公开(公告)号：US06452253B1

公开(公告)日：2002-09-17

申请号：US09651997

申请日：2000-08-31

Applicant: Mark Tuttle

Inventor： Mark Tuttle

IPC: H05K100

CPC classification number: H01L23/522 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/29 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: Disclosed are a method and apparatus which provide a magnetic shield for integrated circuits containing electromagnetic circuit elements. The shield is formed of a magnetically permeable material, which may be a non-conductive magnetic oxide, and either partially contacts or completely surrounds the integrated circuit.

Abstract translation: 公开了一种为包含电磁电路元件的集成电路提供磁屏蔽的方法和装置。 屏蔽由导磁材料形成，其可以是非导电性磁性氧化物，并且部分地接触或完全围绕集成电路。

公开(公告)号：US20100059898A1

公开(公告)日：2010-03-11

申请号：US12209052

申请日：2008-09-11

Applicant: Brent Keeth ,  Mark Hiatt ,  Terry R. Lee ,  Mark Tuttle ,  Rahul Advani ,  John F. Schreck

Inventor： Brent Keeth ,  Mark Hiatt ,  Terry R. Lee ,  Mark Tuttle ,  Rahul Advani ,  John F. Schreck

IPC: H01L23/52 ,  H01L21/00

CPC classification number: H01L25/0657 ,  H01L23/50 ,  H01L23/5385 ,  H01L23/66 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/06181 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/01004 ,  H01L2924/15311 ,  Y10T29/49165

Abstract: Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

Abstract translation: 一些实施例包括装置，系统和方法，其具有底座，第一管芯，第二管芯，第二管芯和第二管芯，第二管芯和第二管芯，第二管芯和第二管芯， 被配置为在所述基座与所述第一和第二骰子中的至少一个之间传送信号。

公开(公告)号：US20080007462A1

公开(公告)日：2008-01-10

申请号：US11855022

申请日：2007-09-13

Applicant: Mark Tuttle

Inventor： Mark Tuttle

IPC: H01R43/00

CPC classification number: G06K19/0716 ,  G06K19/0723 ,  G06K19/07345 ,  G06K19/07749 ,  H01H2231/05 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q21/28 ,  Y10T29/49004 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117

Abstract: A wireless identification device including a housing; circuitry in the housing configured to provide a signal to identify the device in response to an interrogation signal; and a selectively actuated switch supported by the housing and controlling whether the circuitry identifies the device. A method of manufacturing a wireless identification device, the method comprising configuring circuitry to provide a signal to identify the device in response to an interrogation signal; coupling the circuitry to a push-on/push-off switch supported by the housing and controlling whether the circuitry provides the signal to identify the device; and encasing the circuitry in a housing such that the switch is actuable from outside the housing by touching a portion of the housing.

公开(公告)号：US20070290862A1

公开(公告)日：2007-12-20

申请号：US11846905

申请日：2007-08-29

Applicant: Mark Tuttle

Inventor： Mark Tuttle

IPC: G08B13/14

CPC classification number: G06K7/0008 ,  G06K19/07749 ,  G06K19/07771 ,  G06K19/07786

Abstract: The present invention provides electronic communication devices, methods of forming electrical communication devices, and communications methods. An electronic communication device adapted to receive electronic signals includes: a housing comprising a substrate and an encapsulant; an integrated circuit provided within the housing and comprising transponder circuitry operable to communicate an identification signal responsive to receiving a polling signal; an antenna provided within the housing and being coupled with the transponder circuitry; and a ground plane provided within the housing and being spaced from the antenna and configured to shield some of the electronic signals from the antenna and reflect others of the electronic signals towards the antenna. A method of forming an electronic signal communication device includes providing a substrate having a support surface; providing a conductive layer adjacent at least a portion of the support surface; providing a dielectric layer over the conductive layer; providing an antenna over the dielectric layer; coupling an integrated circuit with the antenna; and encapsulating the antenna, the dielectric layer, and the integrated circuit using a flowable encapsulant.

