公开(公告)号：US07672122B2

公开(公告)日：2010-03-02

申请号：US12033278

申请日：2008-02-19

Applicant: Wei-Hung Lin ,  Yu-Ting Tseng ,  Hung-Yi Chung

Inventor： Wei-Hung Lin ,  Yu-Ting Tseng ,  Hung-Yi Chung

IPC: H05K5/00

CPC classification number: H05K5/0278 ,  Y10T29/49826

Abstract: A flash memory disk includes a holder, a plug, a housing and a pulling ring. The plug is joined with the holder and exposed out of the holder. The housing has a containing space for accommodating the holder and the plug, wherein two sides opposite to each other respectively have a through sliding groove and the third side of the housing there has an opening. The two arms of the pulling ring have sliding blocks, and the sliding blocks are moveable and matched with the through sliding grooves, wherein the pulling ring is rotated about the axis connecting both the sliding blocks, and when the sliding blocks of the pulling ring is moved, the holder would be located between a first position where the plug is entirely accommodated in the containing space and a second position where the plug is entirely protruded out of the opening.

Abstract translation: 闪存盘包括保持器，插头，壳体和拉环。 插头与支架连接并露出支架。 壳体具有用于容纳保持器和插头的容纳空间，其中彼此相对的两侧分别具有通过滑动槽，并且壳体的第三侧具有开口。 牵引环的两个臂具有滑动块，并且滑动块可移动并与通过滑动槽匹配，其中拉环围绕连接两个滑动块的轴线旋转，并且当拉环的滑块为 移动时，支架将位于插头完全容纳在容纳空间中的第一位置和插头完全突出于开口的第二位置之间。

公开(公告)号：US20080210459A1

公开(公告)日：2008-09-04

申请号：US12039997

申请日：2008-02-29

Applicant: Wei-Hung Lin

Inventor： Wei-Hung Lin

IPC: H05K1/09

CPC classification number: H05K1/0271 ,  H05K3/108 ,  H05K3/4644 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2201/2018

Abstract: The invention provides a warpage-proof circuit board structure, including: an inner layer circuit board; at least one dielectric layer formed on at least one surface of the inner layer circuit board; at least one first groove formed in the at least one dielectric layer corresponding in position thereto; a solder mask formed on the surface of the dielectric layer, a second groove formed in the solder mask and corresponding in position to the first groove formed in the dielectric layer; and a metal frame formed in the first and second grooves and protruding from the surface of the solder mask, thereby strengthening the circuit board to prevent it from warping in thermal processing and further using the metal frame as a heat-dissipating means for the package structure.

Abstract translation: 本发明提供一种抗翘曲电路板结构，包括：内层电路板; 形成在所述内层电路板的至少一个表面上的至少一个电介质层; 形成在所述至少一个电介质层中的至少一个第一凹槽对应于其中; 形成在所述电介质层的表面上的焊料掩模，形成在所述焊料掩模中并对应于形成在所述电介质层中的所述第一沟槽的位置的第二沟槽; 以及金属框架，形成在第一槽和第二槽中并且从焊接掩模的表面突出，从而加强电路板以防止其在热加工中翘曲，并且进一步使用金属框作为用于封装结构的散热装置 。

公开(公告)号：US20080038940A1

公开(公告)日：2008-02-14

申请号：US11500932

申请日：2006-08-09

Applicant: Li-Sen Chen ,  Chuan-Shien Yu ,  Wei-Hung Lin

Inventor： Li-Sen Chen ,  Chuan-Shien Yu ,  Wei-Hung Lin

IPC: H05K1/00

CPC classification number: H01R9/0518

Abstract: A wire core of a coaxial cable is tightly bonded with a terminal. A pressing member is used to press the wire core toward the terminal. By doing so, better electrical characteristics are acquired.

