Lee ,  Robert James Twieg ,  Alfred Viehbeck ,  George Frederick Walker

发明人： Kie Yeung Ahn ,  James Lupton Hedrick, Jr. ,  Jeffrey William Labadie ,  Kang-Wook Lee ,  Robert James Twieg ,  Alfred Viehbeck ,  George Frederick Walker

IPC分类号： C08G73/18 ,  C08L71/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L23/532 ,  H05K1/00 ,  H05K1/03 ,  B32B15/00 ,  B32B15/08

CPC分类号： H01L23/5329 ,  C08G73/18 ,  C08L71/00 ,  H01L23/293 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0346 ,  H05K3/4676 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T29/49171 ,  Y10T428/24917 ,  Y10T428/31605 ,  Y10T428/31721

摘要： A multilevel electronic package comprising at least two levels, each level including a poly(aryl ether benzimidazole), a polymide and copper. A process of preparing this package is disclosed. Several novel poly(aryl ether benzimidazoles) useful in preparing this package are also set forth.

摘要翻译： 包括至少两个级别的多级电子封装，每个级别包括聚（芳基醚苯并咪唑），聚酰亚胺和铜。 公开了制备该包装的过程。 还介绍了可用于制备该包装的几种新颖的聚（芳基醚苯并咪唑）。

公开(公告)号：US5569739A

公开(公告)日：1996-10-29

申请号：US197941

申请日：1994-02-17

申请人： Eleftherios Adamopoulos ,  Kang-Wook Lee ,  Terrence R. O'Toole ,  Sampath Purushothaman ,  Jane M. Shaw ,  Alfred Viehbeck ,  George F. Walker

发明人： Eleftherios Adamopoulos ,  Kang-Wook Lee ,  Terrence R. O'Toole ,  Sampath Purushothaman ,  Jane M. Shaw ,  Alfred Viehbeck ,  George F. Walker

IPC分类号： B32B7/10 ,  B32B15/08 ,  B32B15/088 ,  B32B27/00 ,  C08G73/00 ,  C08G73/10 ,  H01B3/30 ,  H01L21/52 ,  H05K1/03 ,  H05K3/46 ,  C08F8/34

CPC分类号： C08G73/1089 ,  C08G73/1003 ,  C08G73/1007 ,  C08G73/101 ,  H01B3/306 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721

摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer copper interface.

摘要翻译： 本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层 的末端不饱和粘合聚酰亚胺和聚酰亚胺。 接合操作。 还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。 新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。 本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物铜界面的铜扩散阻挡层。

公开(公告)号：US5548034A

公开(公告)日：1996-08-20

申请号：US923723

申请日：1992-07-31

申请人： Ali Afzali-Ardakani ,  Jeffrey T. Gotro ,  Jeffrey C. Hedrick ,  Konstantinos Papathomas ,  Niranjan M. Patel ,  Jane M. Shaw ,  Alfred Viehbeck

发明人： Ali Afzali-Ardakani ,  Jeffrey T. Gotro ,  Jeffrey C. Hedrick ,  Konstantinos Papathomas ,  Niranjan M. Patel ,  Jane M. Shaw ,  Alfred Viehbeck

IPC分类号： B32B27/06 ,  C08G65/40 ,  C08G73/06 ,  C08G75/00 ,  C08G75/20 ,  C08G79/02 ,  C08G79/04 ,  C08J5/24 ,  C08L79/04 ,  C08L101/00 ,  C08L101/02 ,  C08L101/04 ,  H05K1/03 ,  C08G65/48

CPC分类号： C08L79/04 ,  H05K1/0373 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T442/2902 ,  Y10T442/2992 ,  Y10T442/3423 ,  Y10T442/3431 ,  Y10T442/3569 ,  Y10T442/656 ,  Y10T442/671

摘要： A curable material comprising a blend of a fluorine-containing cyanate and a fluorine-containing poly(arylene ether) wherein said cyanate is a monomer having the structureN.ident.C--O--R--.sub.n --O--C.ident.Nsaid fluorine containing poly(arylene ether) has the structureX--R--.sub.m --Xwherein X is any group capable of reacting with a --C.ident.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100;said material being heat-curable at a temperatures between 180.degree. and 325.degree. C.;said material in the cured state comprising a fluorine-containing polycyanurate network having a plurality of discrete phases of said fluorine-containing thermoplastic polymer dispersed therein wherein said thermoplastic polymer phases are of submicron size.

