公开(公告)号：US20050264290A1

公开(公告)日：2005-12-01

申请号：US10783630

申请日：2004-02-20

申请人： Tsunemoto Suzuki ,  Yasushi Kato ,  Nozomu Uetake

发明人： Tsunemoto Suzuki ,  Yasushi Kato ,  Nozomu Uetake

IPC分类号： A61B5/055 ,  G01R33/422 ,  G01V3/00

CPC分类号： G01R33/422

摘要： An eddy current induced in an RF shield by an X-axis gradient coil, a Y-axis gradient coil, and a Z-axis gradient coil respectively is homogeneously released to an earth ground simultaneously with induction. An RF shield is connected to a magnet via capacitors at four points whose angles are different from one another by 90°. The magnet is connected to the earth ground. An eddy current induced in the RF shield can be prevented from degrading MRI image quality.

摘要翻译： 通过X轴梯度线圈，Y轴梯度线圈和Z轴梯度线圈分别在RF屏蔽中感应的涡流分别与感应同时释放到大地。 RF屏蔽通过电容器连接到磁铁，四个角度彼此相差90°。 磁铁连接到地面。 可以防止在RF屏蔽中感应的涡流降低MRI图像质量。

公开(公告)号：US06943443B2

公开(公告)日：2005-09-13

申请号：US10221853

申请日：2002-01-15

申请人： Kazuhiro Nobori ,  Satoshi Ikeda ,  Yasushi Kato ,  Yasufumi Nakajima

发明人： Kazuhiro Nobori ,  Satoshi Ikeda ,  Yasushi Kato ,  Yasufumi Nakajima

IPC分类号： H01L25/07 ,  H01L21/60 ,  H01L23/49 ,  H01L23/492 ,  H01L23/495 ,  H01L23/64 ,  H01L25/16 ,  H01L25/18 ,  H01R13/648 ,  H05K1/14 ,  B23K31/02 ,  H01L23/04 ,  H01L23/10 ,  H01L23/34

CPC分类号： H01L23/492 ,  H01L23/49562 ,  H01L23/645 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L25/072 ,  H01L25/162 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15174 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/351 ,  H05K1/144 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/83205 ,  H01L2924/00012

摘要： Bumps are formed on electrodes of semiconductor elements, and moreover, the semiconductor elements with the bumps are electrically connected to metallic members having installation members, whereby wiring lines are eliminated. Stray inductance and conduction resistance resulting from wiring lines can be reduced. A conventional dented connector and a projecting connector are eliminated by connecting the installation members to a second circuit board, thereby enabling an electronic circuit device of a power control system to be made compact.

摘要翻译： 在半导体元件的电极上形成凸起，此外，具有凸块的半导体元件电连接到具有安装构件的金属构件，从而消除了布线。 可以降低由布线引起的杂散电感和导通电阻。 通过将安装构件连接到第二电路板来消除传统的凹入连接器和突出连接器，从而使电力控制系统的电子电路装置更紧凑。

公开(公告)号：US06777355B2

公开(公告)日：2004-08-17

申请号：US10718392

申请日：2003-11-20

申请人： Toshiro Kisakibaru ,  Isao Honbori ,  Yasushi Kato ,  Toshikazu Suzuki ,  Hirohisa Koriyama ,  Hayato Iwamoto ,  Hitoshi Abe

发明人： Toshiro Kisakibaru ,  Isao Honbori ,  Yasushi Kato ,  Toshikazu Suzuki ,  Hirohisa Koriyama ,  Hayato Iwamoto ,  Hitoshi Abe

IPC分类号： H01L2131

CPC分类号： H01L21/67017 ,  Y10S438/907

摘要： A manufacturing apparatus for a semiconductor device comprises: a clean room for installing a plurality of semiconductor manufacturing and processing apparatuses; an external air cleaning device connected to a supply port of the clean room for supplying a cleaned-up outside air into the clean room; a common air duct section installed in the clean room; a first air cleaning and ventilating means connected to said common air duct section for cleaning and ventilating a part of the cleaned-up outside air to the common air duct section; individual air duct section branched off from the common air duct section and connected to each of said semiconductor manufacturing and processing apparatuses; and a second air cleaning and ventilating means interposed between the individual air duct section and each of the semiconductor manufacturing and processing apparatuses for cleaning and ventilating the air to be supplied to each of the semiconductor manufacturing and processing apparatuses.

