公开(公告)号：US20060043599A1

公开(公告)日：2006-03-02

申请号：US10932296

申请日：2004-09-02

Applicant: Salman Akram ,  Charles Watkins ,  Mark Hiatt ,  David Hembree ,  James Wark ,  Warren Farnworth ,  Mark Tuttle ,  Sidney Rigg ,  Steven Oliver ,  Kyle Kirby ,  Alan Wood ,  Lu Velicky

Inventor： Salman Akram ,  Charles Watkins ,  Mark Hiatt ,  David Hembree ,  James Wark ,  Warren Farnworth ,  Mark Tuttle ,  Sidney Rigg ,  Steven Oliver ,  Kyle Kirby ,  Alan Wood ,  Lu Velicky

IPC: H01L21/44 ,  H01L23/48

CPC classification number: H01L21/76877 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/45 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2221/6834 ,  H01L2224/02166 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

公开(公告)号：US20050231626A1

公开(公告)日：2005-10-20

申请号：US11146783

申请日：2005-06-07

Applicant: Mark Tuttle ,  William Hiatt

Inventor： Mark Tuttle ,  William Hiatt

IPC: H01L23/02 ,  H01L27/14 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H04N5/225

CPC classification number: H01L27/14625 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48227 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A microelectronic imager comprising an imaging unit and an optics unit attached to the imaging unit, and methods for packaging microelectronic imagers. In one embodiment, the imaging unit can include (a) a microelectronic die with an image sensor and a plurality of external contacts electrically coupled to the image sensor and (b) a first referencing element fixed to the imaging unit. The optics unit can include an optic member and a second referencing element fixed to the optics unit. The second referencing element is releasably seated with the first referencing element at a preset position in which the optic member is situated at a desired location relative to the image sensor.

Abstract translation: 一种包括成像单元和附接到成像单元的光学单元的微电子成像器，以及用于封装微电子成像器的方法。 在一个实施例中，成像单元可以包括（a）具有图像传感器和电耦合到图像传感器的多个外部触点的微电子管芯和（b）固定到成像单元的第一参考元件。 光学单元可以包括光学构件和固定到光学单元的第二参考元件。 第二参考元件可释放地与第一参考元件一起位于预定位置，在该位置，光学元件位于相对于图像传感器的期望位置处。

公开(公告)号：US06452253B1

公开(公告)日：2002-09-17

申请号：US09651997

申请日：2000-08-31

Applicant: Mark Tuttle

Inventor： Mark Tuttle

IPC: H05K100

CPC classification number: H01L23/522 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/29 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: Disclosed are a method and apparatus which provide a magnetic shield for integrated circuits containing electromagnetic circuit elements. The shield is formed of a magnetically permeable material, which may be a non-conductive magnetic oxide, and either partially contacts or completely surrounds the integrated circuit.

Abstract translation: 公开了一种为包含电磁电路元件的集成电路提供磁屏蔽的方法和装置。 屏蔽由导磁材料形成，其可以是非导电性磁性氧化物，并且部分地接触或完全围绕集成电路。

公开(公告)号：US20100059898A1

公开(公告)日：2010-03-11

申请号：US12209052

申请日：2008-09-11

Applicant: Brent Keeth ,  Mark Hiatt ,  Terry R. Lee ,  Mark Tuttle ,  Rahul Advani ,  John F. Schreck

Inventor： Brent Keeth ,  Mark Hiatt ,  Terry R. Lee ,  Mark Tuttle ,  Rahul Advani ,  John F. Schreck

IPC: H01L23/52 ,  H01L21/00

CPC classification number: H01L25/0657 ,  H01L23/50 ,  H01L23/5385 ,  H01L23/66 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/06181 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/01004 ,  H01L2924/15311 ,  Y10T29/49165

Abstract: Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

Abstract translation: 一些实施例包括装置，系统和方法，其具有底座，第一管芯，第二管芯，第二管芯和第二管芯，第二管芯和第二管芯，第二管芯和第二管芯， 被配置为在所述基座与所述第一和第二骰子中的至少一个之间传送信号。

公开(公告)号：US20080030306A1

公开(公告)日：2008-02-07

申请号：US11847538

申请日：2007-08-30

Applicant: James O'Toole ,  John Tuttle ,  Mark Tuttle ,  Tyler Lowrey ,  Kevin Devereaux ,  George Pax ,  Brian Higgins ,  David Ovard ,  Shu-Sun Yu ,  Robert Rotzoll

Inventor： James O'Toole ,  John Tuttle ,  Mark Tuttle ,  Tyler Lowrey ,  Kevin Devereaux ,  George Pax ,  Brian Higgins ,  David Ovard ,  Shu-Sun Yu ,  Robert Rotzoll

IPC: G06K19/07

CPC classification number: G06K19/0716 ,  G06K7/0008 ,  G06K7/10059 ,  G06K19/0707 ,  G06K19/0712 ,  G06K19/0723 ,  G06K19/0726 ,  G06K19/07749 ,  G06K19/07758 ,  H01Q1/2225 ,  H03L7/0995 ,  H03L7/148

Abstract: A radio frequency identification device includes an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.

