公开(公告)号：US6100114A

公开(公告)日：2000-08-08

申请号：US132127

申请日：1998-08-10

Applicant: Cynthia S. Milkovich ,  Mark V. Pierson ,  Son K. Tran

Inventor： Cynthia S. Milkovich ,  Mark V. Pierson ,  Son K. Tran

IPC: H01L21/56 ,  H01L21/60 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L24/11 ,  H01L21/563 ,  H01L24/29 ,  H01L24/31 ,  H01L24/94 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2224/83951 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14

Abstract: Solder bumps on electronic components are encapsulated before attachment to a substrate or component carrier. A film of sealing material is pressed against top portions of the solder bumps by pressing with a layer of low durometer flexible material. Encapsulant is positioned between the component and the film and in contact with the bumps, and partially cured. The film and layer of flexible material are removed to expose the top portions of the encapsulated solder bumps.

Abstract translation: 电子元件下的焊料凸点在附着到基板或部件载体之前被封装。 通过用低硬度柔性材料层压制，将密封材料膜压在焊料凸块的顶部上。 封装剂位于组件和膜之间并与凸块接触并部分固化。 去除柔性材料的膜和层以暴露封装的焊料凸块的顶部。

公开(公告)号：US6068175A

公开(公告)日：2000-05-30

申请号：US162739

申请日：1998-09-29

Applicant: Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

Inventor： Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

IPC: B23K1/012 ,  B23K3/08 ,  C08G61/00 ,  C08G63/91 ,  C08L63/00 ,  C08L67/02 ,  C08L71/12 ,  H05K3/34 ,  B23K37/02 ,  B23K1/00 ,  B23K5/00 ,  B23K31/00 ,  B23K31/02

CPC classification number: H05K3/3494 ,  B23K1/012 ,  B23K3/08 ,  C08G61/00 ,  C08G63/914 ,  C08L63/00 ,  C08L67/02 ,  C08L71/126 ,  H01L24/75 ,  H05K3/3415 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/16225 ,  H05K2201/10734 ,  H05K2203/0173 ,  H05K2203/081 ,  H05K2203/1105 ,  H05K2203/1572 ,  H05K2203/176 ,  H05K3/3436 ,  Y02P70/613 ,  Y10S29/024 ,  Y10S29/044 ,  Y10T29/49144 ,  Y10T29/53191 ,  Y10T29/53265

Abstract: Apparatus for connecting a first area array component to a substrate with a joining material. The apparatus has a nozzle directing heat toward both the first area array component and the portion of the substrate beneath the first area array component to melt the joining material. An elastic seal contacts the substrate and prevents the heat from affecting other components adjacent the first area array component. The nozzle is pressed against the substrate to restrain warping of the substrate, which might be caused by the heating of the first area array component, and to prevent damage to the substrate. The nozzle can tilt so that it conforms to the surface of the substrate. The first area array component is allowed to move freely in the direction of a plane of the substrate under the surface tension of the molten joining material during heating to center the first area array component.

Abstract translation: 用于使用接合材料将第一区域阵列部件连接到基板的装置。 该装置具有将第一区域阵列部件和第一区域阵列部件下方的基板部分朝着第二区域阵列部件的两个热导向的喷嘴，以熔化接合材料。 弹性密封件接触基板并防止热量影响与第一区域阵列部件相邻的其他部件。 喷嘴被压靠在基板上以抑制基板的翘曲，这可能是由第一区域阵列部件的加热引起的，并且防止损坏基板。 喷嘴可以倾斜使其符合基板的表面。 允许第一区域阵列部件在加热期间在熔融接合材料的表面张力下在基板的平面方向上自由移动以使第一区域阵列部件居中。

公开(公告)号：US5889654A

公开(公告)日：1999-03-30

申请号：US826963

申请日：1997-04-09

Applicant: Mark V. Pierson ,  Kenneth L. Spink, Jr. ,  Thurston B. Youngs, Jr.

