公开(公告)号：US20040212063A1

公开(公告)日：2004-10-28

申请号：US10425383

申请日：2003-04-28

Inventor： Edward W. Jaeck ,  Chia-Pin Chiu

IPC: H01L023/48 ,  H01L021/44

CPC classification number: H05K1/147 ,  H01L23/5385 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/023 ,  H05K1/145 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/10636 ,  H05K2201/10643 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic package is provided, having a flexible substrate, a first plurality of conductors, and a second plurality of conductors. The flexible substrate has first and second portions with a fold portion between the first and second portions, and is folded at the fold portion to position the second portion over the first portion. Each one of the first plurality of conductors runs from the first portion over the fold portion onto the second portion. Each one of the second plurality of conductors runs from the first portion onto the second portion without running over the fold portion.

Abstract translation: 提供一种电子封装，具有柔性基板，第一多个导体和第二多个导体。 柔性基板具有在第一和第二部分之间具有折叠部分的第一和第二部分，并且在折叠部分处折叠以将第二部分定位在第一部分上。 第一多个导体中的每一个从折叠部分上的第一部分延伸到第二部分上。 所述第二多个导体中的每一个从所述第一部分延伸到所述第二部分上，而不超过所述折叠部分。

公开(公告)号：US06651315B1

公开(公告)日：2003-11-25

申请号：US09181028

申请日：1998-10-27

Applicant: Gregory A. Graves ,  Michael Mengruo Zhang ,  Daniel Chandler ,  Chi-Ming Chan ,  Shou-Mean Fang ,  Dennis Siden ,  Mark Thompson

Inventor： Gregory A. Graves ,  Michael Mengruo Zhang ,  Daniel Chandler ,  Chi-Ming Chan ,  Shou-Mean Fang ,  Dennis Siden ,  Mark Thompson

IPC: H01C1728

CPC classification number: H05K1/184 ,  H01C1/14 ,  H01C1/1406 ,  H01C7/027 ,  H01C17/06586 ,  H05K1/182 ,  H05K3/0097 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10469 ,  H05K2201/10643 ,  H05K2201/10666 ,  Y02P70/613 ,  Y10T29/49085 ,  Y10T29/49101 ,  Y10T29/49103

Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising: (a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and (b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element. Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals. Preferably preferred devices contain two laminar electrodes, with a PTC element between them, and a cross-conductor which passes through the thickness of the device and contacts one only of the two electrodes. The cross-conductor permits connection to both electrodes from the same side of the device, and also makes it possible to carry out the steps for preparing such devices on an assembly which corresponds to a number of individual devices, with division of the assembly as the final step.

Abstract translation: 一种电气装置，包括第一和第二层状电极和夹在它们之间的层状PTC电阻元件，该装置包括：（a）主要部分，其包括第一电极的主要部分，第二电极的主要部分，以及 电阻元件的主要部分; 和（b）第一连接腿，其远离主要部分延伸并且包括与第一电极的主要部分成一体的第一电极的第一腿部和电阻元件的第一腿部， 电阻元件的主要部分。这些装置可以以各种方式固定到电路板，并且可弹性变形的端子。 优选地，优选的装置包含两个层状电极，其间具有PTC元件，并且穿过该器件的厚度并且仅与两个电极中的一个接触的交叉导体。 交叉导体允许从设备的同一侧连接到两个电极，并且还使得可以在对应于多个单独设备的组件上执行用于准备这样的设备的步骤，将组件划分为 最后一步。

公开(公告)号：US06548207B1

公开(公告)日：2003-04-15

申请号：US09521090

申请日：2000-03-07

Applicant: Mark E. Tuttle

Inventor： Mark E. Tuttle

IPC: H01M642

CPC classification number: H01M2/1066 ,  H01M2/1044 ,  H01M2/204 ,  H01M6/42 ,  H02J7/0024 ,  H04B1/3883 ,  H05K3/321 ,  H05K2201/10037 ,  H05K2201/10515 ,  H05K2201/10643 ,  Y10T29/49108 ,  Y10T29/49114

Abstract: Thin-profile battery circuits and constructions, and in particular button-type battery circuits and constructions and methods of forming the same are described. In one implementation, a substrate is provided having an outer surface with a pair of spaced electrical contact pads thereon. At least two thin-profile batteries are conductively bonded together in a stack having a lowermost battery and an uppermost battery. The batteries include respective positive and negative terminals. The lowermost battery has one of its positive or negative terminals adhesively bonded to one of the pair of electrical contact pads while the uppermost battery has one of its positive or negative terminals electrically connected to the other of the pair of electrical contact pads. The batteries can be provided into parallel or series electrical connections.

