LOW BAKE, LOW VOC CONDUCTIVE PRIMER
    37.
    发明申请
    LOW BAKE, LOW VOC CONDUCTIVE PRIMER 审中-公开
    LOW BAKE,低VOC导电PRIMER

    公开(公告)号:US20100160537A1

    公开(公告)日:2010-06-24

    申请号:US12422384

    申请日:2009-04-13

    Abstract: The present invention provides for a sealer/primer that is generally cured at low bake temperatures. The composition utilizes a resin system to provide both conductivity and adhesion of the coating onto plastic substrates. The present invention uses a polyester, such as one that includes unsaturated polyester, in combination with other resins, including an acrylic, crosslinking agent and conductive pigment to create a conductive primer that can be cured at low temperatures. The composition can be applied through traditional application equipment, seals the surface of the substrate to which it is applied, and cures to an acceptable surface for further processing, such as painting.

    Abstract translation: 本发明提供通常在低烘烤温度下固化的密封剂/底漆。 该组合物利用树脂体系来提供涂层在塑料基材上的导电性和粘附性。 本发明使用包括不饱和聚酯的聚酯与其它树脂组合,包括丙烯酸,交联剂和导电颜料,以产生可在低温下固化的导电底漆。 该组合物可以通过传统的应用设备施加,密封其所施加的基底的表面,并固化到可接受的表面以进行进一步加工,例如涂漆。

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