Abstract:
A semiconductor device can include a first gate electrode including a gate insulating pattern, a gate conductive pattern and a capping pattern that are sequentially stacked on a semiconductor substrate, and a first spacer of a low dielectric constant disposed on a lower sidewall of the first gate electrode. A second spacer of a high dielectric constant, that is greater than the low dielectric constant, is disposed on an upper sidewall of the first gate electrode above the first spacer.
Abstract:
Semiconductor devices are provided including a substrate having a first surface and a second surface recessed from opposite sides of the first surface, a gate pattern formed on the first surface and having a gate insulating layer and a gate electrode, a carbon-doped silicon buffer layer formed on the second surface, and source and drain regions doped with an n-type dopant or p-type dopant, epitaxially grown on the silicon buffer layer to be elevated from a top surface of the gate insulating layer.
Abstract:
A semiconductor memory device may include a semiconductor substrate with an active region extending in a first direction parallel with respect to a surface of the semiconductor substrate. A pillar may extend from the active region in a direction perpendicular with respect to the surface of the semiconductor substrate with the pillar including a channel region on a sidewall thereof. A gate insulating layer may surround a sidewall of the pillar, and a word line may extend in a second direction parallel with respect to the surface of the semiconductor substrate. Moreover, the first and second directions may be different, and the word line may surround the sidewall of the pillar so that the gate insulating layer is between the word line and the pillar. A contact plug may be electrically connected to the active region and spaced apart from the word line, and a bit line may be electrically connected to the active region through the contact plug with the plurality of bit lines extending in the first direction. Related methods are also discussed.
Abstract:
A semiconductor memory device may include a semiconductor substrate with an active region extending in a first direction parallel with respect to a surface of the semiconductor substrate. A pillar may extend from the active region in a direction perpendicular with respect to the surface of the semiconductor substrate with the pillar including a channel region on a sidewall thereof. A gate insulating layer may surround a sidewall of the pillar, and a word line may extend in a second direction parallel with respect to the surface of the semiconductor substrate. Moreover, the first and second directions may be different, and the word line may surround the sidewall of the pillar so that the gate insulating layer is between the word line and the pillar. A contact plug may be electrically connected to the active region and spaced apart from the word line, and a bit line may be electrically connected to the active region through the contact plug with the plurality of bit lines extending in the first direction. Related methods are also discussed.
Abstract:
Disclosed herein is a low-priced flooring comprising a transfer-printed high-density fiberboard (HDF). According to the flooring, an aqueous primer layer is formed on a high-density fiberboard as a core layer and transfer printing is performed on the surface of the primer layer to form a printed layer so that the background fiber pattern of the high-density fiberboard is covered, the adhesion of the core layer to the printed layer is enhanced, and the natural beauty of wood is faithfully imparted to the surface of the flooring.
Abstract:
A digital locked loop circuit having a synchronous delay line, an input node for receiving an external clock signal, and an internal clock node for generating an internal clock signal synchronized with the external clock signal. The digital locked loop circuit includes; a delay buffer for generating a first clock signal by delaying the external clock signal by a predetermined time; a main delay for generating a second clock signal by delaying the first clock signal by a predetermined time; a first delay line consisting of a plurality of serially connected first unit delays, each of the plurality of first unit delays generating a first unit delay output signal by delaying the second clock signal by a predetermined unit length; a second delay line consisting of a plurality of serially connected second unit delays, each of the plurality of second unit delays generating a second unit delay output signal by delaying the first clock signal by a predetermined unit length; switching means for coupling the first clock signal to the internal clock node in response to an enable signal, the switching means having a plurality of switches, each of the plurality of switches connected between an output node of a corresponding second unit delay of the second delay line and the internal clock node; and phase comparing means for generating the enable signal for a predetermined switch of the plurality of switches when the first clock signal is in phase with at least one first unit delay output signal, the phase comparing means being connected between an output node of a first unit delay and an enable port of a corresponding switch of the plurality of switches of the switching means.
Abstract:
A pouch laminator used for coating both sides of a small-sized sheet such as a photograph or identification card with a vinyl film is disclosed. Two folding guide plates are hinged to front and rear sides of the laminator body, respectively. A pair of bearing units are placed inside the laminator body for bearing the heating and molding rollers. A tension member detachably mounted to the top of each bearing unit for elastically holding the heating and molding rollers. A power supply unit having an elastic piece is placed aside each bearing unit. The elastic piece is brought into contact with a terminal provided on an associated end of each heating roller. A flat or embossing roller may be used as the molding roller. The embossing roller has a knurled rolling surface, thus embossing both sides of a coated sheet.
Abstract:
A synchronous dynamic random access memory capable of accessing data in a memory cell array therein in synchronism with a system clock from an external system such as a central processing unit (CPU). The synchronous DRAM receives an external clock and includes a plurality of memory banks each including a plurality of memory cells and operable in either an active cycle or a precharge cycle, a circuit for receiving a row address strobe signal and latching a logic level of the row address strobe signal in response to the clock, an address input circuit for receiving an externally generated address selecting one of the memory banks, and a circuit for receiving the latched logic level and the address from the address input circuit and for outputting an activation signal to the memory bank selected by the address and an inactivation signals to unselected memory banks when the latched logic level is a first logic level, so that the selected memory bank responsive to the activation signal operates in the active cycle while the unselected memory banks responsive to the inactivation signals operate in the precharge cycle.
Abstract:
A reference voltage generating circuit for converting a first source voltage to a second source voltage includes a positive thermal compensation circuit connected between the first source voltage and ground voltage and having a positive thermal coefficient for positively compensating the second source voltage with respect to temperature variations, and a negative thermal compensation circuit responsive to the output of the positive thermal compensation circuit and having a negative thermal coefficient for negatively compensating the second source voltage with respect to temperature variations, wherein the positive and negative thermal coefficients counter-balance each other so as to stabilize the second source voltage.
Abstract:
A semiconductor memory device stably operates over a wide range of the power supply voltage by including a power supply voltage level detector for generating detecting signals according to predetermined levels of the power supply voltage and an oscillator for generating a frequency-controlled oscillation pulse whose frequency is changeable according to the detecting signals. Thus, a boosting ratio of a boosting circuit, the refresh period of a refresh circuit and the substrate voltage of a substrate voltage generator can be adaptively changeable according to the variation of the power supply voltage.