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公开(公告)号:US06501173B2
公开(公告)日:2002-12-31
申请号:US09797719
申请日:2001-03-05
IPC分类号: H01L2334
CPC分类号: H01L24/49 , H01L23/49575 , H01L23/50 , H01L24/48 , H01L24/73 , H01L25/18 , H01L2224/05554 , H01L2224/16 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2225/06562 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01039 , H01L2924/01056 , H01L2924/01058 , H01L2924/07802 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19106 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要: A chip mounting method is proposed which considers facilitating the testing of semiconductor chips when a plurality of semiconductor chips are sealed in a single resin sealing body. This method also considers its application to a variety of MCPs and system LSIs. In a single package, one signal output terminal of the first semiconductor chip and a first external terminal of the semiconductor device are internally connected independently. One signal input terminal of the second semiconductor chip and a second external terminal of the semiconductor device are internally connected independently. The first and second external terminals of the semiconductor device are connected outside the semiconductor device to complete the connection between the signal output terminal and the signal input terminal.
摘要翻译: 提出了当多个半导体芯片被密封在单个树脂密封体中时考虑促进半导体芯片的测试的芯片安装方法。 该方法还考虑其应用于各种MCP和系统LSI。 在单个封装中,第一半导体芯片的一个信号输出端子和半导体器件的第一外部端子独立地内部连接。 第二半导体芯片的一个信号输入端子和半导体器件的第二外部端子独立地内部连接。 半导体器件的第一和第二外部端子连接在半导体器件外部,以完成信号输出端子与信号输入端子之间的连接。
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公开(公告)号:US06433421B1
公开(公告)日:2002-08-13
申请号:US09826965
申请日:2001-04-06
IPC分类号: H01L2334
摘要: A semiconductor device comprising: a resin sealing body, plural semiconductor chips situated inside the resin sealing body and formed of rectangular-shaped plane surfaces, having a first main surface and second main surface facing each other, and having electrodes disposed on the first side of a first side and a second side of the first main surface, the first side and second side facing each other, and leads having inner parts situated inside the resin sealing body and outer parts situated outside the resin sealing body, the inner parts being electrically connected to the electrodes of the plural semiconductor chips via bonding wires, wherein: the first main surfaces are aligned in the same direction with their respective first sides situated on the same side, and the plural semiconductor chips are laminated in positions offset with respect to one another such that the electrodes of one of the mutually opposite semiconductor chips are situated further outside than the first sides of the other semiconductor chips.
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公开(公告)号:US06431456B1
公开(公告)日:2002-08-13
申请号:US09810509
申请日:2001-03-19
IPC分类号: G06K1906
摘要: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.
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公开(公告)号:US06252299B1
公开(公告)日:2001-06-26
申请号:US09161725
申请日:1998-09-29
申请人: Masachika Masuda , Tamaki Wada , Michiaki Sugiyama , Hirotaka Nishizawa , Toshio Sugano , Yasushi Takahashi , Masayasu Kawamura
发明人: Masachika Masuda , Tamaki Wada , Michiaki Sugiyama , Hirotaka Nishizawa , Toshio Sugano , Yasushi Takahashi , Masayasu Kawamura
IPC分类号: H01L2328
CPC分类号: H01L24/06 , H01L23/4951 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/32145 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/4826 , H01L2224/48599 , H01L2224/49113 , H01L2224/49171 , H01L2224/73215 , H01L2224/85201 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01039 , H01L2924/01055 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/30105 , H01L2924/3011 , Y10T29/49121 , H01L2924/00 , H01L2924/00012 , H01L2224/85399
摘要: A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.
摘要翻译: 一种半导体器件,包括树脂模具,位于树脂模具内部的两个半导体芯片,具有形成在前表面上的前后表面和外部端子以及从树脂模具的内部延伸到外部的引线,其中每个所述引线 至少在树脂模具中分支成两个分支引线,一个分支引线固定到一个半导体芯片的表面,并通过导线与表面上的外部端子电连接,另一个分支引线被固定到 另一个半导体芯片的表面,并通过导线与表面上的外部端子电连接,并且两个半导体芯片彼此堆叠,并且它们的背面彼此相对。
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公开(公告)号:US07971793B2
公开(公告)日:2011-07-05
申请号:US11945745
申请日:2007-11-27
申请人: Hirotaka Nishizawa , Akira Higuchi , Kenji Osawa , Tamaki Wada , Michiaki Sugiyama , Junichiro Osako
发明人: Hirotaka Nishizawa , Akira Higuchi , Kenji Osawa , Tamaki Wada , Michiaki Sugiyama , Junichiro Osako
IPC分类号: G06K19/06
CPC分类号: G06K19/077 , G06K19/07732 , H01L23/5388 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0652 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/49171 , H01L2224/4943 , H01L2224/73265 , H01L2225/06562 , H01L2924/00014 , H01L2924/01046 , H01L2924/01055 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: The present invention provides a memory card equipped with an interface controller connected to external connecting terminals, a memory connected to the interface controller, and a security controller connected to the interface controller. A second external connecting terminal capable of supplying an operating power supply to the security controller is provided aside from a first external connecting terminal which supplies an operating power supply to the interface controller and the memory. An interface unit of the interface controller connected to the security controller receives the operating power supply from the second external connecting terminal and thereby enables a stop of the supply of the operating power supply from the first external connecting terminal. Even if the supply of the operating power supply to the interface controller is cut off, the output of the interface unit is not brought to an indefinite state.
