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公开(公告)号：US06620512B2
公开(公告)日：2003-09-16
申请号：US10028393
申请日：2001-12-21
IPC分类号： B32B2738
CPC分类号： C08L35/06 , C08G59/4261 , C08L63/00 , C09D135/06 , H01L21/563 , H01L23/293 , H01L24/29 , H01L2224/73203 , H01L2924/01029 , H01L2924/10253 , H01L2924/14 , Y10T428/31511 , Y10T428/31515 , C08L2666/02 , C08L2666/14 , C08L2666/04 , H01L2924/00
摘要： An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.
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公开(公告)号：US6147177A
公开(公告)日：2000-11-14
申请号：US253497
申请日：1999-02-19
申请人： Saikumar Jayaraman , Brian Leslie Goodall , Larry Funderburk Rhodes , Robert Adam Shick , Richard Vicari , Robert David Allen , Juliann Opitz , Ratnam Sooriyakumaran , Thomas Wallow
发明人： Saikumar Jayaraman , Brian Leslie Goodall , Larry Funderburk Rhodes , Robert Adam Shick , Richard Vicari , Robert David Allen , Juliann Opitz , Ratnam Sooriyakumaran , Thomas Wallow
IPC分类号： C08F4/80 , C08F32/08 , C08F232/08 , C08G61/06 , C08G61/08 , G03F7/004 , G03F7/038 , G03F7/039 , C08F132/08
CPC分类号： C08F232/08 , C08G61/08 , G03F7/0045 , G03F7/0382 , G03F7/039 , Y10S430/115
摘要： Polycyclic polymers containing pendant aromatic moieties are disclosed. The polymers exhibit light transparency properties to deep UV wave lengths making them useful for high resolution photolithographic applications. These polymers are particularly useful in chemically amplified positive and negative tone resists.
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33.发明授权Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly 有权集成散热器，散热器或具有预附加相变热界面材料的热管和制造电子组件的方法公开(公告)号：US07846778B2
公开(公告)日：2010-12-07
申请号：US10261676
申请日：2002-10-02
CPC分类号： H01L23/4275 , H01L2924/0002 , H01L2924/00
摘要： An integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and a method of making an electronic assembly.
摘要翻译： 具有预先附着的相变热界面材料的集成散热器，散热器或热管以及制造电子组件的方法。
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公开(公告)号：US07718216B2
公开(公告)日：2010-05-18
申请号：US11684739
申请日：2007-03-12
IPC分类号： B05D5/12
CPC分类号： C08L101/12 , B29C39/026 , B29C70/58 , B29C70/882 , B29L2031/3406 , C08J5/10 , H01L24/10 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/30107 , H05K3/321 , H05K2201/0367 , H05K2201/10674 , H05K2201/10719 , Y10T428/24917 , Y10T428/25 , Y10T428/31681 , H01L2924/00 , H01L2224/0401
摘要： A method for low temperature bumping is disclosed. A resin capable of being cross-linked by free-radical or cationic polymerization at low temperature is provided. Electrically conductive particles are then added to the resin to form a mixture. The mixture is then activated by heat or exposure to light to polymerize the mixture. In an alternative embodiment, a vinyl ether resin is used, to which electrically conductive particles are added. The mixture is polymerized by exposure to light.
摘要翻译： 公开了一种低温碰撞的方法。 提供能够在低温下通过自由基或阳离子聚合交联的树脂。 然后将导电颗粒加入到树脂中以形成混合物。 然后通过加热或暴露于光使混合物活化，以使混合物聚合。 在替代实施方案中，使用乙烯基醚树脂，其中加入导电颗粒。 混合物通过曝光聚合。
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35.发明申请CHIP PACKAGE THERMAL INTERFACE MATERIALS WITH DIELECTRIC OBSTRUCTIONS FOR BODY-BIASING, METHODS OF USING SAME, AND SYSTEMS CONTAINING SAME 有权芯片封装具有用于机身偏转的电介质阻抗的热接口材料，使用它们的方法以及包含其的系统公开(公告)号：US20080064144A1
公开(公告)日：2008-03-13
申请号：US11935597
申请日：2007-11-06
申请人： Ashay Dani , Saikumar Jayaraman , Mitesh Patel , Vijay Wakharkar
发明人： Ashay Dani , Saikumar Jayaraman , Mitesh Patel , Vijay Wakharkar
CPC分类号： H01L23/3737 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/293 , H01L2224/29486 , H01L2224/2949 , H01L2224/29499 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/16152 , H01L2924/00 , H01L2224/05599
摘要： A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of the first metal or an inorganic compound coating of a second metal. The dielectric film diminishes overall heat transfer from the first metal particle in the thermal interface material by a small fraction of total possible heat transfer without the dielectric film. A method of operating the chip includes biasing the chip with the dielectric film in place.
摘要翻译： 芯片封装包括设置在模具背面和散热器之间的热界面材料。 热界面材料包括由电介质膜覆盖的第一金属颗粒。 电介质膜选自第一金属的无机化合物或第二金属的无机化合物涂层。 电介质膜减少热界面材料中的第一金属颗粒的总传热量，而不需要电介质膜的总可能传热的一小部分。 一种操作该芯片的方法包括：将该电介质膜的芯片偏压就位。
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36.发明授权Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same 有权用于板级接头的低温焊料的应力消除层和应力补偿套圈及其制造方法公开(公告)号：US07291548B2
公开(公告)日：2007-11-06
申请号：US11736280
申请日：2007-04-17
申请人： Daewoong Suh , Saikumar Jayaraman , Stephen E. Lehman , Mitesh Patel , Tiffany A. Byrne , Edward L. Martin , Mohd Erwan B. Basiron , Wei Keat Loh , Sheau Hooi Lim , Yoong Tatt P. Chin
发明人： Daewoong Suh , Saikumar Jayaraman , Stephen E. Lehman , Mitesh Patel , Tiffany A. Byrne , Edward L. Martin , Mohd Erwan B. Basiron , Wei Keat Loh , Sheau Hooi Lim , Yoong Tatt P. Chin
IPC分类号： H01L21/44
CPC分类号： H05K3/3436 , H01L23/562 , H01L24/16 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16 , H01L2924/00014 , H01L2924/01012 , H01L2924/01025 , H01L2924/01046 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H05K1/0271 , H05K3/3463 , H05K2201/10977 , H05K2203/0126 , Y02P70/613 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.