摘要翻译： 一种用于半导体器件的制造设备，包括：用于安装多个半导体制造和处理设备的洁净室; 连接到洁净室的供给口的外部空气净化装置，用于将净化后的外部空气供给到净化室内; 安装在洁净室内的通风道; 连接到所述公共空气管道部分的第一空气净化和通风装置，用于将一部分净化的外部空气清洁和通风到共用空气管道部分; 单独的空气管道部分从公共空气管道部分分支并连接到每个所述半导体制造和处理装置; 以及第二空气净化和通风装置，其插入在单独的空气管道部分和用于清洁和通风供给到每个半导体制造和处理设备的空气的每个半导体制造和处理设备之间。

公开(公告)号：US5931380A

公开(公告)日：1999-08-03

申请号：US898536

申请日：1997-07-22

申请人： Shinji Aoki ,  Toshio Morikawa ,  Hajime Ito ,  Yasushi Kato ,  Goro Uchida

发明人： Shinji Aoki ,  Toshio Morikawa ,  Hajime Ito ,  Yasushi Kato ,  Goro Uchida

IPC分类号： B60H1/08 ,  B60H1/03 ,  F24J3/00 ,  B60H1/02

CPC分类号： B60H1/038 ,  F24J3/003

摘要： A viscous heater for heating cooling water for cooling a water cooled engine is disposed in a cooling water circuit, and a front heater core is disposed in the cooling water circuit at a downstream side of the viscous heater with reference to a flow direction of the cooling water. Only when a heating operation is the maximum heating operation or the maximum heating operation is desired, a viscous clutch is turned on to transmit a driving force of the engine to the viscous heater. When the maximum heating operation is not desired, the viscous clutch is turned off so that the driving force of the engine is not transmitted to the viscous heater. Therefore, a load of the engine is reduced, and the cost for running the vehicle can be lowered.

摘要翻译： 用于加热用于冷却水冷发动机的冷却水的粘性加热器设置在冷却水回路中，并且前加热器芯相对于冷却的流动方向设置在粘性加热器的下游侧的冷却水回路中 水。 只有当加热操作是最大加热操作或需要最大加热操作时，才开启粘性离合器以将发动机的驱动力传递到粘性加热器。 当不需要最大加热操作时，粘性离合器被关闭，使得发动机的驱动力不会传递到粘性加热器。 因此，发动机的负荷降低，能够降低运行车辆的成本。

公开(公告)号：US5800787A

公开(公告)日：1998-09-01

申请号：US621313

申请日：1996-03-25

申请人： Yasushi Kato ,  Shigeharu Hashimoto ,  Yoshinobu Watanabe

发明人： Yasushi Kato ,  Shigeharu Hashimoto ,  Yoshinobu Watanabe

IPC分类号： B01J35/00 ,  B01J35/04 ,  F01N3/20 ,  F01N3/28 ,  H05B3/12 ,  H05B3/42 ,  F01N3/24

CPC分类号： B01J35/04 ,  B01J35/0033 ,  F01N3/202 ,  F01N3/281 ,  H05B3/12 ,  H05B3/42 ,  F01N2330/02 ,  F01N2330/06 ,  H05B2203/024 ,  Y02T10/26

摘要： An electrically heatable honeycomb body includes a plurality of passages which are each defined by partition walls made of an electroconductive material and which are substantially parallel to the direction of a gas flowing through the honeycomb body, and two ends which are the gas inlet and outlet sides of honeycomb body, wherein the heat generation of the honeycomb body by electrification is controlled by adjusting the flow of electricity therein and wherein those cells each constituted by a passage and partition walls, present in the vicinity of each current-concentrating portion are formed in such a structure that the stress caused by current concentration can be reduced. This honeycomb body can reduce the stress caused by current concentration and thereby can prevent the rupture of its cells.

