公开(公告)号：US10850973B2

公开(公告)日：2020-12-01

申请号：US16698535

申请日：2019-11-27

申请人： INVENSENSE, INC.

发明人： Michael Daneman ,  Martin Lim ,  Kegang Huang ,  Igor Tchertkov

IPC分类号： B81B7/02 ,  B81C1/00

摘要： A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.

公开(公告)号：US10598621B2

公开(公告)日：2020-03-24

申请号：US15484864

申请日：2017-04-11

申请人： INVENSENSE, INC.

发明人： Fang Liu ,  Peter Hartwell ,  Martin Lim ,  Yushi Yang

IPC分类号： G01N27/04 ,  G01N33/00 ,  G01N27/18 ,  G01N27/12

摘要： The present invention relates to systems and methods for detecting gases in an environment using chemical and thermal sensing. In one embodiment, a method includes exposing a chemiresistor embedded within a sensor pixel to a gas in an environment; setting a heater embedded within the sensor pixel to a sensing temperature, the sensing temperature being greater than room temperature; measuring an electrical resistance of the chemiresistor in response to setting the heater to the sensing temperature; and in response to a difference between the electrical resistance of the chemiresistor and a reference electrical resistance being less than a threshold, supplying a fixed power input to the heater embedded within the sensor pixel and measuring a temperature of the sensor pixel relative to a reference temperature.

公开(公告)号：US10221065B2

公开(公告)日：2019-03-05

申请号：US15461270

申请日：2017-03-16

申请人： INVENSENSE, INC.

发明人： Daesung Lee ,  Jongwoo Shin ,  Jong Il Shin ,  Peter Smeys ,  Martin Lim

IPC分类号： H01L23/02 ,  B81C1/00 ,  B81B7/00 ,  B81B7/02

摘要： An integrated MEMS device comprises two substrates where the first and second substrates are coupled together and have two enclosures there between. One of the first and second substrates includes an outgassing source layer and an outgassing barrier layer to adjust pressure within the two enclosures. The method includes depositing and patterning an outgassing source layer and a first outgassing barrier layer on the substrate, resulting in two cross-sections. In one of the two cross-sections a top surface of the outgassing source layer is not covered by the outgassing barrier layer and in the other of the two cross-sections the outgassing source layer is encapsulated in the outgassing barrier layer. The method also includes depositing conformally a second outgassing barrier layer and etching the second outgassing barrier layer such that a spacer of the second outgassing barrier layer is left on sidewalls of the outgassing source layer.

公开(公告)号：US10160635B2

公开(公告)日：2018-12-25

申请号：US15477202

申请日：2017-04-03

申请人： INVENSENSE, INC.

发明人： Michael J. Daneman ,  Martin Lim ,  Xiang Li ,  Li-Wen Hung

IPC分类号： H01L29/84 ,  B81B3/00 ,  B81C3/00

摘要： MEMS device for low resistance applications are disclosed. In a first aspect, the MEMS device comprises a MEMS wafer including a handle wafer with one or more cavities containing a first surface and a second surface and an insulating layer deposited on the second surface of the handle wafer. The MEMS device also includes a device layer having a third and fourth surface, the third surface bonded to the insulating layer of the second surface of handle wafer; and a metal conductive layer on the fourth surface. The MEMS device also includes CMOS wafer bonded to the MEMS wafer. The CMOS wafer includes at least one metal electrode, such that an electrical connection is formed between the at least one metal electrode and at least a portion of the metal conductive layer.

公开(公告)号：US20180292338A1

公开(公告)日：2018-10-11

申请号：US15484864

申请日：2017-04-11

申请人： INVENSENSE, INC.

发明人： Fang Liu ,  Peter Hartwell ,  Martin Lim ,  Yushi Yang

IPC分类号： G01N27/04 ,  G01N33/00

摘要： The present invention relates to systems and methods for detecting gases in an environment using chemical and thermal sensing. In one embodiment, a method includes exposing a chemiresistor embedded within a sensor pixel to a gas in an environment; setting a heater embedded within the sensor pixel to a sensing temperature, the sensing temperature being greater than room temperature; measuring an electrical resistance of the chemiresistor in response to setting the heater to the sensing temperature; and in response to a difference between the electrical resistance of the chemiresistor and a reference electrical resistance being less than a threshold, supplying a fixed power input to the heater embedded within the sensor pixel and measuring a temperature of the sensor pixel relative to a reference temperature.

公开(公告)号：US09809448B2

公开(公告)日：2017-11-07

申请号：US14618251

申请日：2015-02-10

申请人： INVENSENSE, INC.