Abstract translation: 射频识别装置包括包括接收器，发射器和微处理器的集成电路。 接收机和发射机一起定义了一个有效的应答器。 集成电路优选地是包括接收器，发射器和微处理器的单片单片集成电路。 由于该设备包括有源应答器，而不是依赖于磁耦合功率的转发器，该器件具有更大的范围。

公开(公告)号：US20080007462A1

公开(公告)日：2008-01-10

申请号：US11855022

申请日：2007-09-13

Applicant: Mark Tuttle

Inventor： Mark Tuttle

IPC: H01R43/00

CPC classification number: G06K19/0716 ,  G06K19/0723 ,  G06K19/07345 ,  G06K19/07749 ,  H01H2231/05 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q21/28 ,  Y10T29/49004 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117

Abstract: A wireless identification device including a housing; circuitry in the housing configured to provide a signal to identify the device in response to an interrogation signal; and a selectively actuated switch supported by the housing and controlling whether the circuitry identifies the device. A method of manufacturing a wireless identification device, the method comprising configuring circuitry to provide a signal to identify the device in response to an interrogation signal; coupling the circuitry to a push-on/push-off switch supported by the housing and controlling whether the circuitry provides the signal to identify the device; and encasing the circuitry in a housing such that the switch is actuable from outside the housing by touching a portion of the housing.

公开(公告)号：US20070293209A1

公开(公告)日：2007-12-20

申请号：US11847558

申请日：2007-08-30

Applicant: James O'Toole ,  John Tuttle ,  Mark Tuttle ,  Tyler Lowrey ,  Kevin Devereaux ,  George Pax ,  Brian Higgins ,  David Ovard ,  Shu-Sun Yu ,  Robert Rotzoll

Inventor： James O'Toole ,  John Tuttle ,  Mark Tuttle ,  Tyler Lowrey ,  Kevin Devereaux ,  George Pax ,  Brian Higgins ,  David Ovard ,  Shu-Sun Yu ,  Robert Rotzoll

IPC: H04M3/00

CPC classification number: G06K19/0716 ,  G06K7/0008 ,  G06K7/10059 ,  G06K19/0707 ,  G06K19/0712 ,  G06K19/0723 ,  G06K19/0726 ,  G06K19/07749 ,  G06K19/07758 ,  H01Q1/2225 ,  H03L7/0995 ,  H03L7/148

Abstract: A radio frequency identification device includes an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.

Abstract translation: 射频识别装置包括包括接收器，发射器和微处理器的集成电路。 接收机和发射机一起定义了一个有效的应答器。 集成电路优选地是包括接收器，发射器和微处理器的单片单片集成电路。 由于该设备包括有源应答器，而不是依赖于磁耦合功率的转发器，该器件具有更大的范围。

公开(公告)号：US20070290862A1

公开(公告)日：2007-12-20

申请号：US11846905

申请日：2007-08-29

Applicant: Mark Tuttle

Inventor： Mark Tuttle

IPC: G08B13/14

CPC classification number: G06K7/0008 ,  G06K19/07749 ,  G06K19/07771 ,  G06K19/07786

Abstract: The present invention provides electronic communication devices, methods of forming electrical communication devices, and communications methods. An electronic communication device adapted to receive electronic signals includes: a housing comprising a substrate and an encapsulant; an integrated circuit provided within the housing and comprising transponder circuitry operable to communicate an identification signal responsive to receiving a polling signal; an antenna provided within the housing and being coupled with the transponder circuitry; and a ground plane provided within the housing and being spaced from the antenna and configured to shield some of the electronic signals from the antenna and reflect others of the electronic signals towards the antenna. A method of forming an electronic signal communication device includes providing a substrate having a support surface; providing a conductive layer adjacent at least a portion of the support surface; providing a dielectric layer over the conductive layer; providing an antenna over the dielectric layer; coupling an integrated circuit with the antenna; and encapsulating the antenna, the dielectric layer, and the integrated circuit using a flowable encapsulant.