Abstract translation: 描述了薄型电池电路和结构，特别是按钮式电池电路及其构成及其形成方法。 在一个实施方案中，提供了具有外表面的衬底，其上具有一对间隔的电接触焊盘。 至少两个薄型电池在具有最低电池和最上面的电池的堆叠中导电地结合在一起。 电池包括相应的正极和负极。 最下面的电池具有一个正极或负极端子，其粘合地粘合到一对电接触焊盘中的一个，而最上面的电池具有与该对电接触焊盘中的另一个电连接的正或负端子中的一个。 电池可以并联或串联电连接。

公开(公告)号：US06504444B1

公开(公告)日：2003-01-07

申请号：US09187868

申请日：1998-11-06

Applicant: Mitsuru Furuya ,  Osamu Myohga ,  Yoshitsugu Okada

Inventor： Mitsuru Furuya ,  Osamu Myohga ,  Yoshitsugu Okada

IPC: H01P136

CPC classification number: H05K1/184 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/165 ,  H05K1/185 ,  H05K2201/086 ,  H05K2201/10416 ,  H05K2201/10643 ,  H01L2924/00

Abstract: Holes are formed in a ceramic substrate before sintering, magnetic parts and dielectric parts are fitted in the holes and the substrate is sintered at a temperature equal to or lower than the sintering temperature of the magnetic parts. It is possible to obtain a very compact high frequency integrated circuit, particularly, a micro wave integrated circuit which can be utilized in a frequency band of several tens GHz, by using hard ferrite as a material of the magnetic parts and magnetizing them after the sintering.

Abstract translation: 在烧结之前，在陶瓷基板中形成孔，将磁性部件和电介质部件嵌合在孔中，并且在等于或低于磁性部件的烧结温度的温度下烧结基板。 可以通过使用硬质铁氧体作为磁性部件的材料并且在烧结之后对它们进行磁化来获得非常紧凑的高频集成电路，特别是可以在几十GHz的频带中使用的微波集成电路 。

公开(公告)号：US06326558B1

公开(公告)日：2001-12-04

申请号：US09354748

申请日：1999-07-29

Applicant: Osamu Maeda

Inventor： Osamu Maeda

IPC: H05K116

CPC classification number: H05K1/184 ,  H05K3/301 ,  H05K3/366 ,  H05K7/12 ,  H05K2201/10643

Abstract: A part holder includes a part holding portion. In this part holding portion, a leadless part is held by a part receiving portion and an engaging piece. In such a state, the leadless part is inserted in a hole formed in a printed circuit board. At this time, a resilient piece provided on a leg of the part holder comes into abutment against an inner edge of the hole, whereby the part holder is fixed by the hole. Also, the part inserted in the hole is urged onto one surface of the hole by a resilient portion of the part holder. Thus, a pattern formed on one main surface of the part is closely contacted with a pattern formed on a backside of the printed circuit board.

Abstract translation: 部件保持器包括部件保持部。 在该部分保持部分中，无引线部分被部件接收部分和接合件保持。 在这种状态下，将无引线部分插入形成在印刷电路板上的孔中。 此时，设置在部件支架的腿部上的弹性件抵靠孔的内边缘，由此通过孔固定零件保持器。 此外，插入孔中的部分通过部件保持器的弹性部分被推压到孔的一个表面上。 因此，形成在该部件的一个主表面上的图案与形成在印刷电路板的背面上的图案紧密接触。