Abstract translation: 本发明提供电子通信设备，形成电通信设备的方法和通信方法。 适于接收电子信号的电子通信设备包括：壳体，包括衬底和密封剂; 设置在所述外壳内的集成电路，包括响应于接收到轮询信号而传送识别信号的应答器电路; 设置在壳体内并与应答器电路耦合的天线; 以及设置在壳体内并与天线间隔开并被配置为将一些电子信号与天线隔离并将其它电子信号反射向天线的接地平面。 一种形成电子信号通信装置的方法包括提供具有支撑表面的基板; 提供邻近所述支撑表面的至少一部分的导电层; 在所述导电层上提供介电层; 在电介质层上提供天线; 将集成电路与天线耦合; 并使用可流动的密封剂封装天线，电介质层和集成电路。

公开(公告)号：US20070045632A1

公开(公告)日：2007-03-01

申请号：US11217877

申请日：2005-09-01

Applicant: Steven Oliver ,  Lu Velicky ,  William Hiatt ,  David Hembree ,  Mark Tuttle ,  Sidney Rigg ,  James Wark ,  Warren Farnworth ,  Kyle Kirby

Inventor： Steven Oliver ,  Lu Velicky ,  William Hiatt ,  David Hembree ,  Mark Tuttle ,  Sidney Rigg ,  James Wark ,  Warren Farnworth ,  Kyle Kirby

IPC: H01L33/00

CPC classification number: H01L21/00 ,  H01L21/76898 ,  H01L23/552 ,  H01L27/14609 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Microelectronic imaging units and methods for manufacturing a plurality of imaging units at the wafer level are disclosed herein. In one embodiment, a method for manufacturing a plurality of imaging units includes providing an imager workpiece having a plurality of imaging dies including integrated circuits, external contacts electrically coupled to the integrated circuits, and image sensors operably coupled to the integrated circuits. The individual image sensors include at least one dark current pixel at a perimeter portion of the image sensor. The method includes depositing a cover layer onto the workpiece and over the image sensors. The method further includes patterning and selectively developing the cover layer to form discrete volumes of cover layer material over corresponding image sensors. The discrete volumes of cover layer material have sidewalls aligned with an inboard edge of the individual dark current pixels such that the dark current pixels are not covered by the discrete volumes.

Abstract translation: 本文公开了用于在晶片级制造多个成像单元的微电子成像单元和方法。 在一个实施例中，制造多个成像单元的方法包括提供具有多个成像管芯的成像工件，所述成像管芯包括集成电路，电耦合到集成电路的外部触点以及可操作地耦合到集成电路的图像传感器。 各个图像传感器包括在图像传感器的周边部分处的至少一个暗电流像素。 该方法包括将覆盖层沉积在工件上并在图像传感器上方。 该方法还包括图案化和选择性地显影覆盖层以在对应的图像传感器上形成分离体积的覆盖层材料。 覆盖层材料的离散体积具有与各个暗电流像素的内侧边缘对准的侧壁，使得暗电流像素不被离散体积覆盖。

公开(公告)号：US20060136377A1

公开(公告)日：2006-06-22

申请号：US11014600

申请日：2004-12-16

Applicant: Boaz Patt-Shamir ,  Mark Tuttle ,  Eytan Adar

Inventor： Boaz Patt-Shamir ,  Mark Tuttle ,  Eytan Adar

IPC: G06F17/30

CPC classification number: G06F17/30687 ,  G06F17/30887

Abstract: Computer method and apparatus for collaborative web search operate in an intranet with non-existent or defective link structure. A search engine produces an initial search result list in response to a user query. A list optimizer reranks pages on the initial list based on implicit user recommendation or endorsement of pages. A last click heuristic defines user endorsement of a page. To form the final result list, the list optimizer scores each page according to reranking, a textual match (or information retrieval score) of the page with the query and an adjustment value.

Abstract translation: 用于协同网页搜索的计算机方法和装置在具有不存在或有缺陷的链接结构的内联网中操作。 搜索引擎响应于用户查询产生初始搜索结果列表。 列表优化器基于隐含的用户推荐或页面的认可来重新排列初始列表上的页面。 最后点击启发式定义了用户对页面的认可。 为了形成最终结果列表，列表优化器根据重新排序对页面进行分数，具有查询的页面的文本匹配（或信息检索分数）和调整值。