Inventor： Mark V. Pierson ,  Kenneth L. Spink, Jr. ,  Thurston B. Youngs, Jr.

IPC: B42D15/10 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K5/02 ,  H05K7/20

CPC classification number: H05K5/0269 ,  H01L23/5388 ,  H05K7/20445 ,  H01L2224/48472 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14

Abstract: Integrated circuit chips (18, 42, or 56) are packaged within openings formed in a substrate such as PCMCIA Card (20, 40, or 54), thus allowing compliance with overall width dimension requirements for standardized electronic components. The arrangement has the advantages that thermal coefficient of expansion of the chips and cards match, and that a sturdy, multilayer ceramic substrate is used for electrical connection to electronic devices such as laptops, palmtops, and the like. In addition, a second integrated circuit chip (68) can be connected directly to the embedded chip (56), thereby allowing two chips to be accommodated in a card (54) at the same location and allowing chip-to-chip electrical communication. A variety of electrical bonding methods joining the embedded chip to the card can be employed. In addition, a variety of thermal conduction arrangements can be used for cooling the embedded integrated circuit chip.

Abstract translation: 集成电路芯片（18,42或56）封装在诸如PCMCIA卡（20,40或54）的基板中形成的开口内，从而允许符合标准化电子元件的整体宽度尺寸要求。 该布置具有芯片和卡的热膨胀系数匹配的优点，并且使用坚固的多层陶瓷基板来电连接到诸如笔记本电脑，掌上电脑等的电子设备。 此外，第二集成电路芯片（68）可以直接连接到嵌入式芯片（56），从而允许两个芯片被容纳在相同位置的卡（54）中，并允许芯片间的电气通信。 可以采用将嵌入式芯片连接到卡的各种电接合方法。 此外，可以使用各种热传导布置来冷却嵌入式集成电路芯片。

公开(公告)号：US5523696A

公开(公告)日：1996-06-04

申请号：US163452

申请日：1993-12-07

Applicant: Richard G. Charlton ,  George C. Correla ,  Mark A. Couture ,  Gary R. Hill ,  Kibby B. Horsford ,  Anthony P. Ingraham ,  Michael D. Lowell ,  Voya R. Markovich ,  Gordon C. Osborne, Jr. ,  Mark V. Pierson

Inventor： Richard G. Charlton ,  George C. Correla ,  Mark A. Couture ,  Gary R. Hill ,  Kibby B. Horsford ,  Anthony P. Ingraham ,  Michael D. Lowell ,  Voya R. Markovich ,  Gordon C. Osborne, Jr. ,  Mark V. Pierson

IPC: G01R1/04 ,  G01R1/073 ,  G01R31/28

CPC classification number: G01R31/2863 ,  G01R1/0483 ,  G01R1/07307 ,  G01R31/2886

Abstract: A method and apparatus for testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O contacts. The apparatus is provided with an interposer that has contacts corresponding to the contacts on the semiconductor chip. Both the chip and the interposer contacts can be any known type including metal ball, bumps, or tabs or may be provided with dendritic surfaces. The chip contacts are first brought into relative loose temporary contact with the contacts on the interposer and then a compressive force greater that 5 grams per chip contact is applied to the chip to force the chip contacts into good electrical contact with the interposer contacts. Testing of the chip is then performed. The tests may include heating of the chip as well as the application of signals to the chip contacts. After testing the chip is removed from the substrate.

Abstract translation: 公开了一种用于测试半导体芯片的方法和装置。 单个半导体芯片具有I / O触点。 该装置设置有具有对应于半导体芯片上的触点的触点的插入器。 芯片和内插器触点都可以是任何已知的类型，包括金属球，凸块或凸片，或者可以设置有树枝状表面。 首先将芯片触点与插入件上的触点进行相对松动的临时接触，然后将大于每芯片接触5克的压缩力施加到芯片上以迫使芯片触头与插入器触点良好地电接触。 然后进行芯片的测试。 测试可能包括加热芯片以及将信号应用于芯片触点。 测试后，芯片从基板上取下。

