公开(公告)号：US07804176B2

公开(公告)日：2010-09-28

申请号：US11626286

申请日：2007-01-23

申请人： Kazuko Hanawa ,  Takashi Kikuchi ,  Koichi Kanemoto ,  Michiaki Sugiyama ,  Chikako Imura

发明人： Kazuko Hanawa ,  Takashi Kikuchi ,  Koichi Kanemoto ,  Michiaki Sugiyama ,  Chikako Imura

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L25/18 ,  G11C5/06 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06586 ,  H01L2924/01014 ,  H01L2924/01037 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： This invention is to provide a nonvolatile memory device that enhances a size reduction and mass productivity while ensuring reliability and signal transmission performance. A nonvolatile memory chip having a first side formed with no pads and a second side formed with pads is mounted on a mounting substrate. A control chip for controlling the nonvolatile memory chip is mounted on the nonvolatile memory chip. The control chip has a first pad row corresponding to the pads of the nonvolatile memory chip. The first pad row is mounted adjacent to the first side of the nonvolatile memory chip. The first pad row of the control chip and a first electrode row formed on the mounting substrate are connected via a first wire group. The pads of the nonvolatile memory chip and a second electrode row formed on the mounting substrate are connected via a second wire group. The first electrode row and the second electrode row are connected through wirings formed in the mounting substrate.

摘要翻译： 本发明是提供一种在确保可靠性和信号传输性能的同时提高尺寸减小和批量生产率的非易失性存储装置。 具有形成有焊盘的第一侧和形成有焊盘的第二侧的非易失性存储器芯片安装在安装基板上。 用于控制非易失存储器芯片的控制芯片安装在非易失性存储器芯片上。 控制芯片具有对应于非易失性存储器芯片的焊盘的第一焊盘行。 第一焊盘排安装在非易失性存储芯片的第一侧附近。 控制芯片的第一焊盘排和形成在安装基板上的第一电极列经由第一焊丝组连接。 形成在安装基板上的非易失性存储芯片的焊盘和第二电极列经由第二引线组连接。 第一电极列和第二电极列通过形成在安装基板中的布线连接。

公开(公告)号：US07639546B2

公开(公告)日：2009-12-29

申请号：US12037414

申请日：2008-02-26

申请人： Takashi Kikuchi ,  Kenji Noda

发明人： Takashi Kikuchi ,  Kenji Noda

IPC分类号： G11C7/00

CPC分类号： G11C7/1045 ,  G11C7/1006 ,  G11C7/12 ,  G11C14/00 ,  G11C14/0063

摘要： A nonvolatile semiconductor memory device includes a latch circuit having two nodes, a nonvolatile memory cell including two MIS transistors, a bit swapping unit configured to provide straight connections between the two nodes and the two MIS transistors during a first operation mode and to provide cross connections between the two nodes and the two MIS transistors during a second operation mode, and a control circuit configured to cause, in one of the first and second operation modes, the nonvolatile memory cell to store the data latched in the latch circuit as an irreversible change of transistor characteristics occurring in a selected one of the two MIS transistors, and further configured to cause, in another one of the first and second operation modes, the latch circuit to detect the data stored in the nonvolatile memory cell.

摘要翻译： 非易失性半导体存储器件包括具有两个节点的锁存电路，包括两个MIS晶体管的非易失性存储器单元，配置成在第一操作模式期间在两个节点和两个MIS晶体管之间提供直连接并提供交叉连接 在第二操作模式期间在两个节点和两个MIS晶体管之间，以及控制电路，被配置为在第一和第二操作模式之一中使得非易失性存储单元将锁存在锁存电路中的数据存储为不可逆变化 的晶体管特性出现在所述两个MIS晶体管中的所选择的一个中，并且还被配置为在所述第一和第二操作模式中的另一个中引起所述锁存电路来检测存储在所述非易失性存储单元中的数据。

