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    LIGHTING APPARATUS
    42.
    发明申请
    LIGHTING APPARATUS 有权
    照明设备

    公开(公告)号：US20130229793A1

    公开(公告)日：2013-09-05

    申请号：US13821551

    申请日：2011-07-25

    Applicant: Siegfried Herrmann ,  Norwin Von Malm ,  Lutz Höppel

    Inventor： Siegfried Herrmann ,  Norwin Von Malm ,  Lutz Höppel

    IPC: H05B33/08 ,  F21L13/06

    CPC classification number: H05B33/08 ,  F21L13/06 ,  H01L41/044 ,  H01L41/107 ,  H05B33/0809

    Abstract: What is specified is: a lighting apparatus, with a piezoelectric transformer (1), which has a mounting face (10), on which at least two output-side connection points (11) are arranged, and at least one substrateless light-emitting diode (2), which is designed to generate electromagnetic radiation, wherein the at least one substrateless light-emitting diode (2) is fitted at least indirectly to the mounting face (10) and fastened mechanically to the mounting face (10), and the at least one substrateless light-emitting diode (2) is electrically conductively connected to at least two of the output-side connection points (11).

    Abstract translation: 具体实施方式是：具有压电变压器（1）的照明装置，其具有安装面（10），至少两个输出侧连接点（11）配置在所述安装面上，以及至少一个无基板发光 被设计成产生电磁辐射的二极管（2），其中所述至少一个无基板发光二极管（2）至少间接地装配到所述安装面（10）并机械地紧固到所述安装面（10），以及 所述至少一个无衬底发光二极管（2）与所述输出侧连接点（11）中的至少两个导电地连接。

    Optoelectronic component
    43.
    发明授权
    Optoelectronic component 有权
    光电元件

    公开(公告)号：US08476667B2

    公开(公告)日：2013-07-02

    申请号：US12809682

    申请日：2008-12-04

    Applicant: Siegfried Herrmann

    Inventor： Siegfried Herrmann

    IPC: H01L33/38 ,  H01L33/64

    CPC classification number: H01L33/44 ,  H01L33/46 ,  H01L33/62 ,  H01L33/64 ,  H01L33/641 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An optoelectronic component (10) comprising at least one metal body (15) and a layer sequence (17), which is applied on a base body (11) and which is embodied to emit an electromagnetic radiation and to which an insulation (12) is applied on at least one side area, wherein the at least one metal body (15) is applied to at least one region of the insulation (12) and is embodied in such a way that it is in thermally conductive contact with the base body (11).

    Abstract translation: 一种光电子部件（10），包括至少一个金属体（15）和层序列（17），其被施加在基体（11）上，并被实施为发射电磁辐射，绝缘体（12） 施加在至少一个侧面区域上，其中所述至少一个金属体（15）被施加到所述绝缘体（12）的至少一个区域并被实施为使其与所述基体导热接触 （11）。

    Method for producing a plurality of optoelectronic devices, and optoelectronic device
    44.
    发明授权
    Method for producing a plurality of optoelectronic devices, and optoelectronic device 有权
    制造多个光电器件的方法，以及光电器件

    公开(公告)号：US08461601B2

    公开(公告)日：2013-06-11

    申请号：US12667199

    申请日：2008-06-19

    Applicant: Siegfried Herrmann

    Inventor： Siegfried Herrmann

    IPC: H01L29/18 ,  H01L33/00

    CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/0756 ,  H01L33/0079 ,  H01L33/382 ,  H01L33/385 ,  H01L2221/68363 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012

    Abstract: A method for producing a plurality of optoelectronic devices is specified, comprising the following steps: providing a connection carrier assemblage having a plurality of device regions, wherein at least one electrical connection region is provided in each of the device regions, providing a semiconductor body carrier, on which a plurality of separate semiconductor bodies connected to the semiconductor body carrier are arranged, wherein the semiconductor bodies each have a semiconductor layer sequence having an active region, arranging the connection carrier assemblage and the semiconductor body carrier relative to one another in such a way that the semiconductor bodies face the device regions, mechanically connecting a plurality of semiconductor bodies to the connection carrier assemblage in a mounting region of a device region assigned to the respective semiconductor body, electrically conductively connecting the respective semiconductor body to the connection region of the device region assigned to the semiconductor body, and separating from the semiconductor body carrier the semiconductor bodies that are to be connected or are connected to the connection carrier assemblage, and dividing the connection carrier assemblage into a plurality of separate optoelectronic devices each having a connection carrier, which has the device region, and a semiconductor body arranged on the connection carrier and electrically conductively connected to the connection region.

    Abstract translation: 规定了多个光电器件的制造方法，包括以下步骤：提供具有多个器件区域的连接载体组合，其中在每个器件区域中设置至少一个电连接区域，提供半导体本体载体 其上配置有连接到半导体主体载体的多个分离的半导体本体，其中半导体主体各自具有具有有源区的半导体层序列，将连接载体组合和半导体本体载体相对于彼此布置 半导体主体面对设备区域的方式，将多个半导体主体机械地连接到分配给各个半导体主体的设备区域的安装区域中的连接载体组件，将各个半导体主体连接到 设备寄存器 离子，并且与半导体本体载体分离将被连接或连接到连接载体组件的半导体本体，并将连接载体组合分成多个分离的光电子器件，每个光电子器件具有连接载体， 其具有器件区域，以及布置在连接载体上并导电连接到连接区域的半导体本体。