摘要翻译： 通过在基底下表面上分配聚合物以部分地嵌入设置在下表面上的低熔点焊料凸点的条件来形成应力消除层。 应力消除层流向低熔点焊料凸块。 应力补偿轴环形成在与基板相配合的基板上，并且应力补偿套环部分嵌入低熔点焊料凸块。 还包括展示应力消除层和应力补偿套环的物品。 还包括包括低熔点焊料，应力消除层和应力补偿环的计算系统。
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37.发明申请Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same 有权具有用于体偏置的电介质障碍物的芯片封装热界面材料，其使用方法以及含有它们的体系公开(公告)号：US20070158823A1
公开(公告)日：2007-07-12
申请号：US11323512
申请日：2005-12-30
申请人： Ashay Dani , Anna Prakash , Saikumar Jayaraman , Mitesh Patel , Vijay Wakharkar
发明人： Ashay Dani , Anna Prakash , Saikumar Jayaraman , Mitesh Patel , Vijay Wakharkar
IPC分类号： H01L23/34
CPC分类号： H01L23/3737 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/293 , H01L2224/29486 , H01L2224/2949 , H01L2224/29499 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/16152 , H01L2924/00 , H01L2224/05599
摘要： A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of the first metal or an inorganic compound coating of a second metal. The dielectric film diminishes overall heat transfer from the first metal particle in the thermal interface material by a small fraction of total possible heat transfer without the dielectric film. A method of operating the chip includes biasing the chip with the dielectric film in place.
摘要翻译： 芯片封装包括设置在模具背面和散热器之间的热界面材料。 热界面材料包括由电介质膜覆盖的第一金属颗粒。 电介质膜选自第一金属的无机化合物或第二金属的无机化合物涂层。 电介质膜减少热界面材料中的第一金属颗粒的总传热量，而不需要电介质膜的总可能传热的一小部分。 一种操作该芯片的方法包括：将该电介质膜的芯片偏压就位。
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38.发明授权Anhydride polymers for use as curing agents in epoxy resin-based underfill material 有权用作基于环氧树脂的底层填充材料中的固化剂的酐聚合物公开(公告)号：US07202304B2
公开(公告)日：2007-04-10
申请号：US11370465
申请日：2006-03-08
CPC分类号： C08L35/06 , C08G59/4261 , C08L63/00 , C09D135/06 , H01L21/563 , H01L23/293 , H01L24/29 , H01L2224/73203 , H01L2924/01029 , H01L2924/10253 , H01L2924/14 , Y10T428/31511 , Y10T428/31515 , C08L2666/02 , C08L2666/14 , C08L2666/04 , H01L2924/00
摘要： An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.
摘要翻译： 提出了可以在电气部件和基板之间使用的底部填充材料。 底部填充材料可以是包含液体或半固体环氧树脂和多官能酐聚合物和/或低聚物固化剂的固化环氧树脂组合物。 酸酐聚合物和/或低聚物的使用降低了组合物的挥发，从而降低了底部填充材料的孔隙率。 通过改变酸酐聚合物和/或低聚物的取代基，可以设计底部填充材料以改变粘度，降低吸湿性，挥发和模量，改善机械性能和增强附着力。
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公开(公告)号：US20060154080A1
公开(公告)日：2006-07-13
申请号：US11370465
申请日：2006-03-08
CPC分类号： C08L35/06 , C08G59/4261 , C08L63/00 , C09D135/06 , H01L21/563 , H01L23/293 , H01L24/29 , H01L2224/73203 , H01L2924/01029 , H01L2924/10253 , H01L2924/14 , Y10T428/31511 , Y10T428/31515 , C08L2666/02 , C08L2666/14 , C08L2666/04 , H01L2924/00
摘要： An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.
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公开(公告)号：US20050186502A1
公开(公告)日：2005-08-25
申请号：US11044484
申请日：2005-01-27
IPC分类号： C08F4/80 , C08F32/00 , C08F220/40 , C08F230/08 , C08F232/08 , G02B6/122 , G02B6/132 , G03C1/492 , G03C1/494 , G03C1/76 , G03F20060101 , G03F7/038 , G03F7/075 , H01L21/301 , H01L21/46 , H01L21/78
CPC分类号： G03F7/0388 , C08F220/40 , C08F230/08 , C08F232/08 , G03F7/0758
摘要： The present invention relates to a directly photoimageable polymer composition (DPPC) and methods for its use in forming microelectronic and optoelectronic devices. Such DPPC encompasses a polymer having at least one norbornene-type repeat unit having a pendant silyl containing radical and at least one norbornene-type repeat unit having an acrylate containing radical.
摘要翻译： 本发明涉及直接可光成像的聚合物组合物（DPPC）及其用于形成微电子和光电器件的方法。 这样的DPPC包括具有至少一个降冰片烯型重复单元的聚合物，该单体具有含甲酰基侧基和至少一个具有含丙烯酸酯基团的降冰片烯型重复单元。
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