摘要:
A method of manufacture of an integrated circuit package system includes: providing a penetrable layer; partially immersing leads in the penetrable layer; coupling an integrated circuit die to the leads; molding a package body on the integrated circuit die, the leads, and the penetrable layer; and exposing stand-off leads from the leads by removing the penetrable layer including establishing a stand-off height between a bottom of the package body and the bottom of the stand-off leads.
摘要:
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a first internal integrated circuit structure and a second internal integrated circuit structure over the substrate; connecting the first internal integrated circuit structure and the second internal integrated circuit structure to the substrate with internal interconnects; forming asymmetric encapsulation structures above the first internal integrated circuit structure and the second internal integrated circuit structure; and encapsulating the first internal integrated circuit structure and the internal interconnects with an encapsulation.
摘要:
A method of manufacture of an integrated circuit packaging system includes: providing a base circuit assembly having an integrated circuit device; mounting a pre-formed conductive frame having an outer interconnect and an inner interconnect over the base circuit assembly, the inner interconnect on the integrated circuit device and the outer interconnect around the integrated circuit device; applying an encapsulant over the inner interconnect and the outer interconnect; and removing a portion of the pre-formed conductive frame exposing an end of the inner interconnect and the outer interconnect.
摘要:
A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit having an active side and a non-active side; forming a channel through the integrated circuit; forming an indent, having a flange and an indent side, from a peripheral region of the non-active side; and forming a conformal interconnect, having an offset segment, a sloped segment, and a flange segment, under the indent.
摘要:
An integrated circuit package system includes: providing a substrate with an integrated circuit mounted thereover; mounting a structure, having ground pads, over the integrated circuit; encapsulating the integrated circuit with an encapsulation while leaving the structure partially exposed; and attaching a conformal shielding to the encapsulation and electrically connected to the grounding pads.
摘要:
A method of manufacture of an integrated circuit packaging system includes: forming an encapsulation surrounding an integrated circuit having an inactive side and an active side exposed; forming a hole through the encapsulation with the hole not exposing the integrated circuit; forming a through conductor in the hole; and mounting a substrate with the integrated circuit surrounded by the encapsulation with the active side facing the substrate.
摘要:
An integrated circuit package system includes: mounting an integrated circuit, having a planar interconnect, over a carrier with the planar interconnect at a non-active side of the integrated circuit and an active side of the integrated circuit facing the carrier; connecting the integrated circuit and the carrier; connecting the planar interconnect and the carrier; and forming an encapsulation over the integrated circuit, the carrier, and the planar interconnect.
摘要:
A method of manufacture of an integrated circuit packaging system includes: providing a structure having a via filled with conductive material completely through the structure, a recess, and a pedestal portion bordering the recess; mounting a semiconductor device inside the recess in the structure; and encapsulating the structure and the semiconductor device in an encapsulation.
摘要:
A method of manufacture of an integrated circuit packaging system includes: providing a base circuit assembly having an integrated circuit device; mounting a pre-formed conductive frame having an outer interconnect and an inner interconnect shorter than the outer interconnect over the base circuit assembly, the inner interconnect over the integrated circuit device and the outer interconnect around the integrated circuit device; applying an encapsulant over the inner interconnect and the outer interconnect; and removing a portion of the pre-formed conductive frame exposing an end of the inner interconnect and an end of the outer interconnect.
摘要:
A method of manufacture of an integrated circuit packaging system includes: forming an encapsulation surrounding an integrated circuit having an inactive side and an active side exposed; forming a hole through the encapsulation with the hole not exposing the integrated circuit; forming a through conductor in the hole; and mounting a substrate with the integrated circuit surrounded by the encapsulation with the active side facing the substrate.