摘要:
A CAM device that utilizes a portion of a desired content as a row address is provided. A row in a CAM memory array is accessed using the row address portion of the desired content. The remaining portion of the desired content is used as a key data tag for comparison with content stored within memory locations of the addressed row. This way, the CAM device does not have to sequentially access each row in the memory array to locate memory cells having the desired content. The CAM can comprise a standard DRAM memory array, sense amplifiers and compare logic located in the sense amplifiers. Alternatively, the CAM device can comprise a standard SRAM memory array and associated compare logic. By accessing the CAM device using a portion of the desired content as a row address, the CAM device can perform a high speed search while also reducing the complexity of the CAM circuitry.
摘要:
An integrated circuit structure and process relating to a self-aligned window at the recessed junction of two insulating regions formed on the surface of a semiconductor body. The window may include a trench forming an isolation region between doped semiconductor regions, or may include an electrical conductor connected to a doped semiconductor region, or may include an electrical conductor separated from doped semiconductor regions by an electrical insulator. Embodiments include, but are not limited to, a field-effect transistor, a tunnelling area for a floating gate transistor, and an electrical connection to a doped area of the substrate.
摘要:
A semiconductor dynamic read/write memory device contains an array of rows and columns of one-transistor memory cells, with a differential sense amplifier for each column of cells. The sense amplifier has a pair of balanced bit lines extending from its inputs, in a quasi-folded bit line configuration. The memory cells are not directly connected to the bit lines, but instead are coupled to bit line segments. The row address selects a cell to be connected to a segment, and also selects one of the two segments to be connected to one of the two bit lines. Instead of being interleaved one-for-one, the word lines for cells to be connected to the two bit lines are in groups one group for each segment line; the groups are interleaved. The combined segment line and bit line capacitance has a more favorable ratio to the storage capacitance, compared to the one-for-one interleaved layout.
摘要:
An improved method of making a semiconductor device such as an N-channel, double level poly, MOS read only memory or ROM array is provided; the array is of very dense structure and may be electrically programmable by floating gates which are interposed between the gate oxide and control gates formed by polycrystalline silicon or metal row address lines. The electrical programming of the cells is accomplished by applying selected voltages to the source, drain, control gate and substrate. The very dense array results from a simplified manufacturing process generally compatible with standard N-channel silicon gate technology. Parallel strips of gate oxide, polycrystalline silicon, and nitride (functioning as an oxidation mask) are created in one mask step before field oxide is grown, then a perpendicular pattern of conductive strips is etched using a second mask step.
摘要:
A dynamic read/write memory cell of the one transistor type is made by a single-level polysilicon process in which the word lines and the gates of the access transistors are formed by the metal strips. No metal-to-silicon or metal-to-polysilicon contacts are needed. The access transistors are made by etching through polysilicon strips which are the capacitor bias plates. The size of the transistor is not determined by alignment accuracy.
摘要:
A memory system for a digital processor device having a 16-bit bidirectional bus with multiplexed addresses and data employs separate memory devices for the high order and low order data bytes. When less than 64K words of memory are used, there are unused address lines in the bus. A microcomputer may use memory devices partitioned 4K.times.8, needing 12 address pins. Both devices are constructed the same, but one accesses the low order byte and the other the high order byte under control of a single byte-select terminal. Mapping of the bus to memory device connections and internal connection of unused pins to address inputs or data input/output lines within the memory devices, along with the byte-select function, allow a single type of device to function in either position.
摘要:
A floating gate type electrically programmable memory device is made by an N-channel double-level polysilicon self-aligned process which results in a very dense array. The programming inefficiency caused by inherent resistance of elongated diffused regions used as column lines is overcome by a capacitive discharge programming method. Distributed capacitance of the column lines is charged to the programming voltage before the selected row line is brought to a high voltage, producing a pulse of current through the cell. A series of these programming pulses may be used.
摘要:
A contact programmable, small cell area MOS read only memory or ROM is formed by a process compatible with standard N-channel silicon gate manufacturing methods. Address lines are metal, gates are second level polysilicon, and output and ground lines are defined by elongated N+ regions. Each potential MOS transistor in the array is programmed to be a logic "1" or "0", by presence or absence of a contact engaging the polysilicon gate over the thin gate oxide.
摘要:
An N-channel double level poly, MOS read only memory or ROM array is electrically programmable by floating gates which are interposed between the gate oxide and control gates formed by polycrystalline silicon row address lines. The cells may be electrically programmed by applying selected voltages to the source, drain, control gate and substrate. A very dense array is obtained by a simplified manufacturing process which is generally compatible with standard N-channel silicon gate technology. Parallel strips of gate oxide, polycrystalline silicon, and nitride oxidation mask are applied, field oxide is grown, then a perpendicular pattern of strips is etched, removing field oxide as well as parts of the original strips, providing a diffusion mask. The second level poly is then applied as strips overlying the original strips.
摘要:
An integrated semiconductor memory device of the static type uses a memory cell circuit having an MOS transistor of the conventional type as the access transistor, along with a resistance element buried under field oxide and an inverted field-effect transistor formed by a polycrystalline layer over a gate region. The MOS transistor connects a storage node to the access line, and the inverted field-effect transistor connects the storage node to reference potential. The storage node is connected to a second node through the resistance element, and a resistor connects the second node to a voltage supply; the magnitude of the resistance element varies according to the voltage on the storage node. The impedance of the inverted field-effect is determined by the voltage on the second node which is a moat region forming the gate.