摘要翻译： 一种包含含氟氰酸酯和含氟聚（亚芳基醚）的共混物的可固化材料，其中所述氰酸酯是具有结构N = CORnOC = N含氟聚（亚芳基醚）的单体，其结构为X-Rm-X，其中X 是能够与-C = N组反应的任何基团; R是可以是或不是氟取代的脂族或芳族基团; R1是脂族或芳族基团，其可以是或不是氟取代的，或者R1选自醚，羰基，砜，氧化膦和硫化物，并且R或R 1中的至少一个必须是氟取代的; n为0-10; m为0-100; 所述材料在180至325℃的温度下是可热固化的; 所述固化状态的材料包括含氟聚氰化酸盐网络，其中分散有所述含氟热塑性聚合物的多个离散相，其中所述热塑性聚合物相具有亚微米尺寸。

公开(公告)号：US5527592A

公开(公告)日：1996-06-18

申请号：US344454

申请日：1994-11-23

申请人： Ali Afzali-Ardakani ,  Jeffrey T. Gotro ,  Jeffrey C. Hedrick ,  Konstantinos Papathomas ,  Niranjan M. Patel ,  Jane M. Shaw ,  Alfred Viehbeck

发明人： Ali Afzali-Ardakani ,  Jeffrey T. Gotro ,  Jeffrey C. Hedrick ,  Konstantinos Papathomas ,  Niranjan M. Patel ,  Jane M. Shaw ,  Alfred Viehbeck

IPC分类号： B32B27/06 ,  C08G65/40 ,  C08G73/06 ,  C08G75/00 ,  C08G75/20 ,  C08G79/02 ,  C08G79/04 ,  C08J5/24 ,  C08L79/04 ,  C08L101/00 ,  C08L101/02 ,  C08L101/04 ,  H05K1/03 ,  B32B3/00

CPC分类号： C08L79/04 ,  H05K1/0373 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T442/2902 ,  Y10T442/2992 ,  Y10T442/3423 ,  Y10T442/3431 ,  Y10T442/3569 ,  Y10T442/656 ,  Y10T442/671

摘要： An electronic circuit package comprising an electrically conductive circuit layer on a polymer, ceramic or multi-layer substrate wherein a curable dielectric material is applied over the electrically conductive circuit layer. The curable dielectric material comprises a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structureN.tbd.C--O--R--[R.sup.1 ].sub.n --O--C.tbd.Nand the fluorine containing arylene ether polymer has the structureX--R--[R.sup.1 ].sub.m --Xwherein X is any group capable of reacting with a --C.tbd.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100.The dielectric material in the cured state comprises a fluorine-containing polycyanurate network having a plurality of discrete phases of the fluorine-containing thermoplastic polymer dispersed therein. The thermoplastic polymer phases are of submicron size.

摘要翻译： 一种电子电路封装，包括在聚合物，陶瓷或多层基底上的导电电路层，其中可固化介电材料施加在导电电路层上。 可固化电介质材料包括含氟氰酸酯和含氟亚芳基醚聚合物的共混物。 氰酸酯是具有结构N 3BOND C-O-R- [R 1] n -O-C 3 N N的单体，含氟亚芳基醚聚合物具有X-R- [R 1] m -X的结构，其中X是可与-C 3 N N基反应的基团; R是可以是或不是氟取代的脂族或芳族基团; R1是脂族或芳族基团，其可以是或不是氟取代的，或者R1选自醚，羰基，砜，氧化膦和硫化物，并且R或R 1中的至少一个必须是氟取代的; n为0-10; m为0-100。 固化状态下的电介质材料含有分散在其中的含氟热塑性聚合物的多个离散相的含氟聚氰脲酸酯网络。 热塑性聚合物相具有亚微米尺寸。

公开(公告)号：US5527566A

公开(公告)日：1996-06-18

申请号：US414140

申请日：1995-03-30

申请人： Mark J. Schadt ,  Alfred Viehbeck

发明人： Mark J. Schadt ,  Alfred Viehbeck

IPC分类号： H01L21/302 ,  C08J7/12 ,  C23C18/20 ,  C23C18/22 ,  H01L21/3065 ,  H01L21/324 ,  H05H1/00 ,  H05K3/18 ,  H05K3/38

CPC分类号： C08J7/123 ,  C08J7/12 ,  C23C18/22 ,  H05K3/181 ,  H05K3/381

摘要： A polymeric substrate is exposed to an oxygen containing plasma; and then exposed to a reducing atmosphere at an elevated temperature. The reducing treatment reverses the effects on the polymer surface chemistry imparted by action of the oxidizing plasma. In this manner, the original electroactive properties of certain polymers are regenerated at the surface.