公开(公告)号：US4741100A

公开(公告)日：1988-05-03

申请号：US911186

申请日：1986-09-24

Applicant: Mark V. Pierson

Inventor： Mark V. Pierson

IPC: H01R12/04 ,  B21K25/00 ,  H01L21/48 ,  H01R43/04 ,  H01R43/20 ,  H05K3/30 ,  H01R9/16 ,  B23P19/00

CPC classification number: H01R43/20 ,  B21K25/00 ,  H01L21/4853 ,  H05K3/308 ,  Y10T29/49153 ,  Y10T29/53174

Abstract: A pin which has a compressive strength less than the tensile strength of a substrate can be fixed into a hole in the substrate when the substrate is held between a stopping block and a clamp by transporting the pin into the hole with sufficient kinetic energy that the pin is forged into a shape defined by the hole upon impacting the stopping block.The pin can be retained in the substrate by forging it into a headed and bulged shape defined by recesses in the stopping block and the clamp on either side of the hole.

公开(公告)号：US4422232A

公开(公告)日：1983-12-27

申请号：US203562

申请日：1980-11-05

Applicant: Stanley R. Vancelette ,  Robert D. DiNozzi ,  Mark V. Pierson

Inventor： Stanley R. Vancelette ,  Robert D. DiNozzi ,  Mark V. Pierson

IPC: B23P21/00 ,  H05K13/00 ,  H05K13/04 ,  H05K3/30

CPC classification number: H05K13/0452 ,  Y10T29/49139 ,  Y10T29/5138 ,  Y10T29/53183 ,  Y10T29/53261

Abstract: An insertion device for two or four pin dual in-line electronic insertion machines which include a radial array of transfer units associated with a picker unit which grasps a component and inserts it into a circuit board.

Abstract translation: 一种用于两针或四针双列直插式电子插入机的插入装置，其包括与抓取部件并将其插入电路板中的拾取器单元相关联的传送单元的径向阵列。

公开(公告)号：US09211558B1

公开(公告)日：2015-12-15

申请号：US13609721

申请日：2012-09-11

Applicant: Mark V. Pierson ,  Mark Levy

Inventor： Mark V. Pierson ,  Mark Levy

IPC: B67D7/58 ,  B05B11/00

CPC classification number: B05B11/3015 ,  B05B11/007 ,  B05B11/304 ,  B05B11/3069 ,  B05B11/3074

Abstract: A toothpaste dispenser having an upper chamber and an inlet port connected for receiving toothpaste and a lower chamber and an outlet port connected for dispensing toothpaste. Suction is created to draw toothpaste into the inlet port, and then forced through the outlet port during actuation. Initiating operation of the suction pulls toothpaste into an upper chamber, and a plunger for expelling the toothpaste from the chamber is operatively connected to the outflow ball check valve for intermittently blocking the flow of toothpaste into and from the toothpaste dispenser. The toothpaste dispenser utilizes ball check valves and two return springs operatively connected to the ball check valves. The toothpaste dispenser actuation has a plunger and also has a portion size adjustment device connected to the plunger for modifying the amount of toothpaste dispensed from the toothpaste dispenser.

Abstract translation: 一种牙膏分配器，其具有连接用于接收牙膏的上部腔室和入口端口以及用于分配牙膏的下部腔室和出口端口。 吸入是将牙膏吸入入口，然后在启动过程中强制通过出口。 抽吸将牙膏引入上部腔室的启动操作和用于将牙膏从腔室排出的活塞可操作地连接到流出球止回阀，以间歇地阻止牙膏流入牙膏分配器的流动。 牙膏分配器使用球形止回阀和可操作地连接到球止回阀的两个复位弹簧。 牙膏分配器致动具有柱塞，并且还具有连接到柱塞的部分尺寸调节装置，用于改变从牙膏分配器分配的牙膏的量。

