公开(公告)号：US09696157B2

公开(公告)日：2017-07-04

申请号：US14750840

申请日：2015-06-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Luca Giuseppe Falorni ,  Carlo Valzasina ,  Roberto Carminati ,  Alessandro Tocchio

IPC: G01C19/00 ,  G01C19/5712 ,  B81B3/00 ,  G01C19/5733 ,  G01C19/5747

CPC classification number: G01C19/5712 ,  B81B3/0018 ,  B81B3/0086 ,  B81B2201/025 ,  B81B2203/0163 ,  G01C19/5733 ,  G01C19/5747

Abstract: MEMS device having a support region elastically carrying a suspended mass through first elastic elements. A tuned dynamic absorber is elastically coupled to the suspended mass and configured to dampen quadrature forces acting on the suspended mass at the natural oscillation frequency of the dynamic absorber. The tuned dynamic absorber is formed by a damping mass coupled to the suspended mass through second elastic elements. In an embodiment, the suspended mass and the damping mass are formed in a same structural layer, for example of semiconductor material, and the damping mass is surrounded by the suspended mass.

公开(公告)号：US20160320425A1

公开(公告)日：2016-11-03

申请号：US14971155

申请日：2015-12-16

Applicant: STMicroelectronics S.r.l.

Inventor： Francesco Procopio ,  Carlo Valzasina

IPC: G01P15/09 ,  H01L41/27 ,  H01L41/25

CPC classification number: G01P15/09 ,  G01L1/16 ,  G01P15/0922 ,  G01P2015/0817 ,  H01L41/1132 ,  H01L41/25 ,  H01L41/27 ,  H01L41/332

Abstract: The piezoelectric sensor is formed in a semiconductor material chip having a surface defining a plane and integrating a structure for sensing forces acting in the plane. The chip is formed by a substrate defining a cantilever having a first end, constrained to an anchorage portion of the substrate, and a second end, which is free to bend under the action of external forces. The cantilever has first and second longitudinal halves, each carrying a respective strip element of piezoelectric material, which extends parallel to the chip plane.

Abstract translation: 压电传感器形成在具有限定平面的表面并且集成用于感测作用在平面中的力的结构的半导体材料芯片中。 芯片由限定悬臂的基板形成，该悬臂具有被限制到基板的锚定部分的第一端和在外力作用下自由弯曲的第二端。 悬臂具有第一和第二纵向半部，每个具有平行于芯片平面延伸的压电材料的相应带状元件。

公开(公告)号：US20140230546A1

公开(公告)日：2014-08-21

申请号：US13922033

申请日：2013-06-19

Applicant: STMicroelectronics S.r.l.

Inventor： Giorgio Allegato ,  Barbara Simoni ,  Carlo Valzasina ,  Lorenzo Corso

IPC: B81B7/00

CPC classification number: B81B7/0074 ,  B81B7/007 ,  B81B7/008 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/012 ,  B81B2207/015 ,  B81B2207/07 ,  B81B2207/092 ,  B81B2207/093 ,  B81B2207/096 ,  B81B2207/097 ,  B81C1/0023 ,  B81C2203/0118 ,  B81C2203/0792 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.

Abstract translation: 微机电装置包括：容纳微机电结构的主体; 以及盖，其结合到主体并通过导电接合区域电耦合到微机电结构。 盖包括选择模块，其具有耦合到微机电结构的第一选择端子，第二选择端子和至少一个控制端子，并且可以通过控制端子控制以将第二选择端子耦合到相应的第一选择端子， 选择性地，对应于相应的操作条件的多个耦合配置之一。

公开(公告)号：US12050102B2

公开(公告)日：2024-07-30

申请号：US17025977

申请日：2020-09-18

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Gabriele Gattere ,  Carlo Valzasina ,  Enri Duqi

IPC: B81B7/00 ,  G01B7/16 ,  G01L1/14 ,  H01G5/01 ,  H01G5/16 ,  H01H1/00 ,  H03K17/975 ,  G06F3/044

CPC classification number: G01B7/22 ,  B81B7/0058 ,  G01L1/14 ,  H01G5/01 ,  H01G5/16 ,  H01H1/0036 ,  H03K17/975 ,  B81B2201/0221 ,  B81B2201/0292 ,  B81B2203/0154 ,  B81B2203/0181 ,  B81B2203/0307 ,  B81B2203/04 ,  B81B2203/056 ,  B81B2207/012 ,  G06F3/044

Abstract: A button device includes a MEMS sensor having a MEMS strain detection structure and a deformable substrate configured to undergo deformation under the action of an external force. The MEMS strain detection structure includes a mobile element carried by the deformable substrate via at least a first and a second anchorage, the latter fixed with respect to the deformable substrate and configured to displace and generate a deformation force on the mobile element in the presence of the external force; and stator elements capacitively coupled to the mobile element. The deformation of the mobile element causes a capacitance variation between the mobile element and the stator elements. Furthermore, the MEMS sensor is configured to generate detection signals correlated to the capacitance variation.

公开(公告)号：US11313681B2

公开(公告)日：2022-04-26

申请号：US16655096

申请日：2019-10-16

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Gabriele Gattere ,  Carlo Valzasina ,  Luca Giuseppe Falorni

IPC: G01C19/00 ,  G01C19/5747 ,  G01C19/5712 ,  H01G5/011 ,  G01C25/00 ,  B81C1/00 ,  G01C19/58

Abstract: A multi-axis MEMS gyroscope includes a micromechanical detection structure having a substrate, a driving-mass arrangement, a driven-mass arrangement with a central window, and a sensing-mass arrangement which undergoes sensing movements in the presence of angular velocities about a first horizontal axis and a second horizontal axis. A sensing-electrode arrangement is fixed with respect to the substrate and is set underneath the sensing-mass arrangement. An anchorage assembly is set within the central window for constraining the driven-mass arrangement to the substrate at anchorage elements. The anchorage assembly includes a rigid structure suspended above the substrate that is elastically coupled to the driven mass by elastic connection elements at a central portion, and is coupled to the anchorage elements by elastic decoupling elements at end portions thereof.

