公开(公告)号：US10825967B2

公开(公告)日：2020-11-03

申请号：US16447935

申请日：2019-06-20

Applicant: NICHIA CORPORATION

Inventor： Tadao Hayashi ,  Teruhito Azuma ,  Suguru Beppu ,  Kunihiro Izuno ,  Tsuyoshi Okahisa

IPC: H01L33/50 ,  H01L33/48 ,  H01L33/58 ,  H01L33/60

Abstract: A method of manufacturing a covering member includes: providing a first light-reflective member comprising a through-hole, the through-hole having first and second openings; arranging a light-transmissive resin containing a wavelength-conversion material within the through-hole; distributing the wavelength-conversion material predominantly on a side of the first opening of the through-hole within the light-transmissive resin; and after the step of distributing the wavelength-conversion material, removing a portion of the light-transmissive resin from a side of the second opening of the through-hole.

公开(公告)号：US10566504B2

公开(公告)日：2020-02-18

申请号：US15875226

申请日：2018-01-19

Applicant: NICHIA CORPORATION

Inventor： Tadao Hayashi

IPC: H01L33/48 ,  H01L33/62 ,  H01L25/075 ,  H01L33/54

Abstract: A composite board is provided with a board and a covering member. The board includes a base made of ceramics, first wiring provided on an upper surface of the base, and second wiring provided on a lower surface of the base and electrically connected to the first wiring. The covering member covers the base such that the first wiring and the second wiring are exposed.

公开(公告)号：US10559724B2

公开(公告)日：2020-02-11

申请号：US15783514

申请日：2017-10-13

Applicant: NICHIA CORPORATION

Inventor： Tadao Hayashi

IPC: H01L33/50 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62

Abstract: A light emitting device includes a light emitting element, a reflective member, and a covering member. The light emitting element includes a light extraction surface, an electrode-formed surface on a side opposite to the light extraction surface, lateral surfaces positioned between the light extraction surface and the electrode-formed surface, and a pair of electrodes on the electrode-formed surface. At least a part of the pair of the electrodes is exposed outside the light emitting device. The reflective member covers the lateral surfaces of the light emitting element while being in contact with at least a part of the light emitting element, the part of the pair of the electrodes being exposed from the reflective member. The covering member includes a lens portion on an upper surface thereof. The covering member covers the light emitting element and the reflective member while being in contact with the reflective member.

公开(公告)号：US10069045B2

公开(公告)日：2018-09-04

申请号：US15483269

申请日：2017-04-10

Applicant: NICHIA CORPORATION

Inventor： Takeshi Ikegami ,  Tadao Hayashi ,  Hiroto Tamaki

IPC: H01L33/50 ,  H01L33/48

Abstract: A method of manufacturing a light emitting device including: forming a supporting body on a mounting surface of each of semiconductor light emitting elements; arranging the semiconductor light emitting elements to be spaced apart from each other by a predetermined distance; and forming a wavelength conversion layer to continuously cover an upper surface and side surfaces of at least one of the semiconductor light emitting elements. The forming the wavelength conversion layer includes spraying a slurry provided by mixing particles of a wavelength conversion member and a thermosetting resin in a solvent onto the upper surface and the side surfaces of the semiconductor light emitting element, so that a thickness of the wavelength conversion layer at a lower portion of the side surfaces of the supporting body is smaller than the thickness on the upper surface and the side surfaces of the semiconductor light emitting element.

公开(公告)号：US09640734B2

公开(公告)日：2017-05-02

申请号：US14568256

申请日：2014-12-12

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Takeshi Ikegami ,  Tadaaki Ikeda ,  Tadao Hayashi ,  Hiroto Tamaki

IPC: H01L33/48 ,  H01L23/00 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L24/97 ,  H01L25/13 ,  H01L33/387 ,  H01L33/502 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

Abstract: Provided is a small and thin light emitting device which has no connection failure, a high life, high performance and good light extraction efficiency. The light emitting device includes a base body comprising a base material having a pair of connection terminals on at least a first main surface, a light emitting element connected to the connection terminals, and a sealing member that seals the light emitting element, wherein the base material has a linear expansion coefficient within ±10 ppm/° C. of the linear expansion coefficient of the light emitting element.

公开(公告)号：US09425367B2

公开(公告)日：2016-08-23

申请号：US14802317

申请日：2015-07-17

Applicant: NICHIA CORPORATION

Inventor： Tadao Hayashi ,  Takuya Nakabayashi

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/00 ,  H01L33/10 ,  H01L33/08 ,  H01L25/075 ,  H01L25/00 ,  H01L33/58

CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L25/0756 ,  H01L25/50 ,  H01L33/005 ,  H01L33/08 ,  H01L33/10 ,  H01L33/50 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2924/00

Abstract: A light emitting device includes a flip-chip mounted type light emitting element, a phosphor-containing member, and a first reflecting member. The flip-chip mounted type light emitting element has a pair of electrodes disposed on a bottom surface side. The phosphor-containing member is provided at least above the light emitting element and separated from the light emitting element. The first reflecting member is configured to cover the phosphor-containing member. An opening is in at least one of side faces of the light emitting device, the opening extracting light emitted from the light emitting element and light whose wavelength is converted by the phosphor-containing member.

Abstract translation: 发光装置包括倒装芯片安装型发光元件，含荧光体的构件和第一反射构件。 倒装芯片安装型发光元件具有设置在底面侧的一对电极。 含荧光体的构件至少设置在发光元件的上方并与发光元件分离。 第一反射部件被构造成覆盖含荧光体的部件。 开口处在发光装置的侧面中的至少一个面上，从发光元件发射的开口提取光和由含荧光体的构件转换波长的光。

公开(公告)号：US20150325756A1

公开(公告)日：2015-11-12

申请号：US14802317

申请日：2015-07-17

Applicant: NICHIA CORPORATION

Inventor： Tadao Hayashi ,  Takuya Nakabayashi

IPC: H01L33/50 ,  H01L25/00 ,  H01L33/08 ,  H01L25/075 ,  H01L33/00 ,  H01L33/10

CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L25/0756 ,  H01L25/50 ,  H01L33/005 ,  H01L33/08 ,  H01L33/10 ,  H01L33/50 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2924/00

Abstract: A light emitting device includes a flip-chip mounted type light emitting element, a phosphor-containing member, and a first reflecting member. The flip-chip mounted type light emitting element has a pair of electrodes disposed on a bottom surface side. The phosphor-containing member is provided at least above the light emitting element and separated from the light emitting element. The first reflecting member is configured to cover the phosphor-containing member. An opening is in at least one of side faces of the light emitting device, the opening extracting light emitted from the light emitting element and light whose wavelength is converted by the phosphor-containing member.

Abstract translation: 发光装置包括倒装芯片安装型发光元件，含荧光体的构件和第一反射构件。 倒装芯片安装型发光元件具有设置在底面侧的一对电极。 含荧光体的构件至少设置在发光元件的上方并与发光元件分离。 第一反射部件被构造成覆盖含荧光体的部件。 开口处在发光装置的侧面中的至少一个面上，从发光元件发射的开口提取光和由含荧光体的构件转换波长的光。