公开(公告)号：US06268078B1

公开(公告)日：2001-07-31

申请号：US09459226

申请日：1999-12-10

Applicant: Mark E. Tuttle

Inventor： Mark E. Tuttle

IPC: H01M642

CPC classification number: H01M2/1066 ,  H01M2/1044 ,  H01M2/204 ,  H01M6/42 ,  H02J7/0024 ,  H04B1/3883 ,  H05K3/321 ,  H05K2201/10037 ,  H05K2201/10515 ,  H05K2201/10643 ,  Y10T29/49108 ,  Y10T29/49114

Abstract: Thin-profile battery circuits and constructions, and in particular button-type battery circuits and constructions and methods of forming the same are described. In one implementation, a substrate is provided having an outer surface with a pair of spaced electrical contact pads thereon. At least two thin-profile batteries are conductively bonded together in a stack having a lowermost battery and an uppermost battery. The batteries include respective positive and negative terminals. The lowermost battery has one of its positive or negative terminals adhesively bonded to one of the pair of electrical contact pads while the uppermost battery has one of its positive or negative terminals electrically connected to the other of the pair of electrical contact pads. The batteries can be provided into parallel or series electrical connections.

Abstract translation: 描述了薄型电池电路和结构，特别是按钮式电池电路及其构成及其形成方法。 在一个实施方案中，提供了具有外表面的衬底，其上具有一对间隔的电接触焊盘。 至少两个薄型电池在具有最低电池和最上面的电池的堆叠中导电地结合在一起。 电池包括相应的正极和负极。 最下面的电池具有一个正极或负极端子，其粘合地粘合到一对电接触焊盘中的一个，而最上面的电池具有与该对电接触焊盘中的另一个电连接的正或负端子中的一个。 电池可以并联或串联电连接。

公开(公告)号：US6114060A

公开(公告)日：2000-09-05

申请号：US255062

申请日：1999-02-22

Applicant: Mark E. Tuttle

Inventor： Mark E. Tuttle

IPC: H01M2/10 ,  H01M2/20 ,  H01M6/42 ,  H02J7/00 ,  H04B1/38 ,  H05K3/32 ,  H01M6/12

CPC classification number: H01M2/1066 ,  H01M2/1044 ,  H01M2/204 ,  H02J7/0024 ,  H05K3/321 ,  H01M6/42 ,  H04B1/3883 ,  H05K2201/10037 ,  H05K2201/10515 ,  H05K2201/10643 ,  Y10T29/49108 ,  Y10T29/49114

Abstract: Thin-profile battery circuits and constructions, and in particular button-type battery circuits and constructions and methods of forming the same are described. In one implementation, a substrate is provided having an outer surface with a pair of spaced electrical contact pads thereon. At least two thin-profile batteries are conductively bonded together in a stack having a lowermost battery and an uppermost battery. The batteries include respective positive and negative terminals. The lowermost battery has one of its positive or negative terminals adhesively bonded to one of the pair of electrical contact pads while the uppermost battery has one of its positive or negative terminals electrically connected to the other of the pair of electrical contact pads. The batteries can be provided into parallel or series electrical connections.

Abstract translation: 描述了薄型电池电路和结构，特别是按钮式电池电路及其构成及其形成方法。 在一个实施方案中，提供了具有外表面的衬底，其上具有一对间隔的电接触焊盘。 至少两个薄型电池在具有最低电池和最上面的电池的堆叠中导电地结合在一起。 电池包括相应的正极和负极。 最下面的电池具有一个正极或负极端子，其粘合地粘合到一对电接触焊盘中的一个，而最上面的电池具有与该对电接触焊盘中的另一个电连接的正或负端子中的一个。 电池可以并联或串联电连接。

公开(公告)号：US4979076A

公开(公告)日：1990-12-18

申请号：US375033

申请日：1989-06-30

Applicant: Raymond DiBugnara

Inventor： Raymond DiBugnara

IPC: H05K1/18 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K1/184 ,  H05K3/3478 ,  H05K2201/10643 ,  H05K2203/0415 ,  H05K3/3442 ,  H05K3/4046

Abstract: A hybrid integrated circuit apparatus includes an electrical circuit component, having first and second leads connected thereto, disposed within an aperture extending from a first surface to a second surface of a circuit board, the circuit board having on each surface a circuit element bonded adjacent the aperture. A disk of fusible material, sized and positioned to fully extend over the aperture and partially over the circuit element, is melted and reformed in place, under vacuum conditions, so as to mechanically couple the electrical component within the board aperture, provide an electrical contact between the component lead and the circuit element, and hermetically seal the component within the circuit board.