摘要翻译: 本发明提供了一种存储卡,其配备有连接到外部连接终端的接口控制器,连接到接口控制器的存储器和连接到接口控制器的安全控制器。 除了向接口控制器和存储器提供工作电源的第一外部连接端子之外,还提供了能够向安全控制器提供工作电源的第二外部连接端子。 连接到安全控制器的接口控制器的接口单元接收来自第二外部连接端子的工作电源,从而能够停止从第一外部连接端子供给工作电源。 即使向接口控制器提供工作电源被切断,接口单元的输出也不会变为无限状态。
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公开(公告)号:US07768110B2
公开(公告)日:2010-08-03
申请号:US11865721
申请日:2007-10-01
IPC分类号: G06K19/067 , H01L23/48
CPC分类号: G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.
摘要翻译: 一种IC卡,其能够增强防止静电损伤,而不会导致半导体集成电路芯片的成本上升。 半导体集成电路芯片(2)安装在卡片基板(1)上,多个连接端子(3)露出。 连接端子连接到半导体集成电路芯片的预定的外部端子(4),连接到外部端子的第一过电压保护元件(7,8,9)集成在半导体集成电路芯片中,第二过电压保护元件 因为连接到连接端子的表面安装型变阻器(11)安装在卡片基板上。 变阻器是具有比第一过电压保护元件大的电流容许能力的可变电阻器元件。 通过考虑包含在半导体集成电路芯片中的第一过电压保护元件的特性和能力之间的关系,已经选择了变阻器,并且具有防止静电损坏的效果。
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公开(公告)号:US07547961B2
公开(公告)日:2009-06-16
申请号:US11619135
申请日:2007-01-02
CPC分类号: G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.
摘要翻译: 一种IC卡,其能够增强防止静电损伤,而不会导致半导体集成电路芯片的成本上升。 半导体集成电路芯片(2)安装在卡片基板(1)上,多个连接端子(3)露出。 连接端子连接到半导体集成电路芯片的预定外部端子(4),连接到外部端子的第一过电压保护元件(7,8,9)集成在半导体集成电路芯片中,第二过电压保护元件 因为连接到连接端子的表面安装型变阻器(11)安装在卡片基板上。 变阻器是具有比第一过电压保护元件大的电流容许能力的可变电阻器元件。 通过考虑包含在半导体集成电路芯片中的第一过电压保护元件的特性和能力之间的关系,已经选择了变阻器,并且具有防止静电损坏的效果。
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公开(公告)号:US20090065593A1
公开(公告)日:2009-03-12
申请号:US12261993
申请日:2008-10-30
CPC分类号: G06K19/07732 , G06K19/0719 , G06K19/07733 , G06K19/07741 , G06K19/07743 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H05K1/0268 , H05K1/117 , H01L2924/00014 , H01L2924/00
摘要: An IC card and card adapters are designed so that the IC card of a specific standard (e.g., MMC standard) is compatible with IC cards and terminals of other standards (e.g., MS card standard and USB terminal standard). In the IC card (MMC), a controller IC, which is connected to a flash memory, includes a voltage pull-down detector, a mode controller, a USB-mode interface controller, a MS-mode interface controller, and an MMC/SD-mode interface controller. The card adapters suffice to have component parts which are easy in formation and low in cost such as wiring lines and resistors. The voltage pull-down detector of the IC card detects the voltage pull-down caused by the resistors, and the mode controller selects the USB-mode interface controller, MS-mode interface controller or MMC/SD-mode interface controller so that the IC card becomes compatible with the corresponding IC card standard.