摘要翻译： 电气可加热蜂窝体包括多个通道，每个通道由导电材料制成的分隔壁限定，并且基本上平行于流过蜂窝体的气体的方向，并且两端是气体入口和出口侧 的蜂窝体，其中通过调节其中的电流来控制蜂窝体通过带电的发热，并且其中存在于每个集流部附近的由通道和分隔壁构成的那些单元形成为 可以减少由电流集中引起的应力的结构。 该蜂窝体可以减少由电流集中引起的应力，从而可以防止其电池破裂。

公开(公告)号：US5639825A

公开(公告)日：1997-06-17

申请号：US317777

申请日：1994-10-04

申请人： Toshiro Nanbu ,  Hirotoshi Kawaguchi ,  Hisao Furukawa ,  Yasushi Kato

发明人： Toshiro Nanbu ,  Hirotoshi Kawaguchi ,  Hisao Furukawa ,  Yasushi Kato

IPC分类号： C08L43/04 ,  C08L101/06 ,  C08L101/10 ,  C09D133/06 ,  C09D201/10 ,  C08F230/08

CPC分类号： C08L101/10 ,  C08L101/06 ,  C08L43/04 ,  C09D133/066 ,  C09D201/10

摘要： When a thermosetting composition comprising(A) a resin having hydroxyl group,(B) a hydrolyzable silyl group-containing polymer,(C) a hydrolyzable silicon compound and(D) a curing catalyst is used, coating materials having no problem as to bad-smelling can be obtained and the coating films formed therefrom are improved in physical properties such as adhesion, solvent resistance and hardness.

摘要翻译： 当使用包含（A）具有羟基的树脂（B）可水解的含甲硅烷基的聚合物，（C）可水解的硅化合物和（D）固化催化剂）的热固性组合物时，没有问题的涂料 可以获得耐磨性，并且由其形成的涂膜改善了诸如粘合性，耐溶剂性和硬度的物理性能。

公开(公告)号：US5632772A

公开(公告)日：1997-05-27

申请号：US558028

申请日：1995-11-13

申请人： Rysler Alcime ,  Yasushi Kato ,  Leonard Pinchuk

发明人： Rysler Alcime ,  Yasushi Kato ,  Leonard Pinchuk

IPC分类号： A61F2/00 ,  A61F2/06 ,  A61F2/82 ,  A61F2/88 ,  A61F2/90

CPC分类号： A61F2/90 ,  A61F2/07 ,  A61F2/91 ,  A61F2/88 ,  A61F2/885 ,  A61F2/89 ,  A61F2002/065 ,  A61F2002/067 ,  A61F2002/072 ,  A61F2002/075 ,  A61F2002/30329 ,  A61F2002/826 ,  A61F2220/0008 ,  A61F2220/0025 ,  A61F2220/005 ,  A61F2220/0058 ,  A61F2220/0075 ,  A61F2230/001 ,  A61F2230/0078 ,  A61F2240/001 ,  A61F2250/0039

摘要： An endoluminal graft which is both expandable and supportive is provided in a form suitable for use in a branched body vessel location. The graft expands between a first diameter and a second, larger diameter. The support component is an expandable stent endoprosthesis. A liner is applied to the endoprosthesis in the form of a compliant wall material that is porous and biocompatible in order to allow normal cellular invasion upon implantation, without stenosis, when the expandable and supportive graft is at its second diameter. The supportive endoluminal graft is preferably provided as a plurality of components that are deployed separately at the branching body vessel location, one of which has a longitudinal indent defining leg portions within which the other components fit in a telescoping manner.

摘要翻译： 可膨胀和支持的腔内移植物以适合用于分支体血管位置的形式提供。 移植物在第一直径和第二直径较大的直径之间膨胀。 支撑部件是可扩张的支架内置假体。 将内衬施用于多孔且生物相容的柔性壁材料形式的内用假体，以便当可扩张和支持性移植物处于其第二直径时，在植入时允许正常的细胞侵入而没有狭窄。 支撑性内腔移植物优选地设置成分开展开在分支体血管位置处的多个部件，其中一个部件具有限定腿部的纵向凹口，其中其它部件以伸缩方式配合在其中。

