公开(公告)号：US09821196B2

公开(公告)日：2017-11-21

申请号：US15242511

申请日：2016-08-20

Applicant: Wei-Hung Lin

Inventor： Wei-Hung Lin

IPC: A63B43/06 ,  A63B69/00 ,  A63B37/06 ,  A63B37/12 ,  A63B102/18

CPC classification number: A63B43/06 ,  A63B37/06 ,  A63B69/0002 ,  A63B2037/125 ,  A63B2102/18 ,  A63B2207/02

Abstract: A luminous ball is provided, including an internal sphere in which at least one receiving space is disposed; a light-emitting device disposed in the receiving space; at least one covering wrapping an external circumferential surface of the internal sphere; at least one seam formed on an edge of the covering; a plurality of thread apertures disposed in pairs at two sides of the at least one seam; at least one thread penetrating the plurality of thread apertures to stitch the edge of the covering between the two sides of the at least one seam; wherein the internal sphere is a transparent ball, a light generated by the light-emitting device penetrates the internal sphere through the receiving space, and is visible through the at least one seam and the plurality of the thread apertures distributed on the covering.

公开(公告)号：US09412689B2

公开(公告)日：2016-08-09

申请号：US13357379

申请日：2012-01-24

Applicant: Chun-Cheng Lin ,  Chung-Shi Liu ,  Kuei-Wei Huang ,  Cheng-Ting Chen ,  Wei-Hung Lin ,  Ming-Da Cheng

Inventor： Chun-Cheng Lin ,  Chung-Shi Liu ,  Kuei-Wei Huang ,  Cheng-Ting Chen ,  Wei-Hung Lin ,  Ming-Da Cheng

IPC: H01L23/02 ,  H01L23/498 ,  H01L25/10 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/0273 ,  H01L21/486 ,  H01L21/56 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0231 ,  H01L2224/0239 ,  H01L2224/03452 ,  H01L2224/0401 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/1131 ,  H01L2224/11424 ,  H01L2224/1152 ,  H01L2224/1162 ,  H01L2224/11825 ,  H01L2224/11849 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13611 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01048 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15747 ,  H01L2924/18161 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A system and method for packaging semiconductor dies is provided. An embodiment comprises a first package with a first contact and a second contact. A post-contact material is formed on the first contact in order to adjust the height of a joint between the contact pad a conductive bump. In another embodiment a conductive pillar is utilized to control the height of the joint between the contact pad and external connections.

Abstract translation: 提供一种用于封装半导体管芯的系统和方法。 实施例包括具有第一触点和第二触点的第一封装。 在第一接触件上形成接触后材料，以便调节接触垫之间的接头的高度，导体凸块。 在另一个实施例中，使用导电柱来控制接触垫和外部连接之间的接头的高度。

公开(公告)号：US08809117B2

公开(公告)日：2014-08-19

申请号：US13270890

申请日：2011-10-11

Applicant: Wen-Hsiung Lu ,  Ming-Da Cheng ,  Wei-Hung Lin ,  Kuei-Wei Huang ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Chung-Shi Liu

Inventor： Wen-Hsiung Lu ,  Ming-Da Cheng ,  Wei-Hung Lin ,  Kuei-Wei Huang ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Chung-Shi Liu

IPC: H01L21/00

CPC classification number: H01L21/6835 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/562 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05554 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/11444 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/11462 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75754 ,  H01L2224/7698 ,  H01L2224/81001 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83102 ,  H01L2224/9205 ,  H01L2224/92125 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/3841 ,  Y10T29/41 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2224/05552 ,  H01L2924/013

Abstract: Packaging process tools and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure including a frame. The frame includes a plurality of apertures adapted to retain a plurality of integrated circuit dies therein. The frame includes at least one hollow region.

Abstract translation: 公开了用于半导体器件的封装处理工具和封装方法。 在一个实施例中，用于半导体器件的封装处理工具包括包括框架的机械结构。 框架包括适于将多个集成电路管芯保持在其中的多个孔。 框架包括至少一个中空区域。

公开(公告)号：US20130143361A1

公开(公告)日：2013-06-06

申请号：US13309311

申请日：2011-12-01

Applicant: Wei-Hung Lin ,  Kuei-Wei Huang ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Wei-Hung Lin ,  Kuei-Wei Huang ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L21/60 ,  H01L23/12

CPC classification number: H01L21/6835 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/562 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05554 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/11444 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/11462 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75754 ,  H01L2224/7698 ,  H01L2224/81001 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83102 ,  H01L2224/9205 ,  H01L2224/92125 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/3841 ,  Y10T29/41 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2224/05552 ,  H01L2924/013

Abstract: Packaging process tools and systems, and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure for supporting package substrates or integrated circuit die during a packaging process for the integrated circuit die. The mechanical structure includes a low thermal conductivity material disposed thereon.

Abstract translation: 公开了用于半导体器件的封装加工工具和系统以及封装方法。 在一个实施例中，用于半导体器件的封装处理工具包括用于在集成电路管芯的封装工艺期间支撑封装衬底或集成电路管芯的机械结构。 机械结构包括设置在其上的低热导率材料。

公开(公告)号：US20130113116A1

公开(公告)日：2013-05-09

申请号：US13291882

申请日：2011-11-08

Applicant: Meng-Tse Chen ,  Wei-Hung Lin ,  Kuei-Wei Huang ,  Chih-Wei Lin ,  Chih Chun Chiu ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Wei-Hung Lin ,  Kuei-Wei Huang ,  Chih-Wei Lin ,  Chih Chun Chiu ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L23/28 ,  H01L21/56

CPC classification number: H01L23/48 ,  H01L21/4853 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/49816 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15321 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05647

Abstract: A system and method for forming contacts is provided. An embodiment comprises forming the contacts on a substrate and then coining the contacts by physically shaping them using, e.g., a molding chamber. The physical shaping of the contacts may be performed using a patterned portion of the molding chamber or else by placing a patterned stencil around the contacts prior before a force is applied to physically reshape the contacts. The contacts may be reshaped into a cylindrical, oval, cuboid, or rectangular shape, for example.

公开(公告)号：US20130062761A1

公开(公告)日：2013-03-14

申请号：US13228768

申请日：2011-09-09

Applicant: Chih-Wei Lin ,  Ming-Da Cheng ,  Wen-Hsiung Lu ,  Hsiu-Jen Lin ,  Bor-Ping Jang ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu ,  Meng-Tse Chen ,  Chun-Cheng Lin ,  Yu-Peng Tsai ,  Kuei-Wei Huang ,  Wei-Hung Lin

Inventor： Chih-Wei Lin ,  Ming-Da Cheng ,  Wen-Hsiung Lu ,  Hsiu-Jen Lin ,  Bor-Ping Jang ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu ,  Meng-Tse Chen ,  Chun-Cheng Lin ,  Yu-Peng Tsai ,  Kuei-Wei Huang ,  Wei-Hung Lin

IPC: H01L23/498 ,  H01L21/56

CPC classification number: H01L25/0657 ,  H01L21/52 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/92 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68377 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06515 ,  H01L2224/09181 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/73259 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/9202 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15322 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/03 ,  H01L2924/014 ,  H01L2924/00

Abstract: Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL.

公开(公告)号：US20120018494A1

公开(公告)日：2012-01-26

申请号：US12841858

申请日：2010-07-22

Applicant: Bor-Ping Jang ,  Kuei-Wei Huang ,  Wei-Hung Lin ,  Chung-Shi Liu

Inventor： Bor-Ping Jang ,  Kuei-Wei Huang ,  Wei-Hung Lin ,  Chung-Shi Liu

IPC: B23K31/02

CPC classification number: H01L24/81 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/95 ,  H01L2224/13147 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75302 ,  H01L2224/75824 ,  H01L2224/7598 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81234 ,  H01L2224/81815 ,  H01L2224/81947 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method includes providing a substrate carrier including work piece holders, and placing a first plurality of work pieces into the work piece holders. A second plurality of work pieces is picked up and placed, with each of the second plurality of work pieces being placed on one of the first plurality of work pieces. Solder bumps between the first and the second plurality of work pieces are then reflowed to simultaneously bond the first and the second plurality of work pieces together.

