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147 条记录 (耗时 0.057 秒)

    Molded chip fabrication method and apparatus
    41.
    发明申请
    Molded chip fabrication method and apparatus 有权
    成型芯片制造方法和装置

    公开(公告)号：US20050062140A1

    公开(公告)日：2005-03-24

    申请号：US10666399

    申请日：2003-09-18

    申请人： Michael Leung ,  Eric Tarsa ,  James Ibbetson

    发明人： Michael Leung ,  Eric Tarsa ,  James Ibbetson

    IPC分类号： H01L21/56 ,  H01L33/50 ,  H01L23/02

    CPC分类号： H01L33/504 ,  H01L21/565 ,  H01L24/96 ,  H01L27/15 ,  H01L33/50 ,  H01L2224/2518 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/0041 ,  H01L2924/00

    摘要： A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material. One embodiment of an apparatus according to the invention for coating a plurality of semiconductor devices comprises a mold housing having a formation cavity arranged to hold semiconductor devices. The formation cavity is also arranged so that a curable coating material can be injected into and fills the formation cavity to at least partially covering the semiconductor devices.

    摘要翻译： 一种用于涂覆多个半导体器件的方法和设备，其特别适用于涂覆含有转化颗粒的涂层材料的LED。 根据本发明的一种方法包括提供具有地层腔的模具。 多个半导体器件安装在模具形成腔内，并且可固化涂层材料被注入或以其它方式被引入到模具中以填充模具形成腔并且至少部分地覆盖半导体器件。 固化涂层材料，使得半导体器件至少部分地嵌入固化的涂层材料中。 具有嵌入式半导体器件的固化的涂层材料从形成腔中移除。 半导体器件被分离成使得每个半导体器件至少部分被固化的涂层材料层覆盖。 根据本发明的用于涂覆多个半导体器件的设备的一个实施例包括具有布置成保持半导体器件的形成空腔的模具外壳。 形成空腔也被布置成使得可固化的涂层材料可以注入并填充地层腔以至少部分地覆盖半导体器件。

    Reflector packages and methods for packaging of a semiconductor light emitting device
    42.
    发明申请
    Reflector packages and methods for packaging of a semiconductor light emitting device 有权
    用于封装半导体发光器件的反射器封装和方法

    公开(公告)号：US20050221518A1

    公开(公告)日：2005-10-06

    申请号：US11044779

    申请日：2005-01-27

    申请人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

    发明人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

    IPC分类号： H01L21/00 ,  H01L33/52 ,  H01L33/58

    CPC分类号： H01L33/58 ,  H01L33/52

    摘要： Methods of packaging a semiconductor light emitting device in a reflector having a moat positioned between a lower and an upper sidewall thereof, the upper and lower sidewall defining a reflective cavity, include dispensing encapsulant material into the reflective cavity including the light emitting device therein to cover the light emitting device and to form a convex meniscus of encapsulant material in the reflective cavity extending from an edge of the moat without contacting the upper sidewall of the reflector. The encapsulant material in the reflective cavity is cured. Packaged semiconductor light emitting devices and reflectors for the same are also provided.

    摘要翻译： 将半导体发光器件封装在具有位于其下侧和上侧壁之间的护城河的反射器中的方法，所述上壁和下侧壁限定反射腔，包括将密封剂材料分配到包括其中的发光器件的反射腔中以覆盖 并且在反射腔中形成密封材料的凸弯月面，其从护城河的边缘延伸而不接触反射器的上侧壁。 反射腔中的密封材料固化。 还提供了用于其的封装的半导体发光器件和反射器。

