摘要:
An abrasion-resistant screen-printed potentiometer includes top and bottom resistive layers screen-printed on a substrate. The resistivity of the top layer is substantially greater than the resistivity of the bottom layer. A slide arm is in pressure contact with the top layer and is slidably movable thereacross.
摘要:
Meat or poultry is cooked automatically in a thermal oven to a desired degree of doneness by a chosen time. The temperature of the meat or poultry is monitored, and linear extrapolations are made therefrom. These extrapolations are compared to the course the cooking should follow, and the oven temperature is automatically varied to correct deviations from the ideal course.
摘要:
A circuit for controlling power consumption of a load, by controlling the flow of current thereto, utilizes at least one parallel combination of non-linear resistance elements, such as a varistor and the like, and a gateable semiconductor switching device, such as a triac and the like, to substantially reduce or prevent current flow when the semiconductor switching device is gated to an "off" condition and to enable normal current flow to a load when the semiconductor switching device is gated to an "on" condition. Embodiments of the power circuits for control of magnetron power, in a microwave oven, are illustrated.
摘要:
A flexible high density interconnect structure is provided by extending the high density interconnect structure beyond the solid substrate containing the chips interconnected thereby. During fabrication, the flexible portion of the high density interconnect structure is supported by a temporary interconnect support to facilitate fabrication of the structure in accordance with existing fabrication techniques. Subsequently, that temporary support structure may be removed or may remain in place if it sufficiently flexible to impart the desired degree of flexibility to that portion of the high density interconnect structure. Methods of fabrication are also disclosed.
摘要:
A high density interconnect structure is rendered suitable for the packaging of overlay sensitive chips by providing a cavity in the high density interconnect structure which spaces the sensitive surface of such chips from the overlying high density interconnect structure in a manner which prevents undesired interactions between the dielectric of the high density interconnect structure and the chip.
摘要:
A high acceleration object includes an electronic system which is operable at accelerations in excess of 20,000 g. Connections between integrated circuit chips and other portions of the electronic system are provided by metallization patterns disposed on polymer dielectric layers which are self-supporting across gaps between components. A high density interconnect structure is disposed within the cavity of a hermetically sealed package.
摘要:
An improved high density interconnect structure may include electronic components mounted on both sides of its substrate or a substrate which is only as thick as the semiconductor chips which reduces the overall structure thickness to the thickness of the semiconductor chips plus the combined thickness of the high density interconnect structure's dielectric and conductive layers. In the two-sided structures, feedthroughs, which are preferably hermetic, provide connections between opposite sides of the substrate. Substrates of either of these types may be stacked to form a three-dimensional structure. Means for connecting between adjacent substrates are preferably incorporated within the boundaries of the stack rather than on the outside surface thereof.
摘要:
A packaged electronics system, having respective portions each with respective input and output ports, and having interconnection busses between certain of these ports, is tested as follows. Each input port has a set of first transmission gates associated therewith for selectively disconnecting it during testing from the end of each interconnection bus connected bit during normal operation. Each input port has a second set of transmission gates associated therewith for selectively applying test vectors thereto during testing as provided in parallel form from a serially loaded shift register. Each output port connects to the input connections of a respective set of tristate drivers for selectively applying its output signals at relatively low source impedance to at least one interconnection bus connected from the output connections of that set of tristate drivers. A shift register converts the signals appearing in parallel at least one end of each interconnection bus to a concatenation of test results in serial form.
摘要:
The functionality, versatility and connection and packing density of a high density interconnect structure is enhanced by mounting one or more components on top of the high density interconnect structure for connection to conductors of the high density interconnect structure and the chips embedded within the high density interconnect structure. Both active and passive components may be mounted in this manner, as may components which would be adversely affected by high density interconnect structure fabrication temperatures or by the presence of the high density interconnect structure dielectric.
摘要:
A method of removing components bonded to a substrate without damaging either the component-to-be-removed or adjacent components involves bonding a lifting member to an exposed surface of a component-to-be-removed with a bonding layer whose yielding temperature is above the yielding temperature of the bonding layer which bonds the component-to-be-removed to the substrate and then pulling the lifting member under conditions which cause the bond between the component and the substrate to yield. This component removal process enables post removal failure analysis to be performed on a faulty component and also allows a removed good component to be reused by preventing damage to the component being removed.