公开(公告)号：US20140160278A1

公开(公告)日：2014-06-12

申请号：US14181333

申请日：2014-02-14

申请人： FLIR Systems, Inc.

发明人： Robert G. Benson ,  Thomas J. Scanlon ,  Paul A. Czerepuszko

IPC分类号： H04N5/33 ,  H01L31/18

CPC分类号： H04N5/33 ,  G01J3/0286 ,  G01J3/2803 ,  G01J5/06 ,  G01J5/061 ,  G01J5/0806 ,  G01J5/0862 ,  G01J5/12 ,  G01J2005/0077 ,  G01J2005/0081 ,  G01J2005/123 ,  G01N21/3504 ,  G01N21/3518 ,  G01N2021/1793 ,  G01N2021/3531 ,  H01L31/03042 ,  H01L31/03046 ,  H01L31/035236 ,  H01L31/18 ,  H04N5/2253

摘要： An infrared camera system is provided to detect absorption of infrared radiation in a selected spectral bandwidth. In one example, an infrared camera system includes a lens adapted to receive infrared radiation from a survey scene comprising one or more gasses. The infrared camera system also includes a focal plane array comprising a plurality of quantum well infrared photo detectors (QWIPs). The QWIPs are tuned to detect a limited spectral bandwidth of the infrared radiation corresponding to at least a portion of an infrared absorption band of the one or more gasses. The infrared camera system also includes an optical band pass filter positioned substantially between the lens and the focal plane array. The optical band pass filter is adapted to filter the infrared radiation to a wavelength range substantially corresponding to the limited spectral bandwidth of the QWIPs before the infrared radiation is received by the focal plane array.

摘要翻译： 提供红外摄像机系统以检测所选频谱带宽中的红外辐射的吸收。 在一个示例中，红外相机系统包括适于从包括一个或多个气体的勘测场景接收红外辐射的透镜。 红外相机系统还包括包括多个量子阱红外光电检测器（QWIP）的焦平面阵列。 QWIP被调谐以检测对应于一个或多个气体的红外吸收带的至少一部分的红外辐射的有限光谱带宽。 红外相机系统还包括基本上位于透镜和焦平面阵列之间的光学带通滤光器。 光学带通滤波器适于在红外辐射被焦平面阵列接收之前将红外辐射过滤到基本上对应于QWIP的有限光谱带宽的波长范围。

公开(公告)号：US08653461B1

公开(公告)日：2014-02-18

申请号：US12415721

申请日：2009-03-31

申请人： Robert G. Benson ,  Thomas J. Scanlon ,  Paul A. Czerepuszko

发明人： Robert G. Benson ,  Thomas J. Scanlon ,  Paul A. Czerepuszko

IPC分类号： G01N21/35

CPC分类号： H04N5/33 ,  G01J3/0286 ,  G01J3/2803 ,  G01J5/06 ,  G01J5/061 ,  G01J5/0806 ,  G01J5/0862 ,  G01J5/12 ,  G01J2005/0077 ,  G01J2005/0081 ,  G01J2005/123 ,  G01N21/3504 ,  G01N21/3518 ,  G01N2021/1793 ,  G01N2021/3531 ,  H01L31/03042 ,  H01L31/03046 ,  H01L31/035236 ,  H01L31/18 ,  H04N5/2253

摘要： An infrared camera system is provided to detect absorption of infrared radiation in a selected spectral bandwidth. In one example, an infrared camera system includes a lens adapted to receive infrared radiation from a survey scene comprising one or more gasses. The infrared camera system also includes a focal plane array comprising a plurality of quantum well infrared photo detectors (QWIPs). The QWIPs are tuned to detect a limited spectral bandwidth of the infrared radiation corresponding to at least a portion of an infrared absorption band of the one or more gasses. The infrared camera system also includes an optical band pass filter positioned substantially between the lens and the focal plane array. The optical band pass filter is adapted to filter the infrared radiation to a wavelength range substantially corresponding to the limited spectral bandwidth of the QWIPs before the infrared radiation is received by the focal plane array.

摘要翻译： 提供红外摄像机系统以检测所选频谱带宽中的红外辐射的吸收。 在一个示例中，红外相机系统包括适于从包括一个或多个气体的勘测场景接收红外辐射的透镜。 红外相机系统还包括包括多个量子阱红外光电检测器（QWIP）的焦平面阵列。 QWIP被调谐以检测对应于一个或多个气体的红外吸收带的至少一部分的红外辐射的有限光谱带宽。 红外相机系统还包括基本上位于透镜和焦平面阵列之间的光学带通滤光器。 光学带通滤波器适于在红外辐射被焦平面阵列接收之前将红外辐射过滤到基本对应于QWIP的有限光谱带宽的波长范围。

公开(公告)号：US20040129882A1

公开(公告)日：2004-07-08

申请号：US10647345

申请日：2003-08-26

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Naoya Mashio ,  Keitaro Shigenaka ,  Hideyuki Funaki ,  Yoshinori Iida ,  Ikuo Fujiwara

