公开(公告)号：US20090121335A1

公开(公告)日：2009-05-14

申请号：US11938371

申请日：2007-11-12

申请人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Abelardo Jr. Advincula ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Abelardo Jr. Advincula ,  Lionel Chien Hui Tay

IPC分类号： H01L23/02

CPC分类号： H01L25/03 ,  H01L21/561 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05553 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/14 ,  H01L2924/1515 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit package system comprising: providing a substrate having a cavity; sealing a package over the cavity of the substrate; and forming an encapsulant over the package and a portion of the substrate substantially preventing the encapsulant from forming in the cavity.

摘要翻译： 一种集成电路封装系统，包括：提供具有空腔的衬底; 将封装密封在衬底的空腔上; 以及在所述封装上形成密封剂，并且所述衬底的一部分基本上防止所述密封剂在所述空腔中形成。

公开(公告)号：US20090072364A1

公开(公告)日：2009-03-19

申请号：US11854989

申请日：2007-09-13

申请人： Jeffrey D. Punzalan ,  Jairus Legaspi Pisigan ,  Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho

发明人： Jeffrey D. Punzalan ,  Jairus Legaspi Pisigan ,  Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/495

CPC分类号： H01L23/49503 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An integrated circuit package system is provided including forming a leadframe having a frame and a die paddle having leads thereon. The leads are held with respect to the die paddle. The leads are separated from the die paddle, and a die is attached to the die paddle. Bond wires are bonded between the leads and the die. The die and bond wires are encapsulated. The leadframe is singulated to separate the frame and the die paddle.

摘要翻译： 提供了一种集成电路封装系统，包括形成具有框架的引线框架和在其上具有引线的管芯焊盘。 导线相对于芯片被保持。 引线与管芯分离，并且管芯附接到管芯焊盘。 接合线结合在引线和芯片之间。 管芯和接合线被封装。 引导框架被单独分离框架和模具桨。

公开(公告)号：US20120241983A1

公开(公告)日：2012-09-27

申请号：US13052816

申请日：2011-03-21

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/3107 ,  H01L23/3135 ,  H01L23/49541 ,  H01L23/49575 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2225/06586 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a lead; placing an integrated circuit device, having an external connector, adjacent to and electrically isolated from the lead; mounting an integrated circuit over the lead and the integrated circuit device with the integrated circuit electrically isolated from the integrated circuit device; and forming a package encapsulation, having an encapsulation base, over the lead, the integrated circuit, and the integrated circuit device with the lead and the external connector exposed from the encapsulation base.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供引线; 将具有外部连接器的集成电路器件放置在与引线相邻并与之电隔离的位置; 将集成电路安装在引线和集成电路器件上，使集成电路与集成电路器件电隔离; 以及在所述引线，所述集成电路和所述集成电路器件之间形成具有封装基底的封装封装，所述引线和所述外部连接器从所述封装基座暴露。

公开(公告)号：US20100078831A1

公开(公告)日：2010-04-01

申请号：US12239707

申请日：2008-09-26

申请人： Jairus Legaspi Pisigan ,  Zigmund Ramirez Camacho ,  Henry Descalzo Bathan

发明人： Jairus Legaspi Pisigan ,  Zigmund Ramirez Camacho ,  Henry Descalzo Bathan

IPC分类号： H01L23/28 ,  H01L21/00

CPC分类号： H01L23/3107 ,  H01L21/568 ,  H01L23/24 ,  H01L24/48 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: providing a die attach pad; forming a package contact pad adjacent the die attach pad; attaching an integrated circuit over the die attach pad; attaching a die connector to the integrated circuit and the package contact pad; and forming an encapsulant over the die connector and the integrated circuit, the encapsulant having an encapsulant edge from a sawless singulation process.

摘要翻译： 集成电路封装系统包括：提供管芯附接垫; 形成邻近管芯附接垫的封装接触垫; 将集成电路连接在芯片附着垫上; 将管芯连接器附接到集成电路和封装接触焊盘; 以及在所述管芯连接器和所述集成电路上形成密封剂，所述密封剂具有来自无锯末切割工艺的密封剂边缘。

公开(公告)号：US20110140287A1

公开(公告)日：2011-06-16

申请号：US12637746

申请日：2009-12-14

申请人： Henry Descalzo Bathan ,  Jairus Legaspi Pisigan ,  Zigmund Ramirez Camacho

发明人： Henry Descalzo Bathan ,  Jairus Legaspi Pisigan ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/49 ,  H01L21/60

CPC分类号： H01L24/06 ,  H01L23/49838 ,  H01L24/28 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a device over a substrate including a bond wire pad row located between a perimeter of the substrate and the device; configuring the bond wire pad row to include three sided bond wire pads that horizontally overlap; and forming an interconnection between the device and the bond wire pad row.

