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    Method of manufacturing printed circuit board
    42.
    发明申请
    Method of manufacturing printed circuit board 失效
    制造印刷电路板的方法

    公开(公告)号：US20090223044A1

    公开(公告)日：2009-09-10

    申请号：US12453616

    申请日：2009-05-15

    Applicant: Han Seo Cho ,  Je Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

    Inventor： Han Seo Cho ,  Je Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

    IPC: H05K3/10

    CPC classification number: G02B6/1221 ,  G02B6/136 ,  G02B6/28 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/20 ,  Y10T29/49155

    Abstract: A method of manufacturing a printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.

    Abstract translation: 一种制造印刷电路板的方法，其中形成光波导以及电信号一起传输光信号，电信号包括包层，嵌入在传播光信号的包层中的芯，以及嵌入在包层中的布线图案，其传输电 信号，可以通过使包层充当绝缘层并且将布线图案嵌入包层中来提供改善的光学连接效率和降低的材料成本。

    Architecture of connecting optical PCB, transceiver modules for optical PCB and optical connection block
    45.
    发明授权
    Architecture of connecting optical PCB, transceiver modules for optical PCB and optical connection block 失效
    连接光学PCB的结构，光学PCB和光学连接块的收发器模块

    公开(公告)号：US07062144B2

    公开(公告)日：2006-06-13

    申请号：US11067708

    申请日：2005-03-01

    Applicant: Sung Hwan Hwang ,  Han Seo Cho ,  Mu Hee Cho ,  Hyo-Hoon Park

    Inventor： Sung Hwan Hwang ,  Han Seo Cho ,  Mu Hee Cho ,  Hyo-Hoon Park

    IPC: G02B6/00

    CPC classification number: G02B6/423 ,  G02B6/4214 ,  G02B6/43

    Abstract: Disclosed herein is an architecture of connecting a transceiver module for an optical PCB, in which an active photo-electric element and other components to be integrated in the optical PCB having waveguides are packaged, waveguides arranged in the optical PCB, and an optical connection block for optical coupling between the transceiver module and the waveguides of the optical PCB. Guide pin insertion holes are formed at one sides of the ends of the waveguides such that the optical PCB, the transceiver module and the optical connection block can be passively aligned using guide pins inserted into the guide pin insertion holes.

    Abstract translation: 这里公开了一种连接用于光学PCB的收发器模块的架构，其中要集成在具有波导的光学PCB中的有源光电元件和其它组件被封装，布置在光学PCB中的波导和光学连接块 用于光收发器模块与光学PCB的波导之间的光耦合。 引导销插入孔形成在波导端部的一侧，使得可以使用插入引导销插入孔中的引导针将光学PCB，收发器模块和光学连接块无源对准。

    Printed circuit board for optical waveguides and method of manufacturing same
    46.
    发明授权
    Printed circuit board for optical waveguides and method of manufacturing same 有权
    光波导用印刷电路板及其制造方法

    公开(公告)号：US08989529B2

    公开(公告)日：2015-03-24

    申请号：US12553899

    申请日：2009-09-03

    Applicant: Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

    Inventor： Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

    IPC: G02B6/12 ,  G02B6/138

    CPC classification number: G02B6/138

    Abstract: Disclosed herein is a printed circuit board for an optical waveguide, including: a lower substrate; an insulation layer which has a through-hole and is formed on the lower substrate; an optical waveguide which is formed in the through-hole such that a clearance is present between the optical wave guide and an inner wall of the through-hole; and an adhesive material which is charged in the clearance. The printed circuit board for an optical waveguide is advantageous in that a lower clad material, a core material and an upper clad material are sequentially applied on the lower substrate partially, not entirely, based on the region in which a core is formed, and is then patterned to form an optical waveguide, so that the amounts of the lower and upper clad materials and the core material, which are used to form the optical waveguide, can be greatly decreased.

    Abstract translation: 本文公开了一种用于光波导的印刷电路板，包括：下基板; 绝缘层，其具有通孔并形成在所述下基板上; 形成在所述通孔中的光波导，使得在所述光波导与所述通孔的内壁之间存在间隙; 以及在间隙中装入的粘合剂材料。 用于光波导的印刷电路板的优点在于，基于形成芯的区域，下包层材料，芯材料和上包层材料被部分地，不完全地部分地施加在下基板上，并且是 然后图案化以形成光波导，使得用于形成光波导的下包层材料和上覆层材料和芯材的量可以大大降低。

    Optical wiring board and manufacturing method thereof
    47.
    发明授权
    Optical wiring board and manufacturing method thereof 失效
    光接线板及其制造方法