公开(公告)号：US07518917B2

公开(公告)日：2009-04-14

申请号：US11775951

申请日：2007-07-11

申请人： Kenji Noda ,  Takashi Kikuchi

发明人： Kenji Noda ,  Takashi Kikuchi

IPC分类号： G11C11/34

CPC分类号： G11C14/00 ,  G11C11/412

摘要： A nonvolatile semiconductor memory device includes a latch configured to store data, a plurality of word lines, a driver configured to activate one of the plurality of word lines, and a plurality of nonvolatile memory cells coupled to the respective word lines, each of the nonvolatile memory cells coupled to the latch so as to exchange stored data with the latch upon activation of a corresponding one of the word lines, each of the nonvolatile memory cells including two MIS transistors and configured to store data as an irreversible change of transistor characteristics occurring in one of the two MIS transistors, wherein the driver includes at least one nonvolatile memory cell storing count data responsive to a number of times storing of data has been performed with respect to the plurality of nonvolatile memory cells, and is configured to activate one of the word lines indicated by the count data.

摘要翻译： 非易失性半导体存储器件包括：锁存器，被配置为存储数据，多个字线，被配置为激活多个字线中的一个字线的驱动器;以及耦合到各个字线的多个非易失性存储器单元，每个非易失性存储器件 存储器单元耦合到所述锁存器，以便在激活相应的一条字线时与所述锁存器交换存储的数据，所述非易失性存储器单元中的每一个包括两个MIS晶体管，并且被配置为将数据存储为晶体管特性的不可逆变化， 两个MIS晶体管中的一个，其中驱动器包括至少一个非易失性存储单元，其存储响应于多次数据存储的数量的计数数据，并且被配置为激活多个非易失性存储单元中的一个， 字数由计数数据表示。

公开(公告)号：US20090069531A1

公开(公告)日：2009-03-12

申请号：US11918181

申请日：2006-04-12

申请人： Hisayasu Kaneshiro ,  Takashi Kikuchi ,  Takaaki Matsuwaki

发明人： Hisayasu Kaneshiro ,  Takashi Kikuchi ,  Takaaki Matsuwaki

IPC分类号： C08G73/10

CPC分类号： H05K1/0346 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08 ,  H05K1/0393 ,  H05K2201/0154

摘要： A polyimide film which, when used in FPC production, is reduced in dimensional change during the production steps. In particular, a metal-clad laminate apt to have abnormal parts such as rumples is produced from the film, and an FPC reduced in dimensional change is obtained in high yield. The polyimide film has a tan δ peak temperature within a range of 320° C. or more and lower than 380° C. in measuring a dynamic viscoelasticity, and is characterized by having a maximum sag of 13 mm or less.

摘要翻译： 当在FPC制造中使用时，在制造工序中尺寸变化减小的聚酰亚胺膜。 特别是，由薄膜制成易于具有诸如凸起等异常部分的覆金属层压板，以高收率获得尺寸变化减小的FPC。 在测量动态粘弹性时，聚酰亚胺膜的tanδ峰值温度在320℃以上且低于380℃的范围内，其特征在于具有13mm以下的最大凹陷。

公开(公告)号：US20090046977A1

公开(公告)日：2009-02-19

申请号：US12099356

申请日：2008-04-08

申请人： Roshan Thapliya ,  Takashi Kikuchi ,  Shigetoshi Nakamura

发明人： Roshan Thapliya ,  Takashi Kikuchi ,  Shigetoshi Nakamura

IPC分类号： G02B6/28

CPC分类号： G02B6/12004 ,  G02B6/125 ,  G02B2006/12145 ,  G02F1/3136

摘要： A waveguide device comprises a first multimode waveguide; a second multimode waveguide; a pair of intermediate single mode waveguides; an input-side single mode waveguides connected to the first multimode waveguide; a pair of output-side single mode waveguides connected to the second multimode waveguide; a pair of switching electrodes disposed to be superposed on the pair of intermediate single mode waveguides; and a ground electrode. The intermediate single mode waveguides are configured by a material whose refractive index is changed by voltages applied to the switching electrodes, the first multimode waveguide splits an optical signal into two signals whose intensities are equal, and the second multimode waveguide is formed, when voltages are not applied to the switching electrodes, to guide the optical signals out from the output-side single mode waveguides that are provided positions diagonal to the intermediate single mode waveguides through which the optical signals are propagated.

