Producing a vertical transistor including reentrant profile
    33.
    发明授权
    Producing a vertical transistor including reentrant profile 有权
    生产垂直晶体管,包括折入型材

    公开(公告)号:US08623757B2

    公开(公告)日:2014-01-07

    申请号:US13248560

    申请日:2011-09-29

    IPC分类号: H01L21/336

    CPC分类号: H01L29/78642

    摘要: Producing a vertical transistor includes providing a substrate including a gate material layer stack with a reentrant profile. A patterned deposition inhibiting material is deposited over a portion of the gate material layer stack and over a portion of the substrate. An electrically insulating material layer is deposited over a portion of the gate material layer stack and over a portion of the substrate using a selective area deposition process in which the electrically insulating material layer is not deposited over the patterned deposition inhibiting material. A semiconductor material layer is deposited over the electrically insulating material layer.

    摘要翻译: 制造垂直晶体管包括提供包括具有折入轮廓的栅极材料层叠层的衬底。 图案化的沉积抑制材料沉积在栅极材料层堆叠的一部分上并在衬底的一部分上方。 使用选择性区域沉积工艺在栅极材料层堆叠的一部分上并在衬底的一部分上沉积电绝缘材料层,其中电绝缘材料层不沉积在图案化的沉积抑制材料上。 在电绝缘材料层上沉积半导体材料层。

    Producing a vertical transistor including reentrant profile
    34.
    发明授权
    Producing a vertical transistor including reentrant profile 有权
    生产垂直晶体管,包括折入型材

    公开(公告)号:US08273654B1

    公开(公告)日:2012-09-25

    申请号:US13248576

    申请日:2011-09-29

    IPC分类号: H01L21/4763

    CPC分类号: H01L29/78642

    摘要: Producing a vertical transistor includes providing a substrate including a gate material layer stack with a reentrant profile. An electrically insulating material layer is deposited over a portion of the gate material layer stack and over a portion of the substrate. A patterned deposition inhibiting material is deposited over the electrically insulating material layer. A semiconductor material layer is deposited over the electrically insulating material layer using a selective area deposition process in which the semiconductor material layer is not deposited over the patterned deposition inhibiting material.

    摘要翻译: 制造垂直晶体管包括提供包括具有折入轮廓的栅极材料层叠层的衬底。 电绝缘材料层沉积在栅极材料层堆叠的一部分上并在衬底的一部分上方。 图案化的沉积抑制材料沉积在电绝缘材料层上。 使用选择性区域沉积工艺在电绝缘材料层上沉积半导体材料层,其中半导体材料层不沉积在图案化的沉积抑制材料上。

    Delivery device for deposition
    37.
    发明授权
    Delivery device for deposition 有权
    用于沉积的输送装置

    公开(公告)号:US08420168B2

    公开(公告)日:2013-04-16

    申请号:US13466507

    申请日:2012-05-08

    摘要: A delivery device for thin-film material deposition has at least first, second, and third inlet ports for receiving a common supply for a first, a second and a third gaseous material, respectively. Each of the first, second, and third elongated emissive channels allow gaseous fluid communication with one of corresponding first, second, and third inlet ports. The delivery device can be formed from apertured plates, superposed to define a network of interconnecting supply chambers and directing channels for routing each of the gaseous materials from its corresponding inlet port to a corresponding plurality of elongated emissive channels. The delivery device comprises a diffusing channel formed by a relief pattern between facing plates. Also disclosed is a process for thin film deposition. Finally, more generally, a flow diffuser and a corresponding method of diffusing flow is disclosed.

    摘要翻译: 用于薄膜材料沉积的递送装置具有至少第一,第二和第三入口端口,用于分别接收用于第一,第二和第三气态材料的共同供应。 第一,第二和第三细长发射通道中的每一个允许与对应的第一,第二和第三入口端口之一的气态流体连通。 输送装置可以由孔板形成,叠加以形成互连供应室的网络,并且引导通道用于将每个气态材料从其相应的入口端口路由到相应的多个细长的发射通道。 输送装置包括由相对板之间的浮雕图案形成的扩散通道。 还公开了一种用于薄膜沉积的方法。 最后,更一般地,公开了一种流扩散器和相应的扩散流的方法。

    Multicolored mask process for making display circuitry
    39.
    发明授权
    Multicolored mask process for making display circuitry 有权
    用于制作显示电路的多彩蒙版工艺

    公开(公告)号:US08153352B2

    公开(公告)日:2012-04-10

    申请号:US11986088

    申请日:2007-11-20

    IPC分类号: G03F7/20

    摘要: A process for forming a pixel circuit is disclosed comprising: (a) providing a transparent support; (b) forming a multicolor mask having at least four different color patterns; (c) forming integrated electronic components of the pixel circuit having at least four layers of patterned functional material comprising a first conductor, a dielectric, a semiconductor, and a second conductor each layer of patterned functional material corresponding to the four different color patterns of the multicolor mask. The functional material is patterned using a photopattern corresponding to each color pattern.

    摘要翻译: 公开了一种用于形成像素电路的工艺,包括:(a)提供透明支撑体; (b)形成具有至少四种不同颜色图案的多色蒙版; (c)形成像素电路的集成电子部件,其具有至少四层图案化的功能材料,其包括第一导体,电介质,半导体和第二导体,每层图案化的功能材料层对应于四个不同颜色图案 多色面膜 使用对应于每个颜色图案的光图案来对功能材料进行图案化。

    PROCESS FOR FORMING THIN FILM ENCAPSULATION LAYERS
    40.
    发明申请
    PROCESS FOR FORMING THIN FILM ENCAPSULATION LAYERS 有权
    形成薄膜包封层的方法

    公开(公告)号:US20120070942A1

    公开(公告)日:2012-03-22

    申请号:US13303513

    申请日:2011-11-23

    IPC分类号: H01L21/56

    摘要: A thin film environmental barrier encapsulation process includes providing an electronic device on a substrate, a first reactant gaseous material, a second reactant gaseous material, an inert gaseous material; and a delivery head through which the reactant gaseous materials and the inert gaseous material are simultaneously directed toward the electronic device and the substrate. One or more of the reactant gaseous materials and the inert gaseous material flows through the delivery head. The flow of the one or more of the reactant gaseous materials and the inert gaseous material generates a pressure to create a gas fluid bearing that maintains a substantially uniform distance between the delivery head and the substrate. Relative motion between the delivery head and the substrate causes the second reactant gaseous material to react with at least a portion of the electronic device and the substrate that has been treated with the first reactant gaseous material.

    摘要翻译: 薄膜环境屏障封装方法包括在基底上提供电子器件,第一反应物气态材料,第二反应物气态物质,惰性气态物质; 以及输送头,反应物气体材料和惰性气体材料通过该输送头同时朝向电子装置和基板。 一种或多种反应物气态物质和惰性气体物质流过输送头。 一种或多种反应物气态物质和惰性气体物质的流动产生压力以产生在输送头和基底之间保持基本均匀距离的气体流体轴承。 输送头和基底之间的相对运动导致第二反应物气态物质与已经用第一反应物气态物质处理的电子器件和基底的至少一部分反应。