公开(公告)号：US07718902B2

公开(公告)日：2010-05-18

申请号：US10937654

申请日：2004-09-09

Applicant: Lisa J. Jimarez ,  Mark V. Pierson

Inventor： Lisa J. Jimarez ,  Mark V. Pierson

IPC: H05K1/03

CPC classification number: H05K3/462 ,  H05K3/321 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/4623 ,  H05K2201/096

Abstract: The current invention provides a method of attaching a plurality of cores wherein a core has a via with a conductive surface to be electrically connected to a conductive surface on another core. The method provides for applying a metallurgical paste to a conductive surface, removing a portion of the flux from the paste and joining the two cores. The current invention also provides a structure including a plurality of cores wherein a metallurgical paste electrically connects a via with a conductive surface on a core to a conductive surface on another core.

Abstract translation: 本发明提供了一种附接多个芯的方法，其中芯具有导电表面的通孔以电连接到另一芯上的导电表面。 该方法提供将冶金膏施加到导电表面，从糊料中去除一部分助熔剂并连接两个芯。 本发明还提供了一种包括多个芯的结构，其中冶金膏将通孔与芯上的导电表面电连接到另一芯上的导电表面。

公开(公告)号：US06980392B2

公开(公告)日：2005-12-27

申请号：US10409748

申请日：2003-04-08

Applicant: Mark V. Pierson

Inventor： Mark V. Pierson

IPC: G11B25/04 ,  G11B33/14 ,  G11B5/54

CPC classification number: G11B25/043 ,  G11B33/1446

Abstract: Under the present invention, a contaminant capturing material is positioned within a disk drive. Specifically, the contaminant capturing material is positioned on a suspension, adjacent a slider that hovers proximate a disk within the disk drive when the disk is in rotation. The contaminant capturing material will prevent contaminants from contacting the disk and thereby causing damage. In addition, a set of porous, open celled filters that are coated with the contaminant capturing material can also be provided. If used, the open celled filters are positioned adjacent the disk within an air stream created by a rotation of the disk.

Abstract translation: 在本发明中，污染物捕获材料位于盘驱动器内。 具体而言，当盘旋转时，污染物捕获材料位于悬挂件的附近，该盘片靠近磁盘驱动器内的磁盘。 污染物捕获材料将防止污染物接触盘，从而造成损坏。 此外，还可以提供涂覆有污染物捕获材料的一组多孔，开孔式过滤器。 如果使用，开放式过滤器通过由盘的旋转产生的空气流中定位在盘附近。

公开(公告)号：US06917728B2

公开(公告)日：2005-07-12

申请号：US10608057

申请日：2003-06-27

Applicant: Michael S. Lemmon ,  Mark V. Pierson

Inventor： Michael S. Lemmon ,  Mark V. Pierson

IPC: G02B6/255 ,  G02B6/42 ,  G02B6/12

CPC classification number: G02B6/4202 ,  G02B6/2552

Abstract: An attachment structure, and an associated method and system for forming the attachment structure. An end of an optical fiber is melted while the end is above, but not touching, an exposed surface of a substrate such that said end becomes molten. The optical fiber is substantially optically transparent to laser radiation of a given wavelength. The molten end is moved toward the exposed surface of the substrate until the end makes physical contact with the exposed surface of the substrate. The moving is performed sufficiently fast so that the end is still molten when the end initially makes the physical contact with the exposed surface of the substrate. The physical contact is maintained for a sufficient length of time to enable the end to bond to the exposed surface of the substrate with no intervening matter between the end and the exposed surface of the substrate.

Abstract translation: 附件结构以及用于形成附接结构的相关联的方法和系统。 光纤的端部熔化，而端部在基板的暴露表面上方但不接触，使得端部熔化。 光纤对于给定波长的激光辐射基本上是光学透明的。 熔融端朝向衬底的暴露表面移动，直到端部与衬底的暴露表面物理接触为止。 移动足够快地进行，使得当端部最初与衬底的暴露表面物理接触时，端部仍然熔化。 保持物理接触足够长的时间，以使端部能够在衬底的端部和暴露表面之间没有中间物质结合到衬底的暴露表面。