公开(公告)号：US5459205A

公开(公告)日：1995-10-17

申请号：US132922

申请日：1993-10-07

申请人： Hisao Furukawa ,  Naotami Ando ,  Yasushi Kato

发明人： Hisao Furukawa ,  Naotami Ando ,  Yasushi Kato

IPC分类号： C08F230/08 ,  C08F283/00 ,  C08F299/08 ,  C08F20/00 ,  C07F7/04

CPC分类号： C08F230/08 ,  C08F283/004 ,  C08F299/08

摘要： A curable resin comprising units of at least one prepolymer selected from the group consisting of a prepolymer (C) and a prepolymer (F); the prepolymer (C) having the formula (I): ##STR1## and the prepolymer (F) having the formula (III): ##STR2## The curable resin has the excellent flexibility, solvent resistance and adhesion to organic materials and the properties thereof can be controlled accordingly to desire, in addition to the excellent curability at ordinary temperature, adhesion to inorganic materials and weatherability.

公开(公告)号：US5405575A

公开(公告)日：1995-04-11

申请号：US140005

申请日：1993-10-22

申请人： Yoshihiro Yazawa ,  Yasushi Kato ,  Fusao Togashi ,  Keiichi Yoshioka ,  Sadao Hasuno

发明人： Yoshihiro Yazawa ,  Yasushi Kato ,  Fusao Togashi ,  Keiichi Yoshioka ,  Sadao Hasuno

IPC分类号： C22C38/18

CPC分类号： C22C38/18

摘要： High Cr content, P added ferritic stainless steel containing, in % by weight, C: up to 0.02%, Si: up to 1.0%, Mn: up to 1.0%, S: up to 0.03%, Cr: from more than 20% to 40%, N: up to 0.015%, Al: up to 0.5%, and P: from more than 0.06% to 0.20%, the balance being Fe and incidental impurities, is improved in atmospheric corrosion resistance and rust prevention. The stainless steel may further contain at least one element selected from the following groups: (1) Mo: up to 4.0%; (2) one or more elements of Ti: up to 1.0%, Nb: up to 1.0%, Ta: up to 1.0%, V: up to 1.0%, W: up to 1.0%, Zr: up to 1.0%, and B: up to 0.01%; and (3) one or more elements of Cu: up to 1.0%, Ni: up to 5.0%, and Co: up to 1.0%.

摘要翻译： PCT No.PCT / JP93 / 00231 Sec。 371日期：1993年10月22日 102（e）日期1993年10月22日PCT提交1993年2月25日PCT公布。 公开号WO93 / 17143 日期：1993年9月2日。高Cr含量，P添加的铁素体不锈钢以重量％计含有C：高达0.02％，Si：高达1.0％，Mn：高达1.0％，S：高达0.03％ ，Cr：从20％到40％，N：高达0.015％，Al：高达0.5％，P：从大于0.06％到0.20％，余量为Fe和杂质，在大气中得到改善 耐腐蚀和防锈。 不锈钢还可含有至少一种选自以下组的元素：（1）Mo：至多4.0％; （2）Ti的一种或多种元素：至多1.0％，Nb：至多1.0％，Ta：至多1.0％，V：至多1.0％，W：至多1.0％，Zr：至多1.0％ B：高达0.01％; 和（3）一种或多种Cu元素：至多1.0％，Ni：至多5.0％，Co：至多1.0％。

公开(公告)号：US5136029A

公开(公告)日：1992-08-04

申请号：US422719

申请日：1989-10-17

申请人： Hisao Furukawa ,  Katsuhiko Isayama ,  Yasushi Kato

发明人： Hisao Furukawa ,  Katsuhiko Isayama ,  Yasushi Kato

IPC分类号： C07F7/18 ,  C08F2/38 ,  C08F4/04 ,  C08F8/42

CPC分类号： C08F8/42 ,  C07F7/182 ,  C08F4/04 ,  Y10S534/03

摘要： A hydrolyzable silyl group-containing azo compound is represented by the following general formula (I): ##STR1## wherein A represents a group originating from an azo compound having one or more active hydrogen groups;R.sup.1 represents a monovalent organic group;R.sup.2 represents a divalent organic group;X represents a hydrolyzable group;Y represents --O--, --S--, ##STR2## m is an integer of 1 to 3; and n is an integer of 1 or 2;and process for producing the same is disclosed. The hydrolyzable silyl group-containing azo compound is used to prepare a hydrolyzable silyl group-containing vinyl polymer produced by polymerizing vinyl monomer as a radical polymerization initiator.