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    Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
    43.
    发明授权
    Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process 有权

    公开(公告)号：US10391605B2

    公开(公告)日：2019-08-27

    申请号：US15287665

    申请日：2016-10-06

    Applicant: Applied Materials, Inc.

    Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

    IPC: B24B37/24

    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

    Fabrication of Polishing Pad by Additive Manufacturing Onto Mold
    45.
    发明申请
    Fabrication of Polishing Pad by Additive Manufacturing Onto Mold 审中-公开

    公开(公告)号：US20180339397A1

    公开(公告)日：2018-11-29

    申请号：US15922813

    申请日：2018-03-15

    Applicant: Applied Materials, Inc.

    Inventor： Daniel Redfield

    IPC: B24B53/017 ,  B24B57/02 ,  B29C64/112 ,  B29C64/129 ,  B29C64/209 ,  B29C64/393

    Abstract: A method of fabricating a polishing pad using an additive manufacturing system includes dispensing a first plurality of first layers from a first plurality of successive layers by, for each respective first layer of the first plurality of first layers, ejecting droplets of polishing layer precursor into gaps between projections from a support to form the respective first layer, and curing the respective first layer before depositing a subsequent first layer, and dispensing a second plurality of layers from the first plurality of successive layers over the first plurality of layers by, for each respective second layer of the second plurality of layers, ejecting droplets of the polishing layer precursor to form the respective second layer, each respective second layer spanning the projections and the gaps, and curing the respective second layer before depositing a subsequent second layer, and removing the polishing layer from the support.

    Polishing pads for high temperature processing
    48.
    发明授权
    Polishing pads for high temperature processing 有权

    公开(公告)号：US11911870B2

    公开(公告)日：2024-02-27

    申请号：US17472006

    申请日：2021-09-10

    Applicant: Applied Materials, Inc.

    Inventor： Sivapackia Ganapathiappan ,  Rajeev Bajaj ,  Yingdong Luo ,  Aniruddh Jagdish Khanna ,  You Wang ,  Daniel Redfield

    IPC: B24B37/24 ,  B24B37/26 ,  B24B37/22

    CPC classification number: B24B37/24 ,  B24B37/26 ,  B24B37/22

    Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements. Each polishing element comprises an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface to define a plurality of channels disposed between the polishing elements. Each of the polishing elements has a plurality of pore-features formed therein. Each of the polishing elements is formed of a pre-polymer composition and a sacrificial material composition. In some cases, a sample of the cured pre-polymer composition has a glass transition temperature (Tg) of about 80° C. or greater. A storage modulus (E′) of the cured pre-polymer composition at a temperature of 80° C. (E′80) can be about 200 MPa or greater.

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