Abstract translation: 同轴电缆的芯线与端子紧密接合。 使用按压构件将线芯朝向端子按压。 通过这样做，获得更好的电特性。

公开(公告)号：US09776048B2

公开(公告)日：2017-10-03

申请号：US14716778

申请日：2015-05-19

Applicant: Wei-Hung Lin

Inventor： Wei-Hung Lin

IPC: F21V7/04 ,  H01L33/00 ,  A63B43/06 ,  F21V33/00 ,  F21V8/00 ,  F21W131/40 ,  A63B69/00 ,  A63B102/18 ,  F21Y115/10

CPC classification number: A63B43/06 ,  A63B2069/0004 ,  A63B2102/18 ,  A63B2207/02 ,  F21V33/008 ,  F21W2131/40 ,  F21Y2115/10 ,  G02B6/00 ,  G02B6/0096

Abstract: A modified sphere structure including: a sphere body with a groove formed on a surface of the sphere body along a distribution path; a light source module disposed in a containing space of the sphere body, wherein the groove is connected to the containing space to define a light releasing space and light emitted from the light source passes through the light releasing space; and a light guiding member filling to the light releasing space to allow the light emitted from the light source to be distributed on the light guiding member along the distribution path and transmitted to outside of the sphere body.

公开(公告)号：US09349663B2

公开(公告)日：2016-05-24

申请号：US13539136

申请日：2012-06-29

Applicant: Meng-Tse Chen ,  Yu-Chih Liu ,  Hui-Min Huang ,  Wei-Hung Lin ,  Jing Ruei Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Yu-Chih Liu ,  Hui-Min Huang ,  Wei-Hung Lin ,  Jing Ruei Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L25/065

CPC classification number: H01L25/0652 ,  H01L21/561 ,  H01L21/563 ,  H01L23/00 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/562 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2924/15311

Abstract: A package on package structure providing mechanical strength and warpage control includes a first package component, a second package component, and a first set of conductive elements coupling the first package component to the second package component. A first polymer-comprising material is molded on the first package component and surrounds the first set of conductive elements. The first polymer-comprising material has an opening therein exposing a top surface of the second package component. A third package component and a second set of conductive elements couples the second package component to the third package component.

Abstract translation: 提供机械强度和翘曲控制的封装结构的封装包括第一封装元件，第二封装元件和将第一封装元件连接到第二封装元件的第一组导电元件。 第一含聚合物的材料被模制在第一包装部件上并包围第一组导电元件。 第一含聚合物的材料在其中具有露出第二包装部件的顶表面的开口。 第三包装部件和第二组导电元件将第二包装部件耦合到第三包装部件。

公开(公告)号：US08927391B2

公开(公告)日：2015-01-06

申请号：US13118108

申请日：2011-05-27

Applicant: Meng-Tse Chen ,  Wei-Hung Lin ,  Sheng-Yu Wu ,  Chun-Cheng Lin ,  Kuei-Wei Huang ,  Yu-Peng Tsai ,  Chih-Wei Lin ,  Wen-Hsiung Lu ,  Hsiu-Jen Lin ,  Bor-Ping Jang ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Wei-Hung Lin ,  Sheng-Yu Wu ,  Chun-Cheng Lin ,  Kuei-Wei Huang ,  Yu-Peng Tsai ,  Chih-Wei Lin ,  Wen-Hsiung Lu ,  Hsiu-Jen Lin ,  Bor-Ping Jang ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L21/30 ,  H01L21/56 ,  H01L25/00 ,  H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L24/17 ,  H01L21/565 ,  H01L21/566 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16055 ,  H01L2224/16113 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1304 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/00

Abstract: A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film.

Abstract translation: 包装方法包括将包装部件放置在脱模膜上，其中包装部件表面上的焊球与剥离膜物理接触。 接下来，填充在剥离膜和包装部件之间的模塑料固化，其中在固化步骤期间，焊球与剥离膜保持物理接触。

公开(公告)号：US20130107440A1

公开(公告)日：2013-05-02

申请号：US13315288

申请日：2011-12-09

Applicant: Wei-Hung Lin ,  Hung-I Chung

Inventor： Wei-Hung Lin ,  Hung-I Chung

IPC: G06F1/16 ,  H05K3/32 ,  H05K3/30

CPC classification number: G06F1/16 ,  G11C5/00 ,  H01L25/00 ,  H01L25/0655 ,  H01L2924/0002 ,  H01R12/725 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/10159 ,  H05K2201/10189 ,  Y10T29/49146 ,  H01L2924/00

Abstract: A storage device including a circuit board, an electronic device package and a terminal module is provided. The circuit board has a first surface and a second surface opposite to each other, a plurality of via-holes connecting the first surface and the second surface, a plurality of first pads on the first surface, and a plurality of first pads on the second surface. The electronic device package is disposed on the first surface. The terminal module disposed on the first surface has a plurality of first and second contact parts, and each of the first contact parts passes through the corresponding via-hole and is protruded out of the second surface, and each of the second contact parts is electrically connected to the corresponding first pad. An orthogonal projection area of the electronic device package on the first surface is smaller than an area of the first surface.

