摘要:
A non-volatile semiconductor memory having: a memory cell array having non-volatile memory cells disposed in a matrix form, each memory cell having a floating gate, a control gate, an erase gate, a source and a drain, and data being written through injection of electrons into the floating gate and erased through removal of electrons from the floating gate; and a peripheral circuit driven by a high voltage power source and a low voltage power source, predetermined voltages being applied to the control gate, erase gate and drain respectively of each memory cell to enter one of a data write mode, data erase mode and data read mode, in the data write mode, high voltages being applied to the control gate and drain of the memory cell to be data-written, a stress relaxing voltage being applied to each erase gate of memory cells not to be data-written, and the stress relaxing voltage being an intermediate voltage between the voltages of the high and low power sources.
摘要:
A non-volatile semiconductor memory having: a memory cell array having non-volatile memory cells disposed in a matrix form, each memory cell having a floating gate, a control gate, an erase gate, a source and a drain, and data being written through injection of electrons into the floating gate and erased through removal of electrons from the floating gate; and a peripheral circuit driven by a high voltage power source and a low voltage power source, predetermined voltages being applied to the control gate, erase gate and drain respectively of each memory cell to enter one of a data write mode, data erase mode and data read mode, in the data write mode, high voltages being applied to the control gate and drain of the memory cell to be data-written, a stress relaxing voltage being applied to each erase gate of memory cells not to be data-written, and the stress relaxing voltage being an intermediate voltage between the voltages of the high and low power sources.
摘要:
There is disclosed a non-volatile semiconductor memory device wherein a pair of memory cells constituting one bit data memory unit are connected to a data line in a manner that their drains are commonly connected. When compared to the case where drains of two memory cells are respectively connected to different data lines, the number of the connecting portions between drains and data lines is reduced and the area required for connection is lessened. Thus, a semiconductor memory device satisfactorily miniaturized from the viewpoint of practical use is provided. Further, since there is employed an arrangement such that the one bit data memory unit is comprised of two (a pair of) memory cells, the reliability can be improved. Individual select transistors may be arranged between the drain common junctions in the pair of memory cells, respectively, or a common select transistor may be arranged therebetween. In addition, the sources of the two memory cells may be respectively formed as individual sources.
摘要:
Source and drain regions of a second conductivity type are formed in a stripe form in the surface area of a semiconductor substrate of a first conductivity type. A first insulation film is formed on the source and drain regions of the substrate. A second thin insulation film having a tunnel effect is formed on that part of the substrate which lies between the source and drain regions. A floating gate is formed on the second insulation film. A third insulation film is formed on the first insulation film, the floating gate and that part of the substrate which lies between the source and drain regions and on which the second insulation film is not formed. A control gate is formed on the third insulation film in a stripe form extending in a direction which intersects the source and drain regions. An impurity region of the first conductivity type having an impurity concentration higher than the substrate is formed in the substrate except the source and drain regions and the portions lying below the control gate. A floating gate transistor is constituted to include the substrate, source and drain regions, second insulation film, floating gate, third insulation film and control gate. An offset transistor is constituted to include the substrate, source and drain regions, third insulation film and control gate. The first insulation film and the impurity region are used as an element isolation region of a memory cell.
摘要:
In an electrically erasable non-volatile semiconductor memory device, a plurality of non-volatile semiconductor memory cells are arranged in a matrix form and are connected to corresponding ones of row and column lines. In a data writing mode, a first voltage Vp at is applied to the column lines so that the drains of the memory cells are maintained at a drain potential, and a second voltage is applied to the row lines so that a sum level of the drain potential and the threshold voltage of the memory cell is not smaller than the floating gate potential of the memory cell.
摘要:
A spare memory cell comprises a read FET (Field Effect Transistor), a fusing FET and a current fuse. The FETs are connected in series between a read data line and a low voltage source. The fuse is inserted between a series node of the FETs and a write data line. The fuse is molten when data is written to the spare memory cell. By applying a power source voltage to a control electrode of the fusing FET and by applying a voltage that is higher than the power source voltage to the write data line, the fusing FET is set to its secondary breakdown state. Under this state, a large current flows through the fusing FET to cut off the fuse, thus writing data to the spare memory cell.
摘要:
A semiconductor integrated circuit includes a CMOS circuit operated on a voltage of a first voltage level to set an output node thereof to a voltage of the first voltage level or a reference voltage; an output circuit for controlling supply of a voltage of a second voltage level which is higher than the first voltage level to a signal output node; and an isolation MOS transistor having a current path connected between the output node of the CMOS circuit and the signal output node and a gate connected to receive a control signal. The output node of the CMOS circuit is set to the reference voltage with the conduction resistance of the isolation MOS transistor kept high after the lapse of period in which the voltage of the second voltage level is kept supplied to the signal output node. After this, the conduction resistance of the isolation MOS transistor is reduced in response to the control signal.
摘要:
A semiconductor memory circuit includes a plurality of semiconductor memory areas, a plurality of data lines connected to the memory areas for the transfer of data with respect thereto, a plurality of word lines for transmitting access signals to the memory areas, a column decoder connected to the plurality of data lines and a row decoder having decoding sections respectively connected to the memory areas and switching MOS transistors connected between the decoder sections and a voltage supply terminal. The memory circuit further includes a memory selection circuit connected to the switching MOS transistors of said row decoders for controlling the conduction state of the switching MOS transistors.
摘要:
A semiconductor memory circuit includes a plurality of semiconductor memory areas, a plurality of data lines connected to the memory areas for the transfer of data with respect thereto, a plurality of word lines for transmitting access signals to the memory areas, a column decoder connected to the plurality of data lines and a row decoder having decoding sections respectively connected to the memory areas and switching MOS transistors connected between the decoder sections and a voltage supply terminal. The memory circuit further includes a memory selection circuit connected to the switching MOS transistors of the row decoders for controlling the conduction state of the switching MOS transistors.
摘要:
A semiconductor memory using a DLL circuit having a phase comparison circuit for comparing phases of an internal clock and a delay clock and a variable delay addition circuit for adjusting delay amount according to a signal from the phase comparison circuit comprises a means for inputting a first signal latched to a logic “1” by start of one clock cycle of the internal clock to the variable delay addition circuit through a dummy delay at the start of burst and a means for detecting the duration time of the logic “1” of the first signal inputted by the variable delay addition circuit through the dummy delay until one clock cycle of the internal clock is completed and setting the initial value of delay amount of the variable delay addition circuit based on the duration time.