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    HALOGEN-FREE RESIN COMPOSITION AND METHOD FOR PREPARATION OF COPPER CLAD LAMINATE WITH SAME
    31.
    发明申请
    HALOGEN-FREE RESIN COMPOSITION AND METHOD FOR PREPARATION OF COPPER CLAD LAMINATE WITH SAME 有权
    无卤素树脂组合物及其制备方法

    公开(公告)号：US20140150963A1

    公开(公告)日：2014-06-05

    申请号：US14239045

    申请日：2011-09-02

    Applicant: Yueshan He

    Inventor： Yueshan He

    IPC: C09D171/12 ,  B32B38/08 ,  C09D145/00 ,  B32B37/10 ,  C09D163/10 ,  C09D143/02

    CPC classification number: C09D163/10 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B37/10 ,  B32B38/08 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/076 ,  C08K3/013 ,  C08K5/0025 ,  C08K5/5399 ,  C09D143/02 ,  C09D145/00 ,  C09D171/12 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T156/1075 ,  C08L63/00

    Abstract: A halogen-free resin composition and a method for preparation of copper clad laminate with the same, wherein based on total parts by weight of solid components, the halogen-free resin composition comprises a reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene of 5-50 parts, a thermosetting resin of 15-85 parts, a crosslinking curing agent of 1-35 parts, a crosslinking curing accelerant of 0-5 parts and a filler of 0-100 parts. In the present invention, the reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene having very low water absorption is introduced into the thermosetting resin, satisfying both the halogen-free and antiflaming requirements and improving the electrical properties of the system, and making it possible to prepare the halogen-free high-frequency high-speed substrate material. The resulted copper clad laminate satisfies the halogen-free requirement, and has advantages such as excellent resistance to heat and moisture, and low dielectric loss.

    Abstract translation: 无卤素树脂组合物及其制备方法，其中基于总重量份的固体组分，无卤树脂组合物包含5-50的反应性烯丙基苯氧基环三磷腈或乙烯基苯氧基环三磷腈 部件，15-85份的热固性树脂，1-35份交联固化剂，0-5份交联固化促进剂和0-100份填料。 在本发明中，具有非常低吸水性的反应性烯丙基苯氧基环三磷腈或乙烯基苯氧基环三磷腈引入到热固性树脂中，满足无卤素和抗泡沫性要求，并且改善了体系的电性能，并且使得可以制备 无卤素高频高速基板材料。 所得到的覆铜层压板满足无卤素要求，具有优异的耐热湿性和低介电损耗。

    Aqueous coating composition
    32.
    发明授权
    Aqueous coating composition 失效
    水性涂​​料组合物

    公开(公告)号：US5151125A

    公开(公告)日：1992-09-29

    申请号：US703804

    申请日：1991-05-21

    Applicant: Teruaki Kuwajima ,  Shinichiro Umeda ,  Masakazu Watanabe ,  Sakuichi Konishi

    Inventor： Teruaki Kuwajima ,  Shinichiro Umeda ,  Masakazu Watanabe ,  Sakuichi Konishi

    IPC: C09D133/14 ,  C08F230/02 ,  C09D5/38 ,  C09D17/00 ,  C09D133/04 ,  C09D133/06 ,  C09D137/00 ,  C09D143/00 ,  C09D143/02

    CPC classification number: C09D17/00 ,  C08F230/02 ,  C09D143/02 ,  C09D5/38

    Abstract: Disclosed is an aqueous metallic coating composition which significantly reduces the production of hydrogen gas and does not have the problems which are brought about from hydrophobic segments. The composition can be stored for a long period of time and provide a metallic coating having good appearance and film properties (e.g. water resistance and adhesive properties with substrates). The aqueous coating composition of the present invention comprises(a) an acryl resin having a number average molecular weight of 1,000 to 50,000, an acid value of 15 to 200 and a hydroxyl value of 20 to 200, prepared by copolymerizing an ethylenic monomer and a phosphate monomer represented by ##STR1## [wherein X represents a hydrogen atom or a methyl group, Y represents an alkylene group having 2 to 4 carbon atoms and n is an integer of 3 to 30.] and(b) a pigment;the acryl resin being present in an amount of 2 to 500 parts by weight, based on 100 parts by weight of the pigment.

    Abstract translation: 公开了一种显着降低氢气产生的水性金属涂料组合物，并且不具有从疏水链段引起的问题。 该组合物可以长期储存并提供具有良好外观和膜性质（例如耐水性和与基材的粘合性）的金属涂层。 本发明的水性涂料组合物包含（a）通过使乙烯类单体和乙烯类单体共聚制备的数均分子量为1,000〜50,000，酸值为15〜200，羟基值为20〜200的丙烯酸树脂 由下式表示的磷酸酯单体（I）[式中，X表示氢原子或甲基，Y表示碳原子数2〜4的亚烷基，n表示3〜30的整数。]和（b）颜料 ; 基于100重量份的颜料，丙烯酸树脂以2至500重量份的量存在。

    Novel phosphinyl-containing ethylenically unsaturated compounds
    33.
    发明授权
    Novel phosphinyl-containing ethylenically unsaturated compounds 失效
    新型含膦基的烯属不饱和化合物

    公开(公告)号：US4658003A

    公开(公告)日：1987-04-14

    申请号：US854275

    申请日：1986-04-21

    Applicant: Donald L. Schmidt ,  Gerald K. McEwen

    Inventor： Donald L. Schmidt ,  Gerald K. McEwen

    IPC: C08F230/02 ,  C09D143/02 ,  C09J143/02 ,  C08F30/02

    CPC classification number: C08F230/02 ,  C09D143/02 ,  C09J143/02

    Abstract: The invention is (hydroxy)-phosphinylalkyl acrylate, (hydroxy)-phosphinylalkyl methacrylate or an alkali metal, alkaline earth metal or ammonium salt thereof.In another aspect, the invention is a polymeric composition which comprises the reaction product of:(a) between about 0.5 and 100 percent by weight of a (hydroxy)-phosphinylalkyl acrylate, (hydroxy)-phosphinylalkyl methacrylate or an alkali metal, alkaline earth metal or ammonium salt thereof; and(b) between about 0 and 99.5 weight percent of a compound containing a polymerizable 1,2-ethylenically unsaturated moiety.

    Abstract translation: 本发明是丙烯酸（羟基） - 氧膦基烷基酯，甲基丙烯酸（羟基） - 氧膦基烷基酯或其碱金属，碱土金属或铵盐。 另一方面，本发明是一种聚合物组合物，其包含以下反应产物：（a）约0.5至100重量％的丙烯酸（羟基） - 氧膦基烷基酯，甲基丙烯酸（羟基） - 氧膦基烷基酯或碱金属碱土 金属或铵盐; 和（b）约0至99.5重量％的含有可聚合的1,2-烯属不饱和部分的化合物。

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