Abstract translation: 提供一种包括电路板，电子装置封装和端子模块的存储装置。 电路板具有彼此相对的第一表面和第二表面，连接第一表面和第二表面的多个通孔，第一表面上的多个第一焊盘和第二表面上的多个第一焊盘 表面。 电子器件封装设置在第一表面上。 设置在第一表面上的端子模块具有多个第一和第二接触部分，并且每个第一接触部分穿过相应的通孔并且突出到第二表面之外，并且每个第二接触部分是电 连接到相应的第一个焊盘。 电子器件封装在第一表面上的正交投影区域小于第一表面的面积。

公开(公告)号：US08360303B2

公开(公告)日：2013-01-29

申请号：US12841882

申请日：2010-07-22

Applicant: Kuei-Wei Huang ,  Wei-Hung Lin ,  Lin-Wei Wang ,  Bor-Ping Jang ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Kuei-Wei Huang ,  Wei-Hung Lin ,  Lin-Wei Wang ,  Bor-Ping Jang ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: B23K31/02 ,  H01L21/44

CPC classification number: B23K31/02 ,  B23K1/0016 ,  H01L21/563 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05166 ,  H01L2224/05647 ,  H01L2224/13147 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/75302 ,  H01L2224/75824 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/81947 ,  H01L2225/06513 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2203/082 ,  Y02P70/613 ,  Y10T428/24612 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of forming a bump structure includes providing a first work piece including a dielectric layer having a top surface; placing a second work piece facing the first work piece; placing a heating tool contacting the second work piece; and heating the second work piece using the heating tool to perform a reflow process. A first solder bump between the first and the second work pieces is melted to form a second solder bump. Before the second solder bump solidifies, pulling the second work piece away from the first work piece, until an angle formed between a tangent line of the second solder bump and the top surface of the dielectric layer is greater than about 50 degrees, wherein the tangent line is drawn at a point where the second solder bump joins the dielectric layer.

公开(公告)号：US20100110643A1

公开(公告)日：2010-05-06

申请号：US12605869

申请日：2009-10-26

Applicant: Wei-Hung Lin

Inventor： Wei-Hung Lin

IPC: H05K7/00

CPC classification number: G06K19/07 ,  G06K19/07732 ,  H01R13/4538

Abstract: A flash drive and a housing assembly thereof is provided. The housing assembly comprises a housing, a base and a rotating mechanism. The housing has a first opening, a second opening, and a space, the first opening is situated at a side surface of the housing, and the second opening is situated on a top surface of the housing. The base is used for accommodating a storage device which has a connecting member, the base is movably disposed in the space and has a slot facing the second opening. The rotating mechanism is disposed at the second opening and mounted to the housing, the rotating mechanism has a protrusion portion movably engaged in the slot. When the rotating mechanism rotates relative to the housing, the protrusion portion moves along the slot and drives the base to reciprocate between a first position and a second position.

Abstract translation: 提供闪存驱动器及其壳体组件。 壳体组件包括壳体，基座和旋转机构。 壳体具有第一开口，第二开口和空间，第一开口位于壳体的侧表面处，并且第二开口位于壳体的顶表面上。 基座用于容纳具有连接构件的存储装置，基座可移动地设置在该空间中，并且具有面向第二开口的槽。 旋转机构设置在第二开口处并且安装到壳体，旋转机构具有可移动地接合在槽中的突出部。 当旋转机构相对于壳体旋转时，突起部分沿着狭槽移动并驱动基座在第一位置和第二位置之间往复运动。

公开(公告)号：US10522452B2

公开(公告)日：2019-12-31

申请号：US13276143

申请日：2011-10-18

Applicant: Kuei-Wei Huang ,  Wei-Hung Lin ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Meng-Tse Chen ,  Ming-Da Cheng ,  Ching-Shi Liu

Inventor： Kuei-Wei Huang ,  Wei-Hung Lin ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Meng-Tse Chen ,  Ming-Da Cheng ,  Ching-Shi Liu

IPC: H01L21/00 ,  H01L23/498

Abstract: Packaging methods for semiconductor devices are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a workpiece including a plurality of packaging substrates. A portion of the workpiece is removed between the plurality of packaging substrates. A die is attached to each of the plurality of packaging substrates.