公开(公告)号：US20050051818A1

公开(公告)日：2005-03-10

申请号：US10655666

申请日：2003-09-05

Applicant: Mark Tuttle

Inventor： Mark Tuttle

IPC: G11B5/147 ,  G11C11/00 ,  G11C11/15 ,  H01L31/113 ,  H01L43/12

CPC classification number: H01L43/12

Abstract: An integrated circuit structure is formed using a damascene process that involves forming a trench or cavity for the structure in a temporary layer of material. A conductive material, such as copper, can then be deposited on the temporary layer to overfill the trench or cavity, and the excess conductive material can be removed by polishing down to the surface of the temporary layer. The integrated circuit structure can then be exposed by removing the temporary layer. One example of an integrated circuit structure that can be formed using this method is an upper electrode in an MRAM array. By using the process to form an upper electrode in an MRAM array, the process of forming a magnetic keeper around the upper electrode is advantageously simplified.

公开(公告)号：US06429044B1

公开(公告)日：2002-08-06

申请号：US09939652

申请日：2001-08-28

Applicant: Mark Tuttle

Inventor： Mark Tuttle

IPC: H01L2144

CPC classification number: H01L23/522 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/29 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: Disclosed are a method and apparatus which provide a magnetic shield for integrated circuits containing electromagnetic circuit elements. The shield is formed of a magnetically permeable material, which may be a non-conductive magnetic oxide, and either partially contacts or completely surrounds the integrated circuit.

公开(公告)号：US20080032494A1

公开(公告)日：2008-02-07

申请号：US11872607

申请日：2007-10-15

Applicant: Sanh Tang ,  Mark Tuttle ,  Keith Cook

Inventor： Sanh Tang ,  Mark Tuttle ,  Keith Cook

IPC: H01L21/441

CPC classification number: H01L24/11 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/04073 ,  H01L2224/05018 ,  H01L2224/05026 ,  H01L2224/05082 ,  H01L2224/05181 ,  H01L2224/05187 ,  H01L2224/05558 ,  H01L2224/05559 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0496 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/04941 ,  H01L2224/05552

Abstract: Microelectronic workpieces that have bump sites over bond-pads and methods of fabricating such bump sites. One embodiment of such a workpiece, for example, includes a substrate having a plurality of microelectronic dies comprising integrated circuitry and bond-pads, such as copper bond-pads, electrically coupled to the integrated circuitry. The workpiece further includes (a) a dielectric structure having a plurality of openings with sidewalls projecting from corresponding bond-pads, and (b) a plurality of caps over corresponding bond-pads. The individual caps can include a discrete portion of a barrier layer attached to the bond-pads and the sidewalls of the openings, and a discrete portion of a cap layer on the barrier layer. The caps are electrically isolated from each other and self-aligned with corresponding bond-pads without forming a mask layer over the cap layer.

Abstract translation: 在焊盘上具有凸起部位的微电子工件以及制造这种凹凸点的方法。 例如，这种工件的一个实施例包括具有多个微电子管芯的衬底，该多个微电子管芯包括集成电路和电耦合到集成电路的接合焊盘，例如铜接合焊盘。 工件还包括（a）具有多个开口的电介质结构，其中侧壁从相应的接合焊盘突出，以及（b）在相应的接合焊盘上的多个盖。 各个盖可以包括附着到接合焊盘和开口的侧壁的阻挡层的分立部分，以及阻挡层上的覆盖层的离散部分。 盖子彼此电隔离并且与相应的接合焊盘自对准，而不在盖层上形成掩模层。

公开(公告)号：US20080001715A1

公开(公告)日：2008-01-03

申请号：US11855044

申请日：2007-09-13

Applicant: Mark Tuttle

Inventor： Mark Tuttle

IPC: H04Q1/00

CPC classification number: G06K19/0716 ,  G06K19/0723 ,  G06K19/07345 ,  G06K19/07749 ,  H01H2231/05 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q21/28 ,  Y10T29/49004 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117

Abstract: A wireless identification device including a housing; circuitry in the housing configured to provide a signal to identify the device in response to an interrogation signal; and a selectively actuated switch supported by the housing and controlling whether the circuitry identifies the device. A method of manufacturing a wireless identification device, the method comprising configuring circuitry to provide a signal to identify the device in response to an interrogation signal; coupling the circuitry to a push-on/push-off switch supported by the housing and controlling whether the circuitry provides the signal to identify the device; and encasing the circuitry in a housing such that the switch is actuable from outside the housing by touching a portion of the housing.