    COMPOSITE HIGH REFLECTIVITY LAYER
    43.
    发明申请
    COMPOSITE HIGH REFLECTIVITY LAYER 有权
    复合高反射层

    公开(公告)号：US20120280263A1

    公开(公告)日：2012-11-08

    申请号：US13415626

    申请日：2012-03-08

    申请人： James Ibbetson ,  Ting Li ,  Bernd Keller

    发明人： James Ibbetson ,  Ting Li ,  Bernd Keller

    IPC分类号： H01L33/60 ,  H01L33/48

    CPC分类号： H01L33/46 ,  G02B19/0028 ,  G02B19/0061 ,  H01L33/48 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

    摘要： A high efficiency light emitting diode with a composite high reflectivity layer integral to said LED or package to improve emission efficiency. One embodiment of a light emitting diode (LED) chip comprises a LED and a composite high reflectivity layer integral to the LED to reflect light emitted from the active region. One embodiment of a LED package comprises a LED mounted on a substrate with an encapsulant over said LED and a composite high reflectivity layer arranged to reflect emitted light. The composite layer comprises a plurality of layers such that at least one of said plurality of layers has an index of refraction lower than the encapsulant and a reflective layer on a side of said plurality of layers opposite the LED. In some embodiments, conductive vias are included through the composite layer to allow an electrical signal to pass through the layer to the LED.

    摘要翻译： 一种具有与所述LED或封装集成的复合高反射层的高效率发光二极管，以提高发射效率。 发光二极管（LED）芯片的一个实施例包括LED和与LED成一体的复合高反射率层以反射从有源区域发射的光。 LED封装的一个实施例包括安装在具有在所述LED上的密封剂的衬底上的LED和布置成反射发射光的复合高反射率层。 复合层包括多个层，使得所述多个层中的至少一个层具有低于密封剂的折射率和在与LED相对的所述多个层的一侧上的反射层。 在一些实施例中，通过复合层包括导电通孔，以允许电信号通过该层到达LED。

    LIGHT EMITTING DIODE WITH POROUS SIC SUBSTRATE AND METHOD FOR FABRICATING
    46.
    发明申请
    LIGHT EMITTING DIODE WITH POROUS SIC SUBSTRATE AND METHOD FOR FABRICATING 有权
    具有多孔SIC基板的发光二极管及其制造方法

    公开(公告)号：US20050184307A1

    公开(公告)日：2005-08-25

    申请号：US10676953

    申请日：2003-09-30

    申请人： Ting Li ,  James Ibbetson ,  Bernd Keller

    发明人： Ting Li ,  James Ibbetson ,  Bernd Keller

    IPC分类号： H01L21/3063 ,  H01L31/0236 ,  H01L33/16 ,  H01L33/20 ,  H01L33/00

    CPC分类号： H01L33/20 ,  H01L21/3063 ,  H01L31/0236 ,  H01L33/16 ,  H01L2224/16245 ,  H01L2924/10158

    摘要： A method and apparatus for forming a porous layer on the surface of a semiconductor material wherein an electrolyte is provided and is placed in contact with one or more surfaces of a layer of semiconductor material. The electrolyte is heated and a bias is introduced across said electrolyte and the semiconductor material causing a current to flow between the electrolyte and the semiconductor material. The current forms a porous layer on the one or more surfaces of the semiconductor material in contact with the electrolyte. The semiconductor material with its porous layer can serve as a substrate for a light emitter. A semiconductor emission region can be formed on the substrate. The emission region is capable of emitting light omnidirectionally in response to a bias, with the porous layer enhancing extraction of the emitting region light passing through the substrate.

    摘要翻译： 一种用于在半导体材料的表面上形成多孔层的方法和装置，其中提供电解质并与半导体材料层的一个或多个表面接触。 电解质被加热并且跨越所述电解质和半导体材料引入偏压，导致电流在电解质和半导体材料之间流动。 电流在与电解质接触的半导体材料的一个或多个表面上形成多孔层。 具有多孔层的半导体材料可以用作发光体的基板。 可以在衬底上形成半导体发射区域。 发射区域能够响应于偏压而全向发光，多孔层增强了通过衬底的发射区域光的提取。