Block-on-block memory array architecture using bi-directional staircases

    公开(公告)号:US10978478B1

    公开(公告)日:2021-04-13

    申请号:US16716947

    申请日:2019-12-17

    Inventor: Aaron S. Yip

    Abstract: A memory device stores data in non-volatile memory. The memory device includes a non-volatile memory array. The memory array includes tiers for accessing data stored in blocks of the memory array, including a block having a left block portion and a right block portion. A first staircase is positioned between the left block portion and the right block portion, and a bottom portion of the first staircase includes steps corresponding to first tiers of the left block portion. A second staircase is positioned between the left block portion and the right block portion, and a top portion of the second staircase includes steps corresponding to second tiers of the right block portion. The steps of the first staircase and the steps of the second staircase descend in opposite directions.

    MEMORY CELL PROGRAMMING
    34.
    发明申请

    公开(公告)号:US20170330627A1

    公开(公告)日:2017-11-16

    申请号:US15665474

    申请日:2017-08-01

    Inventor: Aaron S. Yip

    CPC classification number: G11C16/10 G11C11/5628 G11C16/0483 G11C16/26

    Abstract: Methods of operating a memory include applying a programming pulse having a particular voltage level to a selected access line connected to selected memory cells of a programming operation, assigning the selected memory cells to respective groups of memory cells each having a different range of threshold voltages, determining a respective value of VgVt for each group of memory cells, applying a subsequent programming pulse to the selected access line and having a particular voltage level determined in response to the value of VgVt for a particular group of memory cells, enabling the selected memory cells of the particular group of memory cells for programming while the subsequent programming pulse has the particular voltage level, and repeating for a next group of memory cells.

    MEMORY CELL PROGRAMMING UTILIZING
CONDITIONAL ENABLING OF MEMORY CELLS

    公开(公告)号:US20170271014A1

    公开(公告)日:2017-09-21

    申请号:US15072954

    申请日:2016-03-17

    Inventor: Aaron S. Yip

    CPC classification number: G11C16/10 G11C11/5628 G11C16/0483 G11C16/26

    Abstract: Methods of operating a memory include determining indications of programming voltages sufficient to program respective groups of memory cells of a plurality of groups of memory cells to a particular range of threshold voltages, applying a stepped programming pulse to a selected access line connected to each memory cell of the plurality of groups of memory cells, and enabling each group of memory cells for programming when a voltage level of the stepped programming pulse corresponds to the respective indication of the programming voltage sufficient to program that group of memory cells to the particular range of threshold voltages.

    Vertical string driver for memory array

    公开(公告)号:US11688463B2

    公开(公告)日:2023-06-27

    申请号:US16948236

    申请日:2020-09-09

    CPC classification number: G11C16/08 G11C16/0483 H01L29/04

    Abstract: A memory device comprises a substrate and a memory array disposed above the substrate, the memory array comprising a plurality of vertically stacked layers, each vertically stacked layer comprising a plurality of word lines. The memory device further comprises a plurality of vertical string driver circuits disposed above the memory array, wherein each of the plurality of vertical string driver circuits comprises one or more semiconductor devices coupled to a respective one of the plurality of word lines.

    Memory devices with user-defined tagging mechanism

    公开(公告)号:US11636886B2

    公开(公告)日:2023-04-25

    申请号:US17392924

    申请日:2021-08-03

    Abstract: A memory device includes a memory array with memory blocks each having a plurality of memory cells, and one or more current monitors configured to measure current during post-deployment operation of the memory device; and a controller configured to identify a bad block within the memory blocks based on the measured current, and disable the bad block for preventing access thereof during subsequent operations of the memory device.

    INDEPENDENT PLANE ARCHITECTURE IN A MEMORY DEVICE

    公开(公告)号:US20230059543A1

    公开(公告)日:2023-02-23

    申请号:US17887940

    申请日:2022-08-15

    Abstract: A memory device includes a memory array comprising a plurality of memory planes, wherein the plurality of memory planes are arranged in a plurality of independent plane groups, and wherein each of the plurality of independent plane groups comprises one or more of the plurality of memory planes. The memory device further includes a plurality of independent analog driver circuits coupled to the memory array, wherein a respective one of the plurality of independent analog driver circuits is associated with a respective one of the plurality of independent plane groups. The memory device further includes a common analog circuit coupled to the memory array, wherein the common analog circuit is shared by the plurality of independent analog driver circuits and the plurality of independent plane groups. The memory device further includes a plurality of control logic elements, wherein a respective one of the plurality of control logic elements is associated with a respective one of the plurality of independent analog driver circuits and a respective one of the plurality of independent plane groups.

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