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124 条记录 (耗时 0.022 秒)

    Electronic assembly with detachable coolant manifold and coolant-cooled electronic module
    33.
    发明授权
    Electronic assembly with detachable coolant manifold and coolant-cooled electronic module 有权
    具有可拆卸冷却液歧管和冷却剂冷却电子模块的电子组件

    公开(公告)号：US08937810B2

    公开(公告)日：2015-01-20

    申请号：US13616337

    申请日：2012-09-14

    申请人： Thomas J. Brunschwiler ,  Evan G. Colgan ,  Michael J. Ellsworth, Jr. ,  Werner Escher ,  Ingmar G. Meijer ,  Stephan Paredes ,  Gerd Schlottig ,  Martin Witzig ,  Jeffrey A. Zitz

    发明人： Thomas J. Brunschwiler ,  Evan G. Colgan ,  Michael J. Ellsworth, Jr. ,  Werner Escher ,  Ingmar G. Meijer ,  Stephan Paredes ,  Gerd Schlottig ,  Martin Witzig ,  Jeffrey A. Zitz

    IPC分类号： H05K7/20 ,  H01L23/46

    CPC分类号： H05K7/20772 ,  Y10T29/49002

    摘要： Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic components and one or more coolant-carrying channels integrated within the module and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure, which includes a coolant inlet and outlet in fluid communication with the coolant-carrying channel(s) of the electronic module, facilitates flow of coolant through the coolant-carrying channel, and thus cooling of the electronic component(s). Coolant-absorbent material is positioned at the interface between the electronic module and the manifold structure to facilitate absorbing any excess coolant during a stepwise detaching of the manifold structure from the electronic module.

    摘要翻译： 提供了冷却的电子组件，以及一种解耦冷却的电子组件的方法。 在一个实施例中，组件包括冷却剂冷却的电子模块，其具有一个或多个电子部件和一个或多个集成在模块内的冷却剂传送通道并且被配置为便于冷却剂流过模块以冷却电子部件。 此外，组件包括可拆卸地联接到电子模块的冷却剂歧管结构。 歧管结构包括与电子模块的冷却剂输送通道流体连通的冷却剂入口和出口，有利于冷却剂流过冷却剂输送通道，从而冷却电子部件。 冷却剂吸收材料位于电子模块和歧管结构之间的界面处，以便于在将歧管结构从电子模块逐步拆卸时吸收任何多余的冷却剂。

    Compliant mold fill head with integrated cavity venting and solder cooling
    37.
    发明授权
    Compliant mold fill head with integrated cavity venting and solder cooling 有权
    具有集成腔体排气和焊锡冷却的合适的模具填充头

    公开(公告)号：US08011563B2

    公开(公告)日：2011-09-06

    申请号：US11696753

    申请日：2007-04-05

    申请人： Russell A. Budd ,  Evan G. Colgan ,  Peter A. Gruber ,  Gareth G. Hougham ,  John P. Karidis

    发明人： Russell A. Budd ,  Evan G. Colgan ,  Peter A. Gruber ,  Gareth G. Hougham ,  John P. Karidis

    IPC分类号： B23K31/02 ,  B23K37/00

    CPC分类号： B23K3/0607 ,  B23K2101/40

    摘要： A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configured to interface with cavities in a mold plate, the at least one aperture being in fluid communication with the solder delivery head. The compliant portion is configured and dimensioned to urge the dispensing region against the mold plate when held a predetermined distance therefrom and to substantially tolerate variations in flatness of the mold plate, variations in the predetermined distance, and/or variations in an angular orientation of the interface portion and the mold plate.

    摘要翻译： 模具填充头包括焊料输送头和具有固定到焊料输送头的顺应部分和与柔顺部分相关联的分配区域的界面部分。 分配区域形成有至少一个孔，其被配置为与模板中的空腔相接触，所述至少一个孔与焊料输送头流体连通。 顺应部分的构造和尺寸被设计成当从其延伸预定距离时将分配区域推靠在模板上，并且基本上容许模板的平坦度变化，预定距离的变化和/或角度取向的变化 界面部分和模板。

    Methods for encapsulating microelectromechanical (MEM) devices on a wafer scale
    39.
    发明授权
    Methods for encapsulating microelectromechanical (MEM) devices on a wafer scale 有权
    将微机电（MEM）器件封装在晶片上的方法

    公开(公告)号：US07863070B2

    公开(公告)日：2011-01-04

    申请号：US12049836

    申请日：2008-03-17

    申请人： Evan G. Colgan ,  Bruce K. Furman ,  Christopher V. Jahnes

    发明人： Evan G. Colgan ,  Bruce K. Furman ,  Christopher V. Jahnes

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00293 ,  B81C2203/0145

    摘要： Apparatus and methods are provided for enabling wafer-scale encapsulation of microelectromechanical (MEM) devices (e.g., resonators, filters) to protect the MEMs from the ambient and to provide either a controlled ambient or a reduced pressure. In particular, methods for wafer-scale encapsulation of MEM devices are provided, which enable encapsulation of MEM devices under desired ambient conditions that are not determined by the deposition conditions of a sealing process in which MEM release via holes are sealed or pinched-off, and which prevent sealing material from being inadvertently deposited on the MEM device during the sealing process.

    摘要翻译： 提供了设备和方法，用于实现微机电（MEM）装置（例如，谐振器，滤波器）的晶片级封装，以保护MEM免受环境影响，并提供受控的环境或减压。 特别地，提供了用于MEM器件的晶片级封装的方法，其能够在期望的环境条件下封装MEM器件，所述环境条件不是通过其中MEM释放通孔被密封或夹断的密封工艺的沉积条件来确定的， 并且其在密封过程中防止密封材料被无意中沉积在MEM装置上。