Nitride crystal, nitride crystal substrate, epilayer-containing nitride crystal substrate, semiconductor device and method of manufacturing the same
    42.
    发明申请
    Nitride crystal, nitride crystal substrate, epilayer-containing nitride crystal substrate, semiconductor device and method of manufacturing the same 有权
    氮化物晶体,氮化物晶体衬底,含外延层的氮化物晶体衬底,半导体器件及其制造方法

    公开(公告)号:US20080272392A1

    公开(公告)日:2008-11-06

    申请号:US12216236

    申请日:2008-07-01

    IPC分类号: H01L33/00 C01B21/00

    摘要: A nitride crystal is characterized in that, in connection with plane spacing of arbitrary specific parallel crystal lattice planes of the nitride crystal obtained from X-ray diffraction measurement performed with variation of X-ray penetration depth from a surface of the crystal while X-ray diffraction conditions of the specific parallel crystal lattice planes are satisfied, a uniform distortion at a surface layer of the crystal represented by a value of |d1−d2|/d2 obtained from the plane spacing d1 at the X-ray penetration depth of 0.3 μm and the plane spacing d2 at the X-ray penetration depth of 5 μm is equal to or lower than 2.1×10−3. The above configuration provides the nitride crystal having a crystal surface layer that is evaluated directly and reliably without breaking the crystal so that it can be used in a preferred fashion as a substrate for a semiconductor device as well as the nitride crystal substrate, an epilayer-containing nitride crystal substrate, a semiconductor device and a method of manufacturing the same.

    摘要翻译: 氮化物晶体的特征在于,结合由X射线衍射测量得到的氮化物晶体的任意特定平行晶格面的平面间隔,与X射线的X射线 满足特定平行晶格面的衍射条件,在由d 1的值表示的晶体的表面层上的均匀的畸变-d 2/2 在0.3μm的X射线穿透深度处从平面间隔d 1> 1获得的平面间隔d <2>和在X射线处的平面间隔d 2 <2> 5μm的穿透深度等于或低于2.1×10 -3 -3。 上述结构提供了具有晶体表面层的氮化物晶体,其直接可靠地评估而不破坏晶体,使得其可以以优选的方式用作半导体器件的衬底以及氮化物晶体衬底, 含氮化物晶体基板,半导体装置及其制造方法。

    Method of measuring warpage of rear surface of substrate
    43.
    发明申请
    Method of measuring warpage of rear surface of substrate 失效
    测量基板后表面翘曲的方法

    公开(公告)号:US20070192058A1

    公开(公告)日:2007-08-16

    申请号:US11706331

    申请日:2007-02-15

    IPC分类号: G06F15/00

    CPC分类号: G01B11/306

    摘要: A method of measuring warpage of a rear surface of a substrate includes a substrate detection step, a best fit plane calculation step, and a warpage calculation step. Further, the method of measuring warpage of a rear surface of a substrate can further includes after the substrate detection step and before the best fit plane calculation step: a noise removal step and an outer peripheral portion removal step; the outer peripheral portion removal step and a smoothing step; or the noise removal step, the outer peripheral portion removal step, and the smoothing step. Thereby, a method of measuring warpage of a rear surface with a high surface roughness of a substrate can be provided.

    摘要翻译: 测量基板的后表面的翘曲的方法包括基板检测步骤,最佳拟合平面计算步骤和翘曲计算步骤。 此外,测量基板后表面的翘曲的方法还可以包括在基板检测步骤之后和最佳拟合平面计算步骤之前:噪声去除步骤和外周部分去除步骤; 外周部除去工序和平滑工序; 或噪声去除步骤,外周部分去除步骤和平滑步骤。 因此,可以提供测量具有高基材表面粗糙度的背面的翘曲的方法。

    Combined RF-DC magnetron sputtering method
    46.
    发明授权
    Combined RF-DC magnetron sputtering method 失效
    组合RF-DC磁控溅射法

    公开(公告)号:US06365009B1

    公开(公告)日:2002-04-02

    申请号:US09071446

    申请日:1998-05-01

    申请人: Keiji Ishibashi

    发明人: Keiji Ishibashi

    IPC分类号: C23C1435

    CPC分类号: C23C14/35

    摘要: A combined RF-DC magnetron sputtering method stops the production of tracking arcs and promotes the consistent manufacture of thin films during the manufacture of thin films by such RF-DC magnetron sputtering. Magnets 121, 122 are placed behind the target 111. RF and DC power are simultaneously supplied to the target to produce a plasma, and sputtering is used to manufacture a thin film on a substrate 106 facing the target. The supply of RF and DC power to the target is simultaneously and periodically stopped. The time that the power is supplied is shorter than the time needed to produce tracking arcs. The RF and DC power is both supplied and stopped simultaneously, and RF and DC power is intermittently supplied to the target.

    摘要翻译: 组合的RF-DC磁控溅射法通过这种RF-DC磁控溅射在薄膜制造过程中停止生产跟踪电弧并促进薄膜的一致制造。 将磁体121,122放置在目标111的后面。将RF和DC功率同时提供给靶以产生等离子体,并且使用溅射来在面向靶的衬底106上制造薄膜。 同时定期停止向目标提供射频和直流电源。 供电时间短于产生跟踪弧所需的时间。 RF和DC电源同时供电和停止,RF和DC电源间歇地提供给目标。