Abstract translation: 一种方法包括提供包括工件保持件的基板载体，以及将第一多个工件放置在工件保持件中。 拾取和放置第二多个工件，其中第二多个工件中的每一个被放置在第一多个工件中的一个上。 然后，第一和第二多个工件之间的焊接凸起被回流以同时将第一和第二工件一起粘合在一起。

公开(公告)号：US07875805B2

公开(公告)日：2011-01-25

申请号：US12039997

申请日：2008-02-29

Applicant: Wei-Hung Lin

Inventor： Wei-Hung Lin

IPC: H05K1/03

CPC classification number: H05K1/0271 ,  H05K3/108 ,  H05K3/4644 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2201/2018

Abstract: The invention provides a warpage-proof circuit board structure, including: an inner layer circuit board; at least one dielectric layer formed on at least one surface of the inner layer circuit board; at least one first groove formed in the at least one dielectric layer corresponding in position thereto; a solder mask formed on the surface of the dielectric layer, a second groove formed in the solder mask and corresponding in position to the first groove formed in the dielectric layer; and a metal frame formed in the first and second grooves and protruding from the surface of the solder mask, thereby strengthening the circuit board to prevent it from warping in thermal processing and further using the metal frame as a heat-dissipating means for the package structure.

Abstract translation: 本发明提供一种抗翘曲电路板结构，包括：内层电路板; 形成在所述内层电路板的至少一个表面上的至少一个电介质层; 形成在所述至少一个电介质层中的至少一个第一凹槽对应于其中; 形成在所述电介质层的表面上的焊料掩模，形成在所述焊料掩模中并对应于形成在所述电介质层中的所述第一沟槽的位置的第二沟槽; 以及金属框架，形成在第一槽和第二槽中并且从焊接掩模的表面突出，从而加强电路板以防止其在热加工中翘曲，并且进一步使用金属框作为用于封装结构的散热装置 。

公开(公告)号：US20090122478A1

公开(公告)日：2009-05-14

申请号：US12033278

申请日：2008-02-19

Applicant: Wei-Hung Lin ,  Yu-Ting Tseng ,  Hung-Yi Chung

Inventor： Wei-Hung Lin ,  Yu-Ting Tseng ,  Hung-Yi Chung

IPC: G06F1/16 ,  H05K7/00 ,  B23P11/00

CPC classification number: H05K5/0278 ,  Y10T29/49826

Abstract: A flash memory disk includes a holder, a plug, a housing and a pulling ring. The plug is joined with the holder and exposed out of the holder. The housing has a containing space for accommodating the holder and the plug, wherein two sides opposite to each other respectively have a through sliding groove and the third side of the housing there has an opening. The two arms of the pulling ring have sliding blocks, and the sliding blocks are moveable and matched with the through sliding grooves, wherein the pulling ring is rotated about the axis connecting both the sliding blocks, and when the sliding blocks of the pulling ring is moved, the holder would be located between a first position where the plug is entirely accommodated in the containing space and a second position where the plug is entirely protruded out of the opening.

Abstract translation: 闪存盘包括保持器，插头，壳体和拉环。 插头与支架连接并露出支架。 壳体具有用于容纳保持器和插头的容纳空间，其中彼此相对的两侧分别具有通过滑动槽，并且壳体的第三侧具有开口。 牵引环的两个臂具有滑动块，并且滑动块可移动并与通过滑动槽匹配，其中拉环围绕连接两个滑动块的轴线旋转，并且当拉环的滑块为 移动时，支架将位于插头完全容纳在容纳空间中的第一位置和插头完全突出于开口的第二位置之间。

公开(公告)号：US07351067B2

公开(公告)日：2008-04-01

申请号：US11500932

申请日：2006-08-09

Applicant: Li-Sen Chen ,  Chuan-Shien Yu ,  Wei-Hung Lin

Inventor： Li-Sen Chen ,  Chuan-Shien Yu ,  Wei-Hung Lin

IPC: H01R12/00

CPC classification number: H01R9/0518

Abstract: A wire core of a coaxial cable is tightly bonded with a terminal. A pressing member is used to press the wire core toward the terminal. By doing so, better electrical characteristics are acquired.

Abstract translation: 同轴电缆的芯线与端子紧密接合。 使用按压构件将线芯朝向端子按压。 通过这样做，获得更好的电特性。