摘要翻译： 将聚合物基质暴露于含氧等离子体; 然后在升高的温度下暴露于还原气氛中。 还原处理反转了对通过氧化等离子体的作用赋予的聚合物表面化学性质的影响。 以这种方式，某些聚合物的原始电活性在表面再生。

公开(公告)号：US5523148A

公开(公告)日：1996-06-04

申请号：US344475

申请日：1994-11-23

申请人： Ali Afzali-Ardakani ,  Jeffrey T. Gotro ,  Jeffrey C. Hedrick ,  Konstantinos Papathomas ,  Niranjan M. Patel ,  Jane M. Shaw ,  Alfred Viehbeck

发明人： Ali Afzali-Ardakani ,  Jeffrey T. Gotro ,  Jeffrey C. Hedrick ,  Konstantinos Papathomas ,  Niranjan M. Patel ,  Jane M. Shaw ,  Alfred Viehbeck

IPC分类号： B32B27/06 ,  C08G65/40 ,  C08G73/06 ,  C08G75/00 ,  C08G75/20 ,  C08G79/02 ,  C08G79/04 ,  C08J5/24 ,  C08L79/04 ,  C08L101/00 ,  C08L101/02 ,  C08L101/04 ,  H05K1/03 ,  B32B7/00

CPC分类号： C08L79/04 ,  H05K1/0373 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T442/2902 ,  Y10T442/2992 ,  Y10T442/3423 ,  Y10T442/3431 ,  Y10T442/3569 ,  Y10T442/656 ,  Y10T442/671

摘要： A prepreg which is heat curable within a temperature range of between about 200.degree. C. and 325.degree. C. comprising a reinforcing material impregnated with a curable material said curable material comprising a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer wherein said cyanate is a monomer having the structureN.tbd.C--O--R--[R.sup.1 ].sub.n --O--C.tbd.Nsaid fluorine containing arylene ether polymer has the structureX--R--[R.sup.1 ].sub.m --Xwherein X is any group capable of reacting with a --C.tbd.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100;said material in the cured state comprising a fluorine-containing polycyanurate network having a plurality of discrete phases of said fluorine-containing thermoplastic polymer dispersed therein wherein said thermoplastic polymer phases are of submicron size.

摘要翻译： 一种在约200℃至325℃的温度范围内可热固化的预浸料，包括浸渍有可固化材料的增强材料，所述可固化材料包含含氟氰酸酯和含氟亚芳基醚的共混物 聚合物，其中所述氰酸酯是具有结构N的化合物，其中X是任何能够与-C 3 N N基团反应的基团， ; R是可以是或不是氟取代的脂族或芳族基团; R1是脂族或芳族基团，其可以是或不是氟取代的，或者R1选自醚，羰基，砜，氧化膦和硫化物，并且R或R 1中的至少一个必须是氟取代的; n为0-10; m为0-100; 所述固化状态的材料包括含氟聚氰化酸盐网络，其中分散有所述含氟热塑性聚合物的多个离散相，其中所述热塑性聚合物相具有亚微米尺寸。

公开(公告)号：US5519193A

公开(公告)日：1996-05-21

申请号：US966960

申请日：1992-10-27

申请人： Peter E. Freiermuth ,  Kathleen S. Ginn ,  Jeffrey A. Haley ,  Susan J. Lamaire ,  David A. Lewis ,  Gavin T. Mills ,  Timothy A. Redmond ,  Yuk L. Tsang ,  Joseph J. Van Horn ,  Alfred Viehbeck ,  George F. Walker ,  Jer-Ming Yang ,  Clarence S. Long

发明人： Peter E. Freiermuth ,  Kathleen S. Ginn ,  Jeffrey A. Haley ,  Susan J. Lamaire ,  David A. Lewis ,  Gavin T. Mills ,  Timothy A. Redmond ,  Yuk L. Tsang ,  Joseph J. Van Horn ,  Alfred Viehbeck ,  George F. Walker ,  Jer-Ming Yang ,  Clarence S. Long

IPC分类号： G01R31/26 ,  G01R31/28 ,  G01R31/311 ,  H01L21/265 ,  H01L21/268 ,  H01L21/326 ,  H01L21/329 ,  H05B6/80

CPC分类号： G01R31/2881 ,  G01R31/311 ,  Y10S148/071

摘要： The described invention is directed to microwave methods for burning-in, electrical stressing, thermal stressing and reducing rectifying junction leakage current in fully processed semiconductor chips individually and at wafer level, as well as burning in and stressing semiconductor chip packaging substrates and the combination of a semiconductor chip mounted onto a semiconductor chip packaging substrate. Microwaves burn-in devices in a substantially shorter period of time than conventional burn-in techniques and avoid the need for special workpiece holders which are required by conventional stress and burn-in techniques. Additionally, microwave methods are described for reducing the leakage current of recitfying junctions, such as PN junctions and Schottky barrier diode junctions of semiconductor devices on fully processed semiconductor chips and wafers.

摘要翻译： 所描述的发明涉及在半导体芯片单独和晶圆级别的烧结，电应力，热应力和减少整流结漏电流的微波方法，以及对半导体芯片封装衬底的燃烧和应力的组合 安装在半导体芯片封装基板上的半导体芯片。 微波老化装置在比传统的老化技术更短的时间内，并且避免了对于常规应力和老化技术所要求的特殊工件支架的需要。 此外，描述了微波方法，用于减少重新连接的漏电流，例如半导体器件在完全处理的半导体芯片和晶片上的PN结和肖特基势垒二极管接头。