摘要:
Plural kinds of metal wiring patterns on which a lid is to be put are formed on a package body. The wiring patterns connected to an IC chip are changed depending upon the size of the lid which is put on the package body. Either of an IC chip operated by a single power supply and an IC chip operated by positive and negative power supplies can be packaged without changing the wiring patterns in the package.
摘要:
A first output buffer having a large current driving capability and a second output buffer having a small current driving capability are connected in parallel between an input terminal and an external lead. The first and second output buffers each includes two CMOS inverters connected in series between the input terminal and the external lead. The P-channel and N-channel MOSFETs of the two CMOS inverters in the second output buffer have gate widths smaller than each of the P-channel and N-channel MOSFETs, respectively, of the two CMOS inverters in the first output buffer. Also disclosed is an output buffer having P-channel and N-channel MOSFETs arranged as a CMOS inverter, but with a base of a first bipolar transistor connected to a source of the N-channel MOSFET. An emitter of the first bipolar transistor is connected to ground and its collector is connected to an output of the output buffer. A base of a second bipolar transistor is connected to an output of the CMOS inverter and its emitter is connected to the output of the output buffer. An input of the output buffer is supplied to an input of the CMOS inverter. Another transistor is connected between the output of the output buffer and ground and is responsive to the input of the output buffer.
摘要:
Disclosed is an improved Bi-CMOS gate array for increasing integration density. The gate array includes a predetermined region for forming PMOS transistors, a predetermined region for forming bipolar transistors, a predetermined region for forming resistance elements, and a predetermined region for forming NMOS transistors. The resistance element region is formed adjacent to the bipolar transistor region, and, therefore, it is not necessary to provide any interconnection for forming a logic circuit including the resistance element connected to the bipolar transistor. An area occupied by interconnections on the semiconductor substrate is thus reduced, and, therefore the integration density is increased.
摘要:
A signal applied through a signal input terminal is logically processed by a logic circuit such as a CMOS inverter and the processed signal is supplied from the signal output terminal. A pinch resistor has a resistance value controlled in accordance with a variation of a voltage at the signal output terminal. Specifically, the pinch resistor has a higher resistance value at an initial stage in the switching operation in which an output from the logic circuit lowers from a logical high level to a logical low level, and supplies a large base current to a bipolar transistor. At a later stage in the switching operation, the pinch resistor has a small resistance value, so that a residual charge in the signal output terminal and a base charge in the bipolar transistor are rapidly emitted through the pinch resistor. Thus, the resistance value of the pinch resistor is always maintained at an optimum value, which increases a speed of the switching operation of the logic circuit.
摘要:
A disconnected situation of a clutch is detected by a clutch sensor and an actuator performing selection of gear ratio in a secondary transmission is controlled by a control circuit in response to detected signals of the clutch sensor, whereby the selection of the gear ratio is conducted only when the clutch is put in its disconnected situation.
摘要:
Technologies are generally described for designing a window glazing for a particular geographical location. In some examples, a window glazing can be designed to selectively block sunlight from entering the window during summer when it may be desirable to have inside temperatures substantially lower than outside temperatures. The glazing can also be designed to selectively allow sunlight to enter the window during winter months when heat from sunlight may be desirable to raise indoor temperatures. The glazing can be prepared from a transparent material that can allow substantially full transmission of sunlight.
摘要:
Bis-Phenol A (BPA) can now be replaced in industrial processes by BPA substitutes. The BPA substitutes can have structures that are derivatives of BPA. The BPA substitutes can be used in preparing epoxy composition, polycarbonate compositions, and polysulfonate compositions or for other uses in place of BPA.
摘要:
Embodiments described herein relate to separating and/or concentrating target cells from a carrier fluid that may include other non-target cells. Embodiments include a cell separator with a flow surface having indentations formed thereon. The indentations are configured to capture target cells by physical and/or chemical interactions. The indentations may also include a layer of support molecules that assist in releasing captured cells for collection.
摘要:
A solid electrolytic capacitor includes a solid electrolytic capacitor element having an anode element having a dielectric film formed on a surface thereof and a conductive polymer layer formed on the anode element, an ionic liquid composed of an anion component and a cation component is present in the conductive polymer layer, and the cation component contains a cation having two or more ether linkages.
摘要:
A plurality of resistance value tables of a battery group with respect to temperature and SOC of the assembled battery, which are measured in advance when currents of different change patterns flow in the assembled battery, are stored. A resistance value for the assembled battery is calculated, based upon its voltage and current. From among the plurality of resistance value tables, a resistance value table is selected so that it corresponds to the change pattern of the current flowing in the assembled battery when the voltage and the current of the assembled battery were measured, and a resistance value is searched for from that resistance value table corresponding to the temperature and the SOC of the assembled battery. Then the calculated resistance value and the one from the table are compared to determine the life of the assembled battery.