发明人： Martin Lim ,  Fariborz Assaderaghi

IPC分类号： H01L29/82 ,  B81B7/00 ,  G01L23/12 ,  H04R19/00 ,  B81B7/02

CPC分类号： B81B7/0061 ,  B81B7/02 ,  B81B2201/025 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2207/012 ,  G01L23/125 ,  H04R19/005

摘要： A micro electro-mechanical system (MEMS) device is provided. The MEMS device includes: a substrate having a first surface and a second surface and wherein the first surface is exposed to an environment outside the MEMS device; and a MEMS microphone disposed at a first location on the second surface of the substrate and having a diaphragm positioned such that acoustic waves received at the MEMS microphone are incident on the diaphragm. The MEMS device also includes: a first integrated circuit disposed at a second location of the substrate, wherein the first integrated circuit is electrically coupled to the MEMS microphone; and a MEMS measurement device at a third location, wherein the MEMS measurement device comprises a motion sensor and a pressure sensor.

公开(公告)号：US09802815B2

公开(公告)日：2017-10-31

申请号：US14957562

申请日：2015-12-02

申请人： Invensense, Inc.

发明人： Michael Julian Daneman ,  Mei-Lin Chan ,  Martin Lim ,  Fariboz Assaderaghi ,  Erhan Polatkan Ata

IPC分类号： H01L21/33 ,  B81C1/00

CPC分类号： B81C1/00246 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/012 ,  B81C1/00158 ,  B81C2201/112 ,  B81C2203/0118 ,  B81C2203/0742 ,  B81C2203/0792 ,  H01L2224/83805

摘要： A method for fabricating a MEMS device includes depositing and patterning a first sacrificial layer onto a silicon substrate, the first sacrificial layer being partially removed leaving a first remaining oxide. Further, the method includes depositing a conductive structure layer onto the silicon substrate, the conductive structure layer making physical contact with at least a portion of the silicon substrate. Further, a second sacrificial layer is formed on top of the conductive structure layer. Patterning and etching of the silicon substrate is performed stopping at the second sacrificial layer. Additionally, the MEMS substrate is bonded to a CMOS wafer, the CMOS wafer having formed thereupon a metal layer. An electrical connection is formed between the MEMS substrate and the metal layer.

公开(公告)号：US09796580B2

公开(公告)日：2017-10-24

申请号：US14738745

申请日：2015-06-12

申请人： InvenSense, Inc.

发明人： Peter Smeys ,  Martin Lim

IPC分类号： B81B7/00

CPC分类号： B81B7/007 ,  B81B2201/0207 ,  B81B2201/0214 ,  B81B2201/0228 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2201/0278 ,  B81B2203/0315 ,  B81B2207/012 ,  B81C1/00238 ,  B81C2203/0785 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A sensor chip combining a substrate comprising at least one CMOS circuit, a MEMS substrate and another substrate comprising at least one CMOS circuit in one package that is vertically stacked is disclosed. The package comprises a sensor chip further comprising a first substrate with a first surface and a second surface comprising at least one CMOS circuit; a MEMS substrate with a first surface and a second surface; and a second substrate comprising at least one CMOS circuit. Where the first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the MEMS substrate. The second surface of the MEMS substrate is attached to the second substrate. The first substrate, the MEMS substrate, the second substrate and the packaging substrate are mechanically attached and provided with electrical inter-connects.

公开(公告)号：US09738512B2

公开(公告)日：2017-08-22

申请号：US14603185

申请日：2015-01-22

申请人： InvenSense, Inc.

发明人： Daesung Lee ,  Jongwoo Shin ,  Jong Il Shin ,  Peter Smeys ,  Martin Lim

IPC分类号： H01L23/02 ,  H01L21/54 ,  B81C1/00 ,  B81B7/00 ,  B81B7/02

CPC分类号： B81C1/0023 ,  B81B7/0038 ,  B81B7/0041 ,  B81B7/02 ,  B81B2201/0228 ,  B81B2207/017 ,  B81C1/00285 ,  B81C2203/019 ,  B81C2203/035 ,  B81C2203/0785

摘要： An integrated MEMS device comprises two substrates where the first and second substrates are coupled together and have two enclosures there between. One of the first and second substrates includes an outgassing source layer and an outgassing barrier layer to adjust pressure within the two enclosures. The method includes depositing and patterning an outgassing source layer and a first outgassing barrier layer on the substrate, resulting in two cross-sections. In one of the two cross-sections a top surface of the outgassing source layer is not covered by the outgassing barrier layer and in the other of the two cross-sections the outgassing source layer is encapsulated in the outgassing barrier layer. The method also includes depositing conformally a second outgassing barrier layer and etching the second outgassing barrier layer such that a spacer of the second outgassing barrier layer is left on sidewalls of the outgassing source layer.

公开(公告)号：US20170190571A1

公开(公告)日：2017-07-06

申请号：US15468066

申请日：2017-03-23

申请人： INVENSENSE, Inc.

发明人： Julius Ming-Lin Tsai ,  Baris Cagdaser ,  Martin Lim ,  Aleksey S. Khenkin

IPC分类号： B81B7/02 ,  H04R1/04 ,  H04R29/00 ,  B81C1/00

CPC分类号： B81B7/02 ,  B81B2201/0214 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/0023 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/16152 ,  H04R1/04 ,  H04R19/04 ,  H04R29/004 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00

摘要： An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.