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公开(公告)号：US20140141550A1
公开(公告)日：2014-05-22
申请号：US14166540
申请日：2014-01-28
Applicant: NICHIA CORPORATION
Inventor： Masafumi KURAMOTO , Satoru OGAWA , Miki NIWA
IPC: H01L33/64
CPC classification number: H01L33/641 , H01L21/187 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L33/62 , H01L2224/0345 , H01L2224/0401 , H01L2224/06102 , H01L2224/13099 , H01L2224/16225 , H01L2224/16227 , H01L2224/29 , H01L2224/2908 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29386 , H01L2224/32225 , H01L2224/812 , H01L2224/81801 , H01L2224/81894 , H01L2224/81907 , H01L2224/83801 , H01L2224/8383 , H01L2224/8384 , H01L2224/83907 , H01L2224/85205 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01063 , H01L2924/01064 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01105 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/04941 , H01L2924/0665 , H01L2924/09701 , H01L2924/12035 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/19041 , H01L2924/3025 , H01L2924/00 , H01L2924/01026 , H01L2924/3512 , H01L2924/0541 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
Abstract: An object of the invention is to provide a method for producing a conductive member having low electrical resistance, and the conductive member is obtained using a low-cost stable conductive material composition that does not contain an adhesive. A method for producing a semiconductor device in which silver or silver oxide provided on a surface of a base and silver or silver oxide provided on a surface of a semiconductor element are bonded, includes the steps of arranging a semiconductor element on a base such that silver or silver oxide provided on a surface of the semiconductor element is in contact with silver or silver oxide provided on a surface of the base, and bonding the semiconductor element and the base by applying heat having a temperature of 200 to 900° C. to the semiconductor device and the base.
Abstract translation: 本发明的目的是提供一种用于制造具有低电阻的导电构件的方法，并且使用不含粘合剂的低成本稳定的导电材料组合物获得导电构件。 一种制造半导体器件的方法，其中设置在基底表面上的银或氧化银和设置在半导体元件的表面上的银或银氧化物结合，包括以下步骤：将半导体元件布置在基底上，使得银 或设置在半导体元件的表面上的氧化银与设置在基板的表面上的银或氧化银接触，并且通过对温度为200〜900℃的热进行加热而将半导体元件和基板接合到 半导体器件和基极。
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公开(公告)号：US20130249127A1
公开(公告)日：2013-09-26
申请号：US13893924
申请日：2013-05-14
Applicant: Nichia Corporation
Inventor： Masaki HAYASHI , Hiroto TAMAKI , Masafumi KURAMOTO , Tomohide MIKI , Takayuki SANO , Tomohisa KISHIMOTO
IPC: B29D11/00
CPC classification number: B29C45/02 , B29C45/2806 , B29D11/0074 , B29K2063/00 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/181 , Y10T428/31511 , H01L2924/00012
Abstract: A light-emitting device includes a light-emitting element on a molded part. The molded part is formed by molding and curing a thermosetting epoxy resin composition comprising (A) the reaction product of a triazine derived epoxy resin with an acid anhydride, (B) an internal parting agent having m.p. 50-90° C., (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst.
Abstract translation: 发光装置在模制部件上包括发光元件。 模制部件通过模制和固化热固性环氧树脂组合物而形成，该热固性环氧树脂组合物包含（A）三嗪衍生的环氧树脂与酸酐的反应产物，（B）具有m.p。的内分离剂。 50-90℃，（C）反射剂，（D）无机填料和（E）固化催化剂。
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公开(公告)号：US20210323061A1
公开(公告)日：2021-10-21
申请号：US17229043
申请日：2021-04-13
Applicant: Nichia Corporation
Inventor： Teppei KUNIMUNE , Masafumi KURAMOTO
IPC: B22F3/26
Abstract: A method of impregnating voids of a sintered metal body having a porous structure with resin, the method comprising preparing a resin material that contains a defoamer containing hydrophilic or hydrophobic particles, defoaming the prepared resin material by reducing pressure of the resin material, applying the defoamed resin material onto a surface of the sintered metal body, impregnating the voids with the resin material by reducing pressure of the sintered metal body and the resin material applied to the surface of the sintered metal body so as to expel gas from the voids; and curing the resin material by heating.
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34.发明申请公开(公告)号：US20210193878A1
公开(公告)日：2021-06-24
申请号：US17193239
申请日：2021-03-05
Applicant: NICHIA CORPORATION
Inventor： Masafumi KURAMOTO , Tomohisa KISHIMOTO
Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c. The first resin molding 40 is formed from a thermosetting resin such as epoxy resin by the transfer molding process, and the second resin molding 50 is formed from a thermosetting resin such as silicone resin.