IPC分类号： G01J005/00

CPC分类号： G01J5/08 ,  G01J5/02 ,  G01J5/023 ,  G01J5/024 ,  G01J5/0245 ,  G01J5/0853 ,  G01J5/14 ,  G01J5/22 ,  G01J2005/123 ,  H04N5/33

摘要： An infrared image sensor encompasses (a) a base body, (b) a plurality of signal lines disposed on the base body, (c) a plurality of address lines intersecting the signal lines, (d) a plurality of detector portions provided in the cross region of the signal lines and the address lines, each of the detector portions being connected between the corresponding signal line and the address line, each of the detector portions is configured to detect infrared-ray, (e) a plurality of supporting beams supporting each of the detector portions above the base body, and (f) a plurality of contactors configured to contact each of the detector portions with the base body thermally so as to transport thermal energy to be accumulated in each of the detector portions toward the base body.

摘要翻译： 红外图像传感器包括（a）基体，（b）设置在基体上的多条信号线，（c）与信号线交叉的多个地址线，（d）多个检测器部分， 信号线的交叉区域和地址线，每个检测器部分连接在对应的信号线和地址线之间，每个检测器部分被配置为检测红外线，（e）多个支撑梁 每个检测器部分在基体上方，以及（f）多个接触器，其构造成使得每个检测器部分与基体热接触，以便将热能积聚在每个检测器部分中朝向基体 。

公开(公告)号：US4772790A

公开(公告)日：1988-09-20

申请号：US919893

申请日：1986-10-14

申请人： Roland H. Aldridge

发明人： Roland H. Aldridge

IPC分类号： G01J5/12 ,  G01N21/35 ,  G01J5/16

CPC分类号： G01N21/3504 ,  G01J5/12 ,  G01J2005/123

摘要： A non dispersive optical gas analyzer is disclosed which uses thermopiles as optical detectors. The thermopiles are formed of an array of interconnected thin films of dissimilar metals deposited on a heat conductive substrate to form a multitude of thermocouples. The array is configured in such a manner that a number of the thermocouples are employed to compensate each thermopile output signal for changes in ambient temperature.

摘要翻译： 公开了一种使用热电堆作为光学检测器的非色散光学气体分析仪。 热电堆由沉积在导热基板上的不同金属的相互连接的薄膜阵列形成，以形成多个热电偶。 该阵列被配置为使得多个热电偶用于补偿每个热电堆输出信号以改变环境温度。

公开(公告)号：US20240302216A1

公开(公告)日：2024-09-12

申请号：US18273907

申请日：2021-12-17

申请人： Sony Group Corporation

发明人： Koji KADONO ,  Shinji IMAIZUMI ,  Ryota OOISHI ,  Taishi ANO

IPC分类号： G01J5/14 ,  G01J5/12 ,  H10N19/00

CPC分类号： G01J5/14 ,  H10N19/00 ,  G01J2005/123

摘要： Provided is a thermal type detection element that enables high sensitivity and high speed response while reducing the size of the element.
A thermoelectric conversion element 10 includes: a substrate 11; a thin film thermoelectric conversion layer 12 that is stacked on the substrate 11; a first electrode 13 on a high temperature side that is disposed on one surface of the thermoelectric conversion layer 12; a second electrode 15 on a low temperature side that is disposed on the other surface of the thermoelectric conversion layer 12; and an absorption layer 18 that is stacked in contact with the one surface of the thermoelectric conversion layer 12 and absorbs heat received from the outside. In the thermoelectric conversion element 10, the one surface is an upper surface of the thermoelectric conversion layer 12, the other surface is a lower surface of the thermoelectric conversion layer 12, the first electrode 13 is disposed at a contact surface between a lower surface of the absorption layer 18 and the upper surface of the thermoelectric conversion layer 12, and the second electrode 15 is disposed at a contact surface between the lower surface of the thermoelectric conversion layer 12 and a front surface of the substrate.

公开(公告)号：US20230145676A1

公开(公告)日：2023-05-11

申请号：US17995830

申请日：2020-08-18

申请人： Mitsubishi Electric Corporation

发明人： Yoshinori TAKAHASHI ,  Tomohiro MAEGAWA

IPC分类号： G01J5/12

CPC分类号： G01J5/12 ,  G01J2005/123

摘要： A sensor chip (4) having a pixel unit (8) that detects an infrared ray is bonded to an insulating substrate (2) using a bonding material (3). A heat generation mechanism (11) is integrated with the sensor chip (4). A control unit (14) is provided on the insulating substrate (2) and controls an amount of current to be supplied to the heat generation mechanism (11).