公开(公告)号：US10809280B2

公开(公告)日：2020-10-20

申请号：US16116467

申请日：2018-08-29

Applicant: STMicroelectronics S.r.l.

Inventor： Alessandro Tocchio ,  Francesco Rizzini ,  Carlo Valzasina ,  Giacomo Langfelder ,  Cristiano Rocco Marra

IPC: G01P15/125 ,  G01C19/5719 ,  G01P15/08 ,  G01P15/18 ,  G01P15/097

Abstract: An inertial sensor for sensing an external acceleration includes: a first and a second proof mass; a first and a second capacitor formed between first and second fixed electrodes and the first proof mass; a third and a fourth capacitor formed between third and fourth fixed electrodes and the second proof mass; a driving assembly configured to cause an antiphase oscillation of the first and second proof masses; a biasing circuit configured to bias the first and third capacitors, thus generating first variation of the oscillation frequency in a first time interval, and to bias the second and fourth capacitors, thus generating first variation of the oscillation frequency in a second time interval; a sensing assembly, configured to generate an differential output signal which is a function of a difference between a value of the oscillating frequency during the first time interval and a value of the oscillating frequency during the second time interval. Such differential output signal can be correlated to the value and direction of the external acceleration.

公开(公告)号：US10598690B2

公开(公告)日：2020-03-24

申请号：US14964469

申请日：2015-12-09

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Barbara Simoni ,  Carlo Valzasina

IPC: G01P15/18 ,  G01C19/574 ,  G01P15/125

Abstract: A microelectromechanical device includes: a supporting structure; two sensing masses, movable with respect to the supporting structure according to a first axis and a respective second axis; a driving device for maintaining the sensing masses in oscillation along the first axis in phase opposition; sensing units for supplying sensing signals indicative of displacements respectively of the sensing masses according to the respective second axis; processing components for combining the sensing signals so as to: in a first sensing mode, amplify effects on the sensing signals of concordant displacements and attenuate effects of discordant displacements of the sensing masses; and in a second sensing mode, amplify effects on the sensing signals of discordant displacements and attenuate effects of concordant displacements of the sensing masses.

公开(公告)号：US20190131952A1

公开(公告)日：2019-05-02

申请号：US16171885

申请日：2018-10-26

Applicant: STMicroelectronics S.r.l.

Inventor： Carlo Valzasina ,  Gabriele Gattere ,  Alessandro Tocchio ,  Giacomo Langfelder

IPC: H03H9/02 ,  H03B5/30

Abstract: A MEMS resonator system has a micromechanical resonant structure and an electronic processing circuit including a first resonant loop that excites a first vibrational mode of the structure and generates a first signal at a first resonance frequency. A compensation module compensates, as a function of a measurement of temperature variation, a first variation of the first resonance frequency caused by the temperature variation to generate a clock signal at a desired frequency that is stable relative to temperature. The electronic processing circuit further includes a second resonant loop, which excites a second vibrational mode of the structure and generates a second signal at a second resonance frequency. A temperature-sensing module receives the first and second signals and generates the measurement of temperature variation as a function of the first variation of the first resonance frequency and a second variation of the second resonance frequency caused by the temperature variation.

公开(公告)号：US10180324B2

公开(公告)日：2019-01-15

申请号：US15197414

申请日：2016-06-29

Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS, INC. ,  STMICROELECTRONICS INTERNATIONAL N.V.

Inventor： Carlo Valzasina ,  Huantong Zhang ,  Matteo Fabio Brunetto ,  Gert Ingvar Andersson ,  Erik Daniel Svensson ,  Nils Einar Hedenstierna

IPC: G01C19/56 ,  G01P9/04 ,  G01C19/574 ,  G01C19/5719 ,  G01C19/5776

Abstract: A gyroscope includes a substrate, a first structure, a second structure and a third structure elastically coupled to the substrate and movable along a first axis. The first and second structure are arranged at opposite sides of the third structure with respect to the first axis A driving system is configured to oscillate the first and second structure along the first axis in phase with one another and in phase opposition with the third structure. The first, second and third structure are provided with respective sets of sensing electrodes, configured to be displaced along a second axis perpendicular to the first axis in response to rotations of the substrate about a third axis perpendicular to the first axis and to the second axis.

公开(公告)号：US20180342998A1

公开(公告)日：2018-11-29

申请号：US15976611

申请日：2018-05-10

Applicant: STMicroelectronics S.r.l.

Inventor： Gabriele Gattere ,  Lorenzo Corso ,  Alessandro Tocchio ,  Carlo Valzasina

IPC: H03H9/02 ,  H03H9/24

CPC classification number: H03H9/02448 ,  H03H3/0076 ,  H03H9/02259 ,  H03H9/02338 ,  H03H9/2405 ,  H03H9/2431 ,  H03H9/2447 ,  H03H2009/02322 ,  H03H2009/02496

Abstract: A microelectromechanical device having a mobile structure including mobile arms formed from a composite material and having a fixed structure including fixed arms capacitively coupled to the mobile arms. The composite material includes core regions of insulating material and a silicon coating.