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35.发明申请公开(公告)号：US20210147695A1
公开(公告)日：2021-05-20
申请号：US17158295
申请日：2021-01-26
Applicant: NICHIA CORPORATION
Inventor： Teppei KUNIMUNE , Masafumi KURAMOTO
Abstract: There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm and further contains an anionic surfactant but is substantially free from resin.
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Patent Agency Ranking
公开(公告)号：US20200308405A1
公开(公告)日：2020-10-01
申请号：US16832210
申请日：2020-03-27
Applicant: NICHIA CORPORATION
Inventor： Masafumi KURAMOTO , Katsuyuki TSUNANO , Takuma ARIKAWA
Abstract: A silicone resin composition includes a silicone resin and a ceria-zirconia solid solution, with the solid solution being contained in a range of 0.01 to 2 parts by mass relative to 100 parts by mass of the silicone resin.
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37.发明申请公开(公告)号：US20200274034A1
公开(公告)日：2020-08-27
申请号：US15930687
申请日：2020-05-13
Applicant: NICHIA CORPORATION
Inventor： Masafumi KURAMOTO , Tomohisa KISHIMOTO
Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c. The first resin molding 40 is formed from a thermosetting resin such as epoxy resin by the transfer molding process, and the second resin molding 50 is formed from a thermosetting resin such as silicone resin.
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38.发明申请公开(公告)号：US20200212272A1
公开(公告)日：2020-07-02
申请号：US16724465
申请日：2019-12-23
Applicant: NICHIA CORPORATION
Inventor： Katsuyuki TSUNANO , Daisuke NIKI , Masafumi KURAMOTO
Abstract: A method for producing a light emitting device, including: integrally molding plural leads with a molded resin portion comprising a resin composition containing a thermosetting resin or a thermoplastic resin, so as to prepare a substrate having a concave portion having a side surface and a bottom surface; disposing a light emitting element on the bottom surface of the concave portion; forming a film including a metal oxide on the side surface of the concave portion and an upper surface of the substrate; disposing a sealing resin composition containing an addition curing silicone resin composition containing an organopolysiloxane containing a functional group capable of performing a crosslinking reaction and an aryl group in one molecule, and an organic modified silicone oil that is unreactive with the organopolysiloxane, in the concave portion; and curing the sealing resin composition to form a resin package.
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39.发明申请公开(公告)号：US20190273188A1
公开(公告)日：2019-09-05
申请号：US16356789
申请日：2019-03-18
Applicant: NICHIA CORPORATION
Inventor： Masafumi KURAMOTO , Tomohisa KISHIMOTO
Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c. The first resin molding 40 is formed from a thermosetting resin such as epoxy resin by the transfer molding process, and the second resin molding 50 is formed from a thermosetting resin such as silicone resin.
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公开(公告)号：US20150228875A1
公开(公告)日：2015-08-13
申请号：US14620309
申请日：2015-02-12
Applicant: NICHIA CORPORATION
Inventor： Yuji OKADA , Masafumi KURAMOTO
CPC classification number: H01L33/0095 , H01L33/505 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2933/005 , H01L2924/00014
Abstract: A light-emitting device includes lead frames, a light-emitting element placed on a bottom of a recessed portion formed at one of the lead frames, and a light-transmitting resin covering the light-emitting element. The lead frames have a covered region which is covered with the light-transmitting resin and an exposed region exposed out of the light-transmitting resin. The light-emitting device has a gap between the lead frame and the light-transmitting resin at an inner side surface of the recessed portion, the gap having a width longer than a main wavelength of light from the light-emitting element. The lead frame is in close contact with the light-transmitting resin at an end of the covered region, which is located in a boundary with the exposed region or in the vicinity of the boundary within the covered region.
Abstract translation: 发光装置包括引线框架，放置在形成在一个引线框架上的凹部的底部上的发光元件和覆盖发光元件的透光树脂。 引线框架具有被透光树脂覆盖的覆盖区域和从透光树脂露出的暴露区域。 所述发光装置在所述凹部的内侧面具有所述引线框与所述透光性树脂之间的间隙，所述间隙的宽度比来自所述发光元件的光的主波长长。 引线框架与覆盖区域的端部处的透光树脂紧密接触，覆盖区域位于与曝光区域的边界或覆盖区域内的边界附近。
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