公开(公告)号：US20180110416A1

公开(公告)日：2018-04-26

申请号：US15567380

申请日：2016-04-06

申请人： Sharp Kabushiki Kaisha

发明人： Ryohichi MASUDA ,  Hidenori KAWANISHI

IPC分类号： A61B5/01 ,  A61B5/00

CPC分类号： A61B5/015 ,  A61B5/0035 ,  A61B5/0075 ,  A61B5/0077 ,  A61B5/4842 ,  A61B5/7275 ,  A61B5/746 ,  A61B2560/0252 ,  A61B2576/00 ,  G01J5/0025 ,  G01J5/026 ,  G01J5/0806 ,  G01J5/0812 ,  G01J5/10 ,  G01J2005/0077 ,  G01J2005/0085 ,  G01J2005/123

摘要： A monitoring system at least includes a measuring device that measures a temperature distribution based on infrared light and a monitoring device that measures image information based on visible light, in which the monitoring device includes an acquisition unit that acquires attribute information of a monitored target extracted based on the image information and fever information of the monitored target from the temperature distribution in a time series and an analysis unit that analyzes the attribute information and a change of the fever information and predicts a transition of the fever information based on the analysis result.

公开(公告)号：US20180090657A1

公开(公告)日：2018-03-29

申请号：US15563407

申请日：2015-10-10

申请人： SHANGHAI INDUSTRIAL μTECHNOLOGY RESEARCH INSTITUTE

发明人： Yue FEI ,  Xuhong WANG ,  Ying ZHANG

IPC分类号： H01L35/32 ,  H01L35/34 ,  H01L21/56 ,  H01L23/31 ,  H01L25/00 ,  H01L21/28 ,  G01J5/12

CPC分类号： H01L35/32 ,  G01J5/12 ,  G01J2005/123 ,  H01L21/28273 ,  H01L21/56 ,  H01L23/3114 ,  H01L23/315 ,  H01L25/50 ,  H01L35/34

摘要： The present disclosure provides a packaging method and a semiconductor device, the packaging method comprising: depositing a first sacrificial layer on a substrate to cover a semiconductor element formed on the substrate; covering a first dielectric layer on an upper surface and a side wall of the first sacrificial layer, the first dielectric layer has a first groove exposing part of the first sacrificial layer; covering a second sacrificial layer on surface of the exposed first sacrificial layer; covering a second dielectric layer on the second sacrificial layer and the exposed surface of the first dielectric layer, the second dielectric layer having a releasing hole exposing the second sacrificial layer and a second groove; depositing a filling layer to fill the second groove; by the releasing hole, removing the second sacrificial layer and the first sacrificial layer to form a cavity; depositing a third dielectric layer which covers the exposed surface of the second dielectric layer, and filling the releasing hole. According to the present application, a step of packaging using a conduit shell is removed, thereby reducing the packaging cost of the semiconductor element and improving the yield.

公开(公告)号：US20180055418A1

公开(公告)日：2018-03-01

申请号：US15793599

申请日：2017-10-25

申请人： Stryker Corporation

发明人： Marko N. Kostic ,  Jonathan Mark Greenbank ,  Christopher J. Cummings

IPC分类号： A61B5/11 ,  G01D5/40 ,  A61G7/05 ,  G01J5/14 ,  G01J5/00 ,  G01G19/44 ,  A61G13/10 ,  A61G5/10

CPC分类号： A61B5/11 ,  A61B5/1115 ,  A61G5/101 ,  A61G7/05 ,  A61G7/0527 ,  A61G7/0528 ,  A61G13/10 ,  G01D5/40 ,  G01G19/44 ,  G01G19/445 ,  G01J5/00 ,  G01J5/0025 ,  G01J5/12 ,  G01J5/14 ,  G01J2005/0077 ,  G01J2005/123

摘要： A person support apparatus includes one or more thermal image sensors whose outputs are analyzed to perform one or more functions. Such functions include automatically turning on a brake, automatically turning on one or more lights, detecting when a patient associated with the person support apparatus has fallen, enabling a propulsion system of the patient support apparatus to be used, automatically controlling one or more environmental controls, and/or automatically arming an exit detection system after entry of a patient onto the person support apparatus. Multiple thermal images may be generated from multiple sensors to generate stereoscopic thermal images of portions of the person support apparatus and its surroundings.

公开(公告)号：US09891113B2

公开(公告)日：2018-02-13

申请号：US14914285

申请日：2014-08-25

申请人： Robert Bosch GmbH

发明人： Ingo Herrmann ,  Fabian Utermoehlen

IPC分类号： G01J5/20 ,  G01J5/14 ,  G01J5/12 ,  G01J5/00 ,  G01J5/10

CPC分类号： G01J5/14 ,  G01J5/12 ,  G01J2005/0077 ,  G01J2005/106 ,  G01J2005/123

摘要： The present disclosure relates to a thermal sensor and a method for producing a thermal sensor of this type having a low signal-to-noise ratio at relatively high signal strengths. To this end, a thermoelectric generator is combined with a field effect transistor and a diode. Owing to its integrated diode and the barrier effect associated therewith, the thermal sensor is suitable for the economical and efficient design of imaging sensor arrays for converting thermal radiation into electrical signals.