Abstract translation: 一种混合集成电路装置，包括电路部件，其具有连接到其上的第一和第二引线，设置在从电路板的第一表面延伸到第二表面的孔内，所述电路板在每个表面上具有邻近所述电路元件的电路元件 光圈。 尺寸和定位为完全延伸在孔上并部分地在电路元件上方的可熔材料的盘在真空条件下熔化并重新定位，以便将电气部件机械地联接在板孔内，提供电接触 在组件引线和电路元件之间，并且将电路板内的部件气密地密封。

公开(公告)号：US4797992A

公开(公告)日：1989-01-17

申请号：US137997

申请日：1987-12-28

Applicant: Vernon B. Powers ,  Deborah C. Murphy

Inventor： Vernon B. Powers ,  Deborah C. Murphy

IPC: H01P1/387 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H01P11/00

CPC classification number: H01P1/387 ,  H05K1/185 ,  H05K1/0233 ,  H05K1/0306 ,  H05K1/182 ,  H05K2201/086 ,  H05K2201/10643 ,  Y10T29/49016

Abstract: A method of forming a microwave integrated circuit is disclosed. A hole is bored in an alumina substrate and a plug having a diameter substantially equal to the hole is provided. The hole and the perimeter of the plug are coated with a thermally fusable dielectric composition and the plug is embedded in the hole. Heating the substrate fuses the plug is place and crystalizes the composition into a glass with compatible thermal expansion. At least one face of the substrate and plug are then polished to provide a planar surface. The metalized circuit is then formed on this assembly, which minimizes conductive tracking on the substrate and facilitates alignment of the circuit with the plug.

Abstract translation: 公开了一种形成微波集成电路的方法。 在氧化铝基板中钻孔，并且提供具有与孔大致相等的直径的塞子。 插塞的孔和周边涂有热熔电介质组合物，插头嵌入孔中。 加热衬底熔断插头，并将组合物结晶成具有兼容的热膨胀的玻璃。 然后抛光衬底和插塞的至少一个面以提供平坦的表面。 金属化电路然后形成在该组件上，这使得衬底上的导电跟踪最小化并且有助于电路与插头的对准。

公开(公告)号：US4576670A

公开(公告)日：1986-03-18

申请号：US199387

申请日：1980-10-21

Applicant: Reinhart Schade

Inventor： Reinhart Schade

IPC: H04R17/00 ,  H01L21/58 ,  H01L41/04 ,  H01L41/29 ,  H04R17/10 ,  H05K3/00 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  B32B31/00

CPC classification number: H01L24/33 ,  H01L24/83 ,  H01L41/29 ,  H05K3/305 ,  H05K3/325 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H05K2201/0382 ,  H05K2201/10287 ,  H05K2201/10643 ,  H05K2201/10977 ,  H05K2203/1189 ,  H05K3/202 ,  Y02P70/613 ,  Y10T156/1039

Abstract: Electrical contact is made on the adhesive-side electrode of an electrical component which is connected to an electrically conductive carrying plate, with the aid of an insulating adhesive which not only ensures good contact is made, but is also suitable for automation. At one or more points the adhesive layer applied on the carrier plate before a bonding operation is pressed away by contact-forming projections during the joining and bonding operation which takes place under the influence of heat and pressure. Embossed projections on the adhesive-coated carrier plate can be used as the structure by which contact is made.

Abstract translation: 在绝缘粘合剂的帮助下，在连接到导电承载板的电气部件的粘合剂侧电极上进行电接触，这不仅确保了良好的接触，而且也适合于自动化。 在一个或多个点处，在接合操作之前施加在承载板上的粘合剂层在接触和接合操作期间在接触和接合操作期间在受热和压力的影响下被压接。 可以使用粘合剂涂布的载体板上的压花突起作为进行接触的结构。