摘要翻译： 波导装置包括第一多模波导; 第二多模波导; 一对中间单模波导; 连接到第一多模波导的输入侧单模波导; 连接到第二多模波导的一对输出侧单模波导; 一对开关电极，被设置为叠置在所述一对中间单模波导上; 和接地电极。 中间单模波导由折射率由施加到开关电极的电压而改变的材料构成，第一多模波导将光信号分解为强度相等的两个信号，并且当电压为 不施加到开关电极，以引导光信号从与传播光信号的中间单模波导对角的提供位置的输出侧单模波导输出。

公开(公告)号：US20080303674A1

公开(公告)日：2008-12-11

申请号：US11547161

申请日：2005-03-31

申请人： Yuuki Hara ,  Takashi Kikuchi ,  Jun Goshima

发明人： Yuuki Hara ,  Takashi Kikuchi ,  Jun Goshima

IPC分类号： G08B13/22

CPC分类号： B60C23/0493 ,  G06K19/04 ,  G06K19/077 ,  G06K19/07764

摘要： Communication between a scanner and a wireless IC tag is performed with certainty. An installation hole is formed in the side surface of a tire and a holder with wireless IC tag 10 housing a wireless IC tag 18 is inserted into this installation hole. The holder with wireless IC tag 10 can open and close. It is opened, the wireless IC tag 18 is housed in a pocket 20, the holder with wireless IC tag 10 is closed and inserted into the installation hole. The holder with wireless IC tag 10 housing the wireless IC tag 18 is inserted into the outer surface of the tire so a scanner can be brought close to the wireless IC tag 18, which can reliably communicate with the scanner. Further, the holder with wireless IC tag 10 is installed to the tire after vulcanization so there does not cause damage to the wireless IC tag 18 due to heat and the like.

摘要翻译： 执行扫描仪与无线IC标签之间的通信。 在轮胎的侧面形成安装孔，在该安装孔插入具有无线IC标签10的保持架，该无线IC标签10容纳无线IC标签18。 具有无线IC标签10的支架可以打开和关闭。 打开时，将无线IC标签18容纳在口袋20中，将具有无线IC标签10的保持器封闭并插入安装孔。 容纳无线IC标签18的无线IC标签10的支架被插入到轮胎的外表面中，使得扫描仪可以靠近无线IC标签18，无线IC标签18可以可靠地与扫描仪通信。 此外，具有无线IC标签10的保持器在硫化后安装到轮胎上，因此不会由于热等而导致对无线IC标签18的损坏。

公开(公告)号：US20080260322A1

公开(公告)日：2008-10-23

申请号：US11809657

申请日：2007-06-01

申请人： Roshan Thapliya ,  Takashi Kikuchi ,  Shigetoshi Nakamura

发明人： Roshan Thapliya ,  Takashi Kikuchi ,  Shigetoshi Nakamura

IPC分类号： G02F1/295 ,  G02B6/26

CPC分类号： G02B6/2813 ,  G02F1/3136 ,  G02F2001/217 ,  G02F2201/06

摘要： An optical splitter/coupler has: a multimode waveguide having an electrooptic effect, and propagating light in a multimode; one incident waveguide propagating light in a single mode, and inputting the light to the multimode waveguide; one pair of emitting waveguides guiding-out, in a single mode, lights which have propagated-in through the multimode waveguide; at least one pair of individual electrodes provided so as to be positioned in vicinities of respective side edges on one surface of the multimode waveguide; