公开(公告)号：US10393798B2

公开(公告)日：2019-08-27

申请号：US15821403

申请日：2017-11-22

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Qianwen Chen ,  Bing Dang ,  John U. Knickerbocker ,  Minhua Lu ,  Robert J. Polastre ,  Bucknell C. Webb

IPC: G01R31/309 ,  G01R31/28 ,  H05K3/34 ,  H05K3/30 ,  H05K3/00 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K1/02 ,  H05K13/00

Abstract: An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

公开(公告)号：US10383572B2

公开(公告)日：2019-08-20

申请号：US15610885

申请日：2017-06-01

Applicant: International Business Machines Corporation

Inventor： John U. Knickerbocker ,  Shriya Kumar ,  Jae-Woong Nah

IPC: H05K3/40 ,  A61B5/00 ,  H01L21/768 ,  H01L23/498 ,  H01L23/532 ,  H01L21/48 ,  H05K1/03 ,  H01L23/00 ,  A61M5/00 ,  B23K3/06 ,  H01L23/66 ,  H01L23/13 ,  H01L23/15 ,  B23K101/36 ,  H01L23/538 ,  H01L23/14

Abstract: A method includes forming one or more vias in a substrate, forming a first photoresist layer on a top surface of the substrate and a second photoresist layer on a bottom surface of the substrate, patterning the first photoresist layer and the second photoresist layer to remove at least a first portion of the first photoresist layer and at least a second portion of the second photoresist layer, filling the one or more vias, the first portion and the second portion with solder material using injection molded soldering, and removing remaining portions of the first photoresist layer and the second photoresist layer.

公开(公告)号：US20190115243A1

公开(公告)日：2019-04-18

申请号：US16214422

申请日：2018-12-10

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Russell A. Budd ,  Bing Dang ,  Li-Wen Hung ,  John U. Knickerbocker ,  Cornelia Kang-I Tsang

IPC: H01L21/683 ,  B32B43/00 ,  H01L21/78 ,  B23K26/57 ,  H01L21/67

CPC classification number: H01L21/6835 ,  B23K26/57 ,  B32B43/006 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/78 ,  H01L23/544 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/94 ,  H01L2924/10253 ,  H01L2924/14 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1158 ,  Y10T156/1917

Abstract: A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release layer being absorptive of light having a first wavelength for being decomposed by the light; an adhesive layer overlying the first release layer, and a second release layer overlying the adhesive layer. The second release layer is absorptive of light having a second wavelength for being decomposed by the light having the second wavelength. The bonded structure further contains a handle substrate that overlies the second release layer, where the handle substrate is substantially transparent to the light having the first wavelength and the second wavelength. Also disclosed is a debonding method to process the bonded structure to remove and reclaim the adhesive layer for re-use. In another embodiment a multi-step method optically cuts and debonds a bonded structure.

公开(公告)号：US10258279B2

公开(公告)日：2019-04-16

申请号：US15612190

申请日：2017-06-02

Applicant: International Business Machines Corporation

Inventor： John U. Knickerbocker ,  Shriya Kumar ,  Jae-Woong Nah

IPC: H01L21/48 ,  A61B5/00 ,  H01L21/768 ,  H01L23/15 ,  H01L23/498 ,  H01L23/532 ,  H05K1/03 ,  H01L23/00 ,  A61M5/00 ,  B23K3/06 ,  H01L23/538 ,  H01L23/66 ,  H05K3/40 ,  B23K101/36

Abstract: A method includes forming one or more vias in a first layer, forming one or more vias in at least a second layer different than the first layer, aligning at least a first via in the first layer with at least a second via in the second layer, and bonding the first layer to the second layer by filling the first via and the second via with solder material using injection molded soldering.

公开(公告)号：US10250963B2

公开(公告)日：2019-04-02

申请号：US15857203

申请日：2017-12-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Li-Wen Hung ,  John U. Knickerbocker

IPC: H04R1/04 ,  A61B5/02 ,  A61B5/00 ,  A61B7/00 ,  A61B5/024 ,  H04R19/01

Abstract: A wearable monitoring system includes a microelectromechanical (MEMS) microphone to receive acoustic signal data through skin of a user. An integrated circuit chip is bonded to and electrically connected to the MEMS microphone. A portable power source is connected to at least the integrated circuit chip. A flexible substrate is configured to encapsulate and affix the MEMS microphone and the integrated circuit chip to the skin of the user.

公开(公告)号：US20190088481A1

公开(公告)日：2019-03-21

申请号：US15859608

申请日：2017-12-31

Applicant: International Business Machines Corporation

Inventor： Russell A. Budd ,  Qianwen Chen ,  Bing Dang ,  Jeffrey D. Gelorme ,  Li-wen Hung ,  John U. Knickerbocker

IPC: H01L21/20 ,  H01L21/683 ,  B24B7/22

CPC classification number: H01L21/2007 ,  B24B7/228 ,  H01L21/6835 ,  H01L23/49827 ,  H01L2221/68318 ,  H01L2221/6834

Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.

公开(公告)号：US10216008B2

公开(公告)日：2019-02-26

申请号：US14985627

申请日：2015-12-31

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Emily R. Kinser ,  John U. Knickerbocker ,  Roy R. Yu

IPC: G02C7/04 ,  B29D11/00 ,  G02C7/08

Abstract: Lenses and methods for adjusting the focus of a lens include dividing multiple light sensors in a lens into four quadrants. A position of the lens relative to occlusion along a top and bottom edge of the lens is determined based on lengths of bit sequences from light sensors in each of the four quadrants. An optimal focal length for the lens is determined based on the position of the lens. The focal length of the lens is adjusted to match the optimal focal length.

公开(公告)号：US10130302B2

公开(公告)日：2018-11-20

申请号：US15196558

申请日：2016-06-29

Applicant: International Business Machines Corporation

Inventor： John U. Knickerbocker ,  Shriya Kumar ,  Jae-Woong Nah

IPC: H01L21/768 ,  A61B5/00 ,  H01L23/15 ,  H01L23/498 ,  H01L23/532 ,  H01L21/48 ,  H05K1/03 ,  H01L23/00 ,  A61M5/00 ,  B23K3/06 ,  H01L23/538 ,  H01L23/66 ,  H05K3/40 ,  B23K101/36

Abstract: A method includes forming one or more vias in a substrate, forming at least one liner on at least one sidewall of at least one of the vias, and filling said at least one via with solder material using injection molded soldering. The at least one liner may comprise a solder adhesion layer, a barrier layer, or a combination of a barrier layer and a solder adhesion layer.

公开(公告)号：US20180323472A1

公开(公告)日：2018-11-08

申请号：US15585924

申请日：2017-05-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Qianwen Chen ,  Bing Dang ,  John U. Knickerbocker

IPC: H01M10/0585 ,  H01M10/0525 ,  A61B5/00

CPC classification number: H01M10/0585 ,  A61B5/681 ,  A61B5/6861 ,  A61B2560/0214 ,  H01M10/0525 ,  H01M2220/30

Abstract: A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.

公开(公告)号：US10108068B2

公开(公告)日：2018-10-23

申请号：US15845032

申请日：2017-12-18

Applicant: International Business Machines Corporation

Inventor： Michael S. Gordon ,  John U. Knickerbocker ,  Minhua Lu ,  Robert Polastre

IPC: G02F1/29 ,  G02F1/137 ,  G02B3/12 ,  G02F1/1343

Abstract: A lens structure includes a transparent cell containing a liquid crystal material. The cell is thicker in a center region thereof than at peripheral regions. The structure further includes transparent electrically conductive electrodes coupled with opposing top and bottom surfaces of the cell and configured to establish an electric field through the cell that is strongest at the peripheral regions where the cell is thinner relative to the center region so that a value of the index of refraction of the liquid crystal material changes across the cell from the center region towards the peripheral regions to change an effective focal length of the lens structure. In some embodiments the top surface of the cell has a first curvature C1 and the bottom surface of the cell has a second curvature C2 that differs from the first curvature.