摘要翻译: IC卡和卡适配器被设计成使得特定标准(例如,MMC标准)的IC卡与IC卡和其他标准的终端(例如,MS卡标准和USB终端标准)兼容。 在IC卡(MMC)中,连接到闪速存储器的控制器IC包括电压下拉检测器,模式控制器,USB模式接口控制器,MS模式接口控制器和MMC / SD模式接口控制器。 卡适配器足以具有易于形成的部件,成本低廉,例如布线和电阻器。 IC卡的电压下拉检测器检测由电阻引起的电压下拉,模式控制器选择USB模式接口控制器,MS模式接口控制器或MMC / SD模式接口控制器,使IC 卡与相应的IC卡标准兼容。
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公开(公告)号:US20080225498A1
公开(公告)日:2008-09-18
申请号:US12125921
申请日:2008-05-23
申请人: JUNICHIRO OSAKO , Hirotaka Nishizawa , Kenji Osawa , Hideo Koike
发明人: JUNICHIRO OSAKO , Hirotaka Nishizawa , Kenji Osawa , Hideo Koike
IPC分类号: H05K1/14
CPC分类号: G06K19/07739 , G06K19/07743 , H01L2224/45144 , H01L2224/48091 , H01L2225/06562 , H01R12/7005 , H01R12/714 , H01R27/00 , H01R31/06 , H01R2201/20 , H05K1/117 , H05K1/142 , H05K3/326 , H01L2924/00014 , H01L2924/00
摘要: An adapter for a memory card is disclosed which performs a change of size so that a memory card smaller in planar size but almost equal in thickness as compared with a multi-media card can be used as a multi-media card. A protuberant portion is formed behind plural external terminals formed on a back side of the adapter, whereby, while the thickness of a front side of the adapter is maintained at a standardized thickness of the multi-media card, a rear side of the adapter is made thicker than the front side and internal terminals for contact with external terminals of the memory card are disposed in the interior of the thick portion of the adapter. The versatility of an extremely small-sized memory card can be improved.
摘要翻译: 公开了一种用于存储卡的适配器,其执行尺寸的改变,使得与多媒体卡相比,平面尺寸较小但几乎相等的存储卡可用作多媒体卡。 在形成在适配器的背面的多个外部端子之后形成突出部分,由此,当适配器的前侧的厚度保持在多媒体卡的标准厚度时,适配器的后侧 制成厚于前侧,并且用于与存储卡的外部端子接触的内部端子设置在适配器的厚部的内部。 可以提高极小型存储卡的多功能性。
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公开(公告)号:US07402047B2
公开(公告)日:2008-07-22
申请号:US11449815
申请日:2006-06-09
IPC分类号: H01R12/00
CPC分类号: G06K19/07732 , G06K19/07 , G06K19/0719 , G06K19/072 , G06K19/07733 , G06K19/07743 , H01L2224/05553 , H01L2224/48137 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/14
摘要: A multifunction IC card (MFC) has compatibility with a multimedia card, an SD card, etc. in that connector terminals (#1 through #13) are disposed on a card substrate (1) in two rows in a zigzag fashion, and realizes multifunction facilities in that a memory card unit (3) and an SIM (Subscriber Identity Module) card unit (4) are respectively exclusively connected and mounted to predetermined terminals of the connector terminals (#1 through #13). The memory card unit (3) and the SIM card unit (4) are respectively separately provided with areas for storing secrete codes for security. Thus, one IC card is capable of implementing multifunction facilities different in security level. Owing to the adoption of a plural-column layout corresponding to a form typified by the zigzag fashion in an array of the connector terminals, a relatively simple structure can be adopted in a card slot, wherein the amounts of protrusion of slot terminals in a card slot are alternately changed in association with a zigzag section, and the slot terminals are disposed in a row in parallel as a whole.
摘要翻译: 多功能IC卡(MFC)与多媒体卡,SD卡等的兼容性在该连接器端子(#1〜#13)中以锯齿形的方式配置在卡片基板(1)上两行, 存储卡单元(3)和SIM(用户识别模块)卡单元(4)分别专门连接并安装到连接器端子(#1至#13)的预定端子上的多功能设施。 存储卡单元(3)和SIM卡单元(4)分别设置有用于存储安全密码的区域。 因此,一个IC卡能够实现安全级别不同的多功能设备。 由于在连接器端子的阵列中采用对应于由之字形形式表示的形式的多列布局,所以在卡槽中可以采用相对简单的结构,其中卡终端在卡中的突出量 插槽与锯齿形部分交替地改变,并且插槽端子整体上平行布置成一排。
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