Abstract translation: 本发明提供电子通信设备，形成电通信设备的方法和通信方法。 适于接收电子信号的电子通信设备包括：壳体，包括衬底和密封剂; 设置在所述外壳内的集成电路，包括响应于接收到轮询信号而传送识别信号的应答器电路; 设置在壳体内并与应答器电路耦合的天线; 以及设置在壳体内并与天线间隔开并被配置为将一些电子信号与天线隔离并将其它电子信号反射向天线的接地平面。 一种形成电子信号通信装置的方法包括提供具有支撑表面的基板; 提供邻近所述支撑表面的至少一部分的导电层; 在所述导电层上提供介电层; 在电介质层上提供天线; 将集成电路与天线耦合; 并使用可流动的密封剂封装天线，电介质层和集成电路。

公开(公告)号：US20070139164A1

公开(公告)日：2007-06-21

申请号：US11607117

申请日：2006-11-28

Applicant: James O'Toole ,  John Tuttle ,  Mark Tuttle ,  Tyler Lowrey ,  Kevin Devereaux ,  George Pax ,  Brian Higgins ,  Shu-Sun Yu ,  David Ovard ,  Robert Rotzoll

Inventor： James O'Toole ,  John Tuttle ,  Mark Tuttle ,  Tyler Lowrey ,  Kevin Devereaux ,  George Pax ,  Brian Higgins ,  Shu-Sun Yu ,  David Ovard ,  Robert Rotzoll

IPC: H04Q5/22

CPC classification number: G06K19/0716 ,  G06K7/0008 ,  G06K7/10059 ,  G06K19/0707 ,  G06K19/0712 ,  G06K19/0723 ,  G06K19/0726 ,  G06K19/07749 ,  G06K19/07758 ,  G06K2017/0051 ,  H01Q1/2225 ,  H03L7/0995 ,  H03L7/148

Abstract: A radio frequency identification device includes an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.

Abstract translation: 射频识别装置包括包括接收器，发射器和微处理器的集成电路。 接收机和发射机一起定义了一个有效的应答器。 集成电路优选地是包括接收器，发射器和微处理器的单片单片集成电路。 由于该设备包括有源应答器，而不是依赖于磁耦合功率的转发器，该器件具有更大的范围。

公开(公告)号：US20070045632A1

公开(公告)日：2007-03-01

申请号：US11217877

申请日：2005-09-01

Applicant: Steven Oliver ,  Lu Velicky ,  William Hiatt ,  David Hembree ,  Mark Tuttle ,  Sidney Rigg ,  James Wark ,  Warren Farnworth ,  Kyle Kirby

Inventor： Steven Oliver ,  Lu Velicky ,  William Hiatt ,  David Hembree ,  Mark Tuttle ,  Sidney Rigg ,  James Wark ,  Warren Farnworth ,  Kyle Kirby

IPC: H01L33/00

CPC classification number: H01L21/00 ,  H01L21/76898 ,  H01L23/552 ,  H01L27/14609 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Microelectronic imaging units and methods for manufacturing a plurality of imaging units at the wafer level are disclosed herein. In one embodiment, a method for manufacturing a plurality of imaging units includes providing an imager workpiece having a plurality of imaging dies including integrated circuits, external contacts electrically coupled to the integrated circuits, and image sensors operably coupled to the integrated circuits. The individual image sensors include at least one dark current pixel at a perimeter portion of the image sensor. The method includes depositing a cover layer onto the workpiece and over the image sensors. The method further includes patterning and selectively developing the cover layer to form discrete volumes of cover layer material over corresponding image sensors. The discrete volumes of cover layer material have sidewalls aligned with an inboard edge of the individual dark current pixels such that the dark current pixels are not covered by the discrete volumes.

Abstract translation: 本文公开了用于在晶片级制造多个成像单元的微电子成像单元和方法。 在一个实施例中，制造多个成像单元的方法包括提供具有多个成像管芯的成像工件，所述成像管芯包括集成电路，电耦合到集成电路的外部触点以及可操作地耦合到集成电路的图像传感器。 各个图像传感器包括在图像传感器的周边部分处的至少一个暗电流像素。 该方法包括将覆盖层沉积在工件上并在图像传感器上方。 该方法还包括图案化和选择性地显影覆盖层以在对应的图像传感器上形成分离体积的覆盖层材料。 覆盖层材料的离散体积具有与各个暗电流像素的内侧边缘对准的侧壁，使得暗电流像素不被离散体积覆盖。