公开(公告)号：US20050221587A1

公开(公告)日：2005-10-06

申请号：US11075712

申请日：2005-03-10

申请人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

发明人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

IPC分类号： H01L21/68 ,  H01L21/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/52 ,  H01L21/58 ,  H01L21/60 ,  H01L21/683 ,  H01L21/687

CPC分类号： H01L21/67092 ,  B24B37/042 ,  B32B37/003 ,  B32B37/1018 ,  B32B38/0012 ,  B32B2310/0831 ,  B32B2457/14 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  Y10T29/5313 ,  Y10T29/53191 ,  Y10T428/1452 ,  H01L2924/3512 ,  H01L2924/00

摘要： The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

公开(公告)号：US20050161793A1

公开(公告)日：2005-07-28

申请号：US11042347

申请日：2005-01-26

申请人： Takao Ohno ,  Eiji Yoshida ,  Hiroshi Misawa

发明人： Takao Ohno ,  Eiji Yoshida ,  Hiroshi Misawa

IPC分类号： H01L21/60 ,  H01L23/02 ,  H01L23/12 ,  H01L23/31 ,  H01L23/52 ,  H01L23/538 ,  H01L25/04 ,  H01L25/065 ,  H01L27/146 ,  H01L31/0203

CPC分类号： H01L23/3114 ,  H01L23/3128 ,  H01L24/50 ,  H01L24/75 ,  H01L24/79 ,  H01L24/81 ,  H01L24/86 ,  H01L25/0657 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/75 ,  H01L2224/75302 ,  H01L2224/81121 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

摘要： A semiconductor device includes a semiconductor element having a plurality of electrodes provided on one principal surface thereof and a wiring substrate having a conductive layer on an insulating substrate. The wiring substrate is arranged in a substantially U-shape along an outer edge of the semiconductor element. An end of the conductive layer of the wiring substrate is connected to the electrodes of the semiconductor element. The other end of the conductive layer extends in a direction opposite to the semiconductor element on the other principal surface side of the semiconductor element.

摘要翻译： 半导体器件包括具有设置在其一个主表面上的多个电极的半导体元件和在绝缘基板上具有导电层的布线基板。 布线基板沿着半导体元件的外边缘布置成大致U形。 布线基板的导电层的端部与半导体元件的电极连接。 导电层的另一端在与半导体元件的另一主面侧的半导体元件相反的方向上延伸。

公开(公告)号：US06902944B2

公开(公告)日：2005-06-07

申请号：US10708067

申请日：2004-02-06

申请人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

发明人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

IPC分类号： H01L21/68 ,  H01L21/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/52 ,  H01L21/58 ,  H01L21/60 ,  H01L21/683 ,  H01L21/687

CPC分类号： H01L21/67092 ,  B24B37/042 ,  B32B37/003 ,  B32B37/1018 ,  B32B38/0012 ,  B32B2310/0831 ,  B32B2457/14 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  Y10T29/5313 ,  Y10T29/53191 ,  Y10T428/1452 ,  H01L2924/3512 ,  H01L2924/00

摘要： The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

公开(公告)号：US06750074B2

公开(公告)日：2004-06-15

申请号：US10101169

申请日：2002-03-20

申请人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

发明人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

IPC分类号： H01L2100

CPC分类号： H01L21/67092 ,  B24B37/042 ,  B32B37/003 ,  B32B37/1018 ,  B32B38/0012 ,  B32B2310/0831 ,  B32B2457/14 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  Y10T29/5313 ,  Y10T29/53191 ,  Y10T428/1452 ,  H01L2924/3512 ,  H01L2924/00

摘要： The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

摘要翻译： 本发明涉及一种制造半导体衬底的方法，该半导体衬底包括晶片的后研磨步骤，切割步骤，拾取步骤和芯片键合步骤; 以及用于这种方法的半导体衬底夹具。 本发明的目的是减轻效果并且防止由于在减薄的半导体衬底中的强度不足而引起的损坏。 提供了具有外框架21的夹具和布置在外框架21内的橡胶膜22，并且通过在其中供应空气使其形状变形而具有越来越小的体尺寸。 随着橡胶膜22的体积增加，晶片固定夹具20使橡胶膜变形，并且允许布置在晶片1和橡胶膜22A之间的带2和6从中心向外逐渐推向晶片1。 使用这种晶片固定夹具进行安装步骤，后研磨步骤，带重新施加步骤，拾取步骤和芯片粘合步骤。