    RADIATION-EMITTING COMPONENT AND METHOD FOR ITS MANUFACTURE
    48.
    发明申请
    RADIATION-EMITTING COMPONENT AND METHOD FOR ITS MANUFACTURE 有权
    辐射发射元件及其制造方法

    公开(公告)号：US20110278621A1

    公开(公告)日：2011-11-17

    申请号：US13129018

    申请日：2009-11-05

    Applicant: Siegfried Herrmann ,  Sebastian Taeger

    Inventor： Siegfried Herrmann ,  Sebastian Taeger

    IPC: H01L33/44 ,  H01L33/50

    CPC classification number: H01L33/44 ,  C08G61/02 ,  H01L24/24 ,  H01L24/82 ,  H01L33/62 ,  H01L2224/24051 ,  H01L2924/01327 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/00

    Abstract: A radiation-emitting component includes a carrier, a semi-conductor chip arranged on the carrier, wherein the semi-conductor chip includes an active layer to generate electromagnetic radiation and a radiation exit surface, a first and a second contact structure for the electrical contacting of the semi-conductor chip, a first and a second contact layer, wherein the semi-conductor chip is electrically conductively connected to the first contact structure via the first, contact layer and to the second contact structure via the second contact layer, a passivation layer arranged on the semi-conductor chip.

    Abstract translation: 辐射发射部件包括载体，布置在载体上的半导体芯片，其中半导体芯片包括产生电磁辐射的有源层和辐射出射表面，用于电接触的第一和第二接触结构 半导体芯片的第一和第二接触层，其中半导体芯片经由第一接触层和第二接触结构经由第二接触层导电连接到第一接触结构，钝化层 层布置在半导体芯片上。

    LED PROJECTOR
    49.
    发明申请
    LED PROJECTOR 有权
    LED投影机

    公开(公告)号：US20110176116A1

    公开(公告)日：2011-07-21

    申请号：US13062792

    申请日：2009-09-09

    Applicant: Stefan Grötsch ,  Ewald Karl Michael Günther ,  Alexander Wilm ,  Siegfried Herrmann

    Inventor： Stefan Grötsch ,  Ewald Karl Michael Günther ,  Alexander Wilm ,  Siegfried Herrmann

    IPC: G03B21/14

    CPC classification number: G03B21/2033

    Abstract: An LED projector includes a plurality of light sources; and an image generator which includes an arrangement of pixels, each pixel including at least one light source; wherein the LEDs are stacked epi-LEDs which include layers arranged above one another for different colors, or each pixel includes an emission surface and at least two LEDs are arranged adjacent one another in the emission surface.

    Abstract translation: LED投影仪包括多个光源; 以及图像生成器，其包括像素的排列，每个像素包括至少一个光源; 其中所述LED是层叠的epi-LED，其包括不同颜色彼此排列的层，或者每个像素包括发射表面，并且至少两个LED在发射表面中彼此相邻地布置。

    Method for the Production of a Plurality of Optoelectronic Components, and Optoelectronic Component
    50.
    发明申请
    Method for the Production of a Plurality of Optoelectronic Components, and Optoelectronic Component 有权
    制造多种光电元件的方法和光电元件

    公开(公告)号：US20100276706A1

    公开(公告)日：2010-11-04

    申请号：US12667199

    申请日：2008-06-19

    Applicant: Siegfried Herrmann

    Inventor： Siegfried Herrmann

    IPC: H01L33/48 ,  H01L21/50

    CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/0756 ,  H01L33/0079 ,  H01L33/382 ,  H01L33/385 ,  H01L2221/68363 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012

    Abstract: A method for producing a plurality of optoelectronic devices is specified, comprising the following steps: providing a connection carrier assemblage having a plurality of device regions, wherein at least one electrical connection region is provided in each of the device regions, providing a semiconductor body carrier, on which a plurality of separate semiconductor bodies connected to the semiconductor body carrier are arranged, wherein the semiconductor bodies each have a semiconductor layer sequence having an active region, arranging the connection carrier assemblage and the semiconductor body carrier relative to one another in such a way that the semiconductor bodies face the device regions, mechanically connecting a plurality of semiconductor bodies to the connection carrier assemblage in a mounting region of a device region assigned to the respective semiconductor body, electrically conductively connecting the respective semiconductor body to the connection region of the device region assigned to the semiconductor body, and separating from the semiconductor body carrier the semiconductor bodies that are to be connected or are connected to the connection carrier assemblage, and dividing the connection carrier assemblage into a plurality of separate optoelectronic devices each having a connection carrier, which has the device region, and a semiconductor body arranged on the connection carrier and electrically conductively connected to the connection region.

    Abstract translation: 规定了多个光电器件的制造方法，包括以下步骤：提供具有多个器件区域的连接载体组合，其中在每个器件区域中设置至少一个电连接区域，提供半导体本体载体 其上配置有连接到半导体主体载体的多个分离的半导体本体，其中半导体主体各自具有具有有源区的半导体层序列，将连接载体组合和半导体本体载体相对于彼此布置 半导体主体面对设备区域的方式，将多个半导体主体机械地连接到分配给各个半导体主体的设备区域的安装区域中的连接载体组合件，将各个半导体主体连接到 设备寄存器 离子，并且与半导体本体载体分离将被连接或连接到连接载体组件的半导体本体，并将连接载体组合分成多个分离的光电子器件，每个光电子器件具有连接载体， 其具有器件区域，以及布置在连接载体上并导电连接到连接区域的半导体本体。

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