    公开(公告)号：US08280204B2

    公开(公告)日：2012-10-02

    申请号：US12760035

    申请日：2010-04-14

    Applicant: Sang-Hoon Kim ,  Han-Seo Cho ,  Joon-Sung Kim ,  Jae-Hyun Jung

    Inventor： Sang-Hoon Kim ,  Han-Seo Cho ,  Joon-Sung Kim ,  Jae-Hyun Jung

    IPC: G02B6/12

    CPC classification number: G02B6/4214 ,  B32B37/02 ,  B32B38/10 ,  B32B2038/0092 ,  B32B2457/08 ,  B32B2457/14 ,  G02B6/428 ,  G02B6/43 ,  Y10T156/1002

    Abstract: An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a base substrate having an optical waveguide layer with a mirror groove formed on one surface thereof and a first insulation layer stacked on one surface of the optical waveguide layer and having a through-hole connected with the mirror groove formed thereon, forming a metal mirror layer connected from the mirror groove to an inner wall of the through-hole and forming an electrode pad on a side of the other surface of the optical waveguide layer, in which the electrode pad is disposed in accordance with the position of the metal mirror layer.

    Abstract translation: 公开了一种光布线板及其制造方法。 根据本发明的实施例，该方法包括提供一基底基板，该基底基板具有光波导层，该光波导层在其一个表面上形成有反射镜槽，第一绝缘层层叠在该光波导层的一个表面上， 与形成在其上的反射镜槽连接的孔，形成从反射镜槽连接到通孔的内壁的金属镜层，并在光波导层的另一个表面的一侧形成电极焊盘，其中电极 按照金属镜面层的位置设置衬垫。

    Method of manufacturing printed circuit board for optical waveguides
    48.
    发明授权
    Method of manufacturing printed circuit board for optical waveguides 失效
    制造光波导用印刷电路板的方法

    公开(公告)号：US08204345B2

    公开(公告)日：2012-06-19

    申请号：US13137754

    申请日：2011-09-09

    Applicant: Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

    Inventor： Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

    IPC: G02B6/12 ,  H01L21/02

    CPC classification number: G02B6/43 ,  B32B2307/51 ,  B32B2457/08 ,  C07D301/06 ,  G02B6/138 ,  H05K1/0274 ,  H05K1/028 ,  H05K3/281 ,  H05K3/4635 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T156/10

    Abstract: A method of manufacturing a printed circuit board for optical waveguides, including: preparing a base substrate; forming an optical waveguide, which includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core, on an upper middle of the base substrate; disposing a side substrate including a first side substrate that has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a first circuit pattern formed therein and a second side substrate disposed on the first side substrate on the upper part of the base substrate on which the optical waveguide is formed; disposing an upper substrate on the side substrate on which the through hole is formed; and stacking the side substrate and the upper substrate on the base substrate on which the optical waveguide is formed.

    Abstract translation: 一种制造光波导用印刷电路板的方法，包括：制备基底; 形成光波导，其包括下包层，形成在下包层的上中间的芯，以及形成在下包层上的围绕芯的上表面和侧表面的上包层， 基底; 设置包括第一侧基板的侧基板，所述第一侧基板具有设置在其中间的光波导穿过的通孔和形成在其中的第一电路图案，以及设置在第一侧基板上的第二侧基板 其上形成有光波导的基底基板; 在其上形成有通孔的侧基板上设置上基板; 并且在其上形成有光波导的基底基板上堆叠侧基板和上基板。

    Method of manufacturing printed circuit board
    50.
    发明授权
    Method of manufacturing printed circuit board 失效
    制造印刷电路板的方法

    公开(公告)号：US07697800B2

    公开(公告)日：2010-04-13

    申请号：US12453616

    申请日：2009-05-15

    Applicant: Han Seo Cho ,  Je-Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

    Inventor： Han Seo Cho ,  Je-Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

    IPC: G02B6/12 ,  G02B6/10 ,  H01L21/00

    CPC classification number: G02B6/1221 ,  G02B6/136 ,  G02B6/28 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/20 ,  Y10T29/49155

    Abstract: A method of manufacturing a printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.

    Abstract translation: 一种制造印刷电路板的方法，其中形成光波导以及电信号一起传输光信号，电信号包括包层，嵌入在传播光信号的包层中的芯，以及嵌入在包层中的布线图案，其传输电 信号，可以通过使包层充当绝缘层并且将布线图案嵌入包层中来提供改善的光学连接效率和降低的材料成本。

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