公开(公告)号：US06528348B2

公开(公告)日：2003-03-04

申请号：US10076580

申请日：2002-02-19

申请人： Fumihiko Ando ,  Akira Takashima ,  Hiroshi Onodera ,  Eiji Yoshida ,  Kazuo Teshirogi

发明人： Fumihiko Ando ,  Akira Takashima ,  Hiroshi Onodera ,  Eiji Yoshida ,  Kazuo Teshirogi

IPC分类号： H01L2940

CPC分类号： H01L25/50 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05548 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06593 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A plurality of semiconductor devices can be mounted on a mounting board in a three-dimensional structure by stacking one on another with a simple structure. A semiconductor element is mounted on a first surface of an interposer. Electrode pads connected to the semiconductor element are arranged around the semiconductor element on the first surface of the interposer. Protruding electrodes are provided on the respective electrode pads. Through holes are formed in the interposer so as to extend from a second surface opposite to the first surface of the redistribution substrate to the respective electrode pads. The semiconductor element is encapsulated by a seal resin. Each of the protruding electrodes is higher than the sealed portion of the semiconductor element.

公开(公告)号：US6137295A

公开(公告)日：2000-10-24

申请号：US79283

申请日：1998-05-15

申请人： Eiji Yoshida

发明人： Eiji Yoshida

IPC分类号： G01R31/302 ,  G01R31/307 ,  H01L21/66 ,  H01L27/12 ,  G01R31/305

CPC分类号： H01L27/1203 ,  G01R31/307

摘要： A defect of an integrated circuit is detected by directly observing the operation of an element with an electron beam tester. Portion (1j) including the formation region of an element is removed from an SOI substrate (1s) on which the integrated circuit is formed. The potential change in a diffusion region (1e) is observed by irradiating electron beam from the rear side of the SOI substrate (1s).

摘要翻译： 通过用电子束测试器直接观察元件的操作来检测集成电路的缺陷。 从形成有集成电路的SOI衬底（1s）去除包括元件的形成区域的部分（1j）。 通过从SOI衬底（1s）的后侧照射电子束来观察扩散区（1e）中的电位变化。

公开(公告)号：US6108465A

公开(公告)日：2000-08-22

申请号：US172255

申请日：1998-10-14

申请人： Rikihiro Iida ,  Akio Ichikawa ,  Yoshihiro Kumagai ,  Yuka Asahina ,  Masataka Nakazawa ,  Eiji Yoshida

发明人： Rikihiro Iida ,  Akio Ichikawa ,  Yoshihiro Kumagai ,  Yuka Asahina ,  Masataka Nakazawa ,  Eiji Yoshida

IPC分类号： H01S3/06 ,  H01S3/083 ,  H01S3/098 ,  H01S3/10 ,  H01S3/136 ,  G02B6/26

CPC分类号： H01S3/06791 ,  H01S3/06725 ,  H01S3/08 ,  H01S3/1109

摘要： The object of the present invention is to provide an optical pulse generator which very stably generates for a long period of time a high cycling frequency optical pulse chain. In order to obtain this object, in a ring type resonator R, the present invention provides an optical path length regulator 14 which performs high precision optical path length adjustment and an optical path length regulator 60 which performs wide range optical path length adjustment, and extracts a clock signal by converting an optical pulse emitted from the ring type resonator R to an electrical signal by a clock extractor 42, detects the frequency difference between a base frequency signal output form a synthesizer 52 by a frequency difference detector 50, and controls said optical path length regulator 14 and said optical path length regulator 60.

摘要翻译： 本发明的目的是提供一种光脉冲发生器，该光脉冲发生器长时间稳定地产生高循环频率的光脉冲链。 为了获得这个目的，在环型谐振器R中，本发明提供一种执行高精度光程长度调节的光路长度调节器14和执行宽范围光程长度调节的光程长度调节器60，并且提取 通过时钟提取器42将从环形谐振器R发射的光脉冲转换为电信号的时钟信号通过频率差检测器50检测由合成器52输出的基频信号之间的频差，并控制所述光 路径长度调节器14和所述光程长度调节器60。

公开(公告)号：US5583959A

公开(公告)日：1996-12-10

申请号：US450533

申请日：1995-05-25

申请人： Masataka Nakazawa ,  Eiji Yoshida

发明人： Masataka Nakazawa ,  Eiji Yoshida

IPC分类号： G02F1/35 ,  G02B6/26 ,  H01S3/00 ,  H01S3/30

CPC分类号： H04B10/25077 ,  G02F1/3513

摘要： A pulse compression device is disclosed for generating ultra short pulses in the femtosecond range In the device an input soliton is subjected to pulse width compression by propagation in a rare-earth doped optical fiber having a gradually diminishing group velocity dispersion from an input end to an output end. The pulse compression is produced by the diminishing dispersion value of the optical fiber as well as by adiabatic narrowing generated by a pumping light coupled, through an optical coupler, to the optical fiber by increasing the energy of the input soliton propagating in the optical fiber. By adjusting the light power of the pumping light, the pulse width of the soliton can be freely controlled.