摘要翻译： 一种集成电路封装系统的制造方法，包括：在衬底上形成器件，该衬底包括位于衬底周边与器件之间的接合线焊盘排; 配置接合线焊盘行包括水平重叠的三面接合线焊盘; 以及在所述器件和所述接合线焊盘排之间形成互连。

公开(公告)号：US20110127661A1

公开(公告)日：2011-06-02

申请号：US12629879

申请日：2009-12-02

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Jairus Legaspi Pisigan

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Jairus Legaspi Pisigan

IPC分类号： H01L23/52 ,  H01L21/98

CPC分类号： H01L23/3107 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/1011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming external interconnects having bases of a first thickness and tips of a second thickness extending inwardly directly toward each other; connecting a first circuit device between the tips; attaching a second circuit device to the first circuit device with a combined thickness of the first circuit device and the second circuit device less than the first thickness; and forming an encapsulation of the first thickness between the bases and over the tips.

摘要翻译： 一种制造集成电路封装系统的方法包括：形成具有第一厚度的底部和具有向内彼此向内延伸的第二厚度的尖端的外部互连; 在尖端之间连接第一电路装置; 将所述第一电路装置和所述第二电路装置的组合厚度小于所述第一厚度的第二电路装置附接到所述第一电路装置; 以及在基底之间和尖端上形成第一厚度的封装。

公开(公告)号：US07691674B1

公开(公告)日：2010-04-06

申请号：US12488557

申请日：2009-06-20

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan

IPC分类号： H01L21/44 ,  H01L23/02

CPC分类号： H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/37599 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/8485 ,  H01L2224/92127 ,  H01L2224/92242 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a first lead, having a first body and a first tip, and a paddle, having a protrusion at a side of the paddle, with the first body adjacent to the protrusion; forming a second lead having a second body and a second tip adjacent to the paddle; attaching a device, having a device active side, to the paddle and adjacent to the protrusion; mounting a component, having a component active side, to the device with the component active side facing the device active side and between the second body and the first tip; connecting the component and the second body; and forming an encapsulation covering the device, and partially covering the paddle, the component, the first lead, and the second lead.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成具有第一主体和第一端头的第一引线以及在所述桨的一侧具有突起的桨，所述第一主体与所述突起相邻; 形成具有第二主体和邻近所述桨的第二末端的第二引线; 将具有装置活动侧的装置附接到所述桨并且邻近所述突起; 将具有部件活动侧的部件安装到所述装置，其中所述部件活动侧面向所述装置主动侧，并且在所述第二主体和所述第一末端之间; 连接部件和第二主体; 以及形成覆盖所述装置的封装，以及部分覆盖所述板，所述部件，所述第一引线和所述第二引线。

公开(公告)号：US08652881B2

公开(公告)日：2014-02-18

申请号：US12235288

申请日：2008-09-22

申请人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Henry Descalzo Bathan

IPC分类号： H01L21/44 ,  H01L23/28

CPC分类号： H01L21/4832 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3142 ,  H01L24/48 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/18165 ,  H01L2924/18301 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: forming an anti-peel pad having both a concave ring and an external terminal with the concave ring, having a peripheral wall, surrounding the external terminal; connecting an integrated circuit with the anti-peel pad; and forming an encapsulation over the integrated circuit, the concave ring, and the external terminal with the encapsulation under the peripheral wall.

摘要翻译： 一种集成电路封装系统，包括：形成具有凹环的外部端子的包含凹环和外部端子的抗剥离垫，具有周壁; 将集成电路与抗剥离垫连接起来; 以及在集成电路，凹环和外部端子之间形成封装，封装在外围壁下。

公开(公告)号：US08106499B2

公开(公告)日：2012-01-31

申请号：US12488555

申请日：2009-06-20

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Jairus Legaspi Pisigan

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Jairus Legaspi Pisigan

IPC分类号： H01L23/02 ,  H01L23/34 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H01L21/50 ,  H01L21/48

CPC分类号： H01L23/5389 ,  H01L23/3128 ,  H01L23/5385 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base substrate having a base conductive material on opposite sides of the base substrate; connecting an internal interconnect having a substantially spherical shape on the base substrate; forming a top substrate having a top conductive material on opposite sides of the top substrate with an upper component thereon facing the base substrate; and attaching the top substrate on the internal interconnect.

摘要翻译： 一种集成电路封装系统的制造方法，包括：在所述基底基板的相对侧设置具有基底导电材料的基底基板; 在基底基板上连接具有大致球形的内部互连; 在顶部衬底的相对侧上形成具有顶部导电材料的顶部衬底，其上部组件面向衬底; 并将顶部衬底附接在内部互连上。

公开(公告)号：US08067825B2

公开(公告)日：2011-11-29

申请号：US11863700

申请日：2007-09-28

申请人： Abelardo Jr. Hadap Advincula ,  Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Jairus Legaspi Pisigan

发明人： Abelardo Jr. Hadap Advincula ,  Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Jairus Legaspi Pisigan

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/49503 ,  H01L24/28 ,  H01L24/29 ,  H01L24/31 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/29288 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes providing die; forming leads adjacent the die; forming a die paddle adjacent the leads with the die thereover; and forming a cavity for isolating one of the die and a die attach segment of the die paddle.

摘要翻译： 集成电路封装系统包括提供裸片; 在模具附近形成引线; 在其上与模具形成邻近引线的芯片; 以及形成用于隔离所述管芯和所述管芯焊盘的管芯附接部分中的一个的腔。