摘要翻译： 公开了一种用于在飞秒范围内产生超短脉冲的脉冲压缩装置。在装置中，输入孤子通过在具有从输入端逐渐减小的群速度色散的稀土掺杂光纤中传播而进行脉冲宽度压缩 输出端。 脉冲压缩是通过光纤的色散值的减小以及通过光耦合器耦合到泵浦光而产生的绝热变窄产生的，这是通过增加在光纤中传播的输入孤子的能量来产生的。 通过调整泵浦光的光功率，可以自由地控制孤子的脉冲宽度。

公开(公告)号：US4986625A

公开(公告)日：1991-01-22

申请号：US391642

申请日：1989-08-07

申请人： Hiromi Yamada ,  Eiji Yoshida ,  Kenji Takahasi

发明人： Hiromi Yamada ,  Eiji Yoshida ,  Kenji Takahasi

IPC分类号： G02B6/38 ,  G02B6/42 ,  H01R4/24

CPC分类号： G02B6/3801 ,  G02B6/3817 ,  G02B6/3887 ,  G02B6/4246 ,  G02B6/4292 ,  H01R4/2454

摘要： An optical fiber connector comprises a retaining plate (20,60,85,95,113,142,173) made of comparatively thin sheet metal and having a slot (22,61,86,113a,173a) fomred therein which has an opening at one end, the opening having a width smaller than an outer diameter of an optical fiber jacket (5a,101b,103a) and larger than a diameter of a fiber optic core (5a,101a, 103d). The retaining plate is inserted in a connector body (10,70,80,90,111,141,171) at almost a right angle to an axial direction of the optical fiber cable (5,101,103) disposed in the connector body with the opening of the slot facing toward the optical fiber cable, and the retaining plate is pressed into the connector body and the jacket of the optical fiber cable in the connector body.

摘要翻译： 光纤连接器包括由比较薄的金属板制成并具有在其中具有开口的槽（22,61,86,113a，173a）的保持板（20,60,85,95,113,142,173），所述槽在一端具有开口，所述开口具有 宽度小于光纤护套（5a，101b，103a）的外径，大于光纤芯（5a，101a，103d）的直径。 保持板相对于设置在连接器主体中的光纤电缆（5,101,103）的轴向几乎成直角插入连接器主体（10,70,80,90,111,141,171）中，其中开口面向光学 光纤电缆，并且保持板被压入连接器主体中，并且光纤电缆的护套被压入连接器主体中。

公开(公告)号：US4826758A

公开(公告)日：1989-05-02

申请号：US036889

申请日：1987-04-10

申请人： Eiji Yoshida ,  Akio Suzuki ,  Masumi Hosaka

发明人： Eiji Yoshida ,  Akio Suzuki ,  Masumi Hosaka

IPC分类号： G03C1/035 ,  G03C1/005 ,  G03C1/015 ,  G03C1/02

CPC分类号： G03C1/015

摘要： A light-sensitive silver halide photographic emulsion wherein the silver halide crystals thereof are formed by:preparing a dispersion containing homogeneously dispersed silver halide particles, the particles containing silver iodide and having an average grain size of 0.5 .mu.m or less,adding an aqueous solution containing at least one halide other than iodide, and an aqueous solution containing a silver salt, to the dispersion, thereby effecting growth, andadding an aqueous solution containing iodide during the course of the crystal growth, independent of the addition of the solution containing the halide other than iodide.

摘要翻译： 一种感光卤化银照相乳剂，其中卤化银晶体是通过以下方法形成的：制备含有均匀分散的卤化银颗粒的分散体，含有碘化银的颗粒，平均粒径为0.5μm或更小，加入水溶液 将含有碘化物以外的至少一种卤化物和含有银盐的水溶液分散到分散体中，从而进行生长，并且在晶体生长过程中加入含有碘化物的水溶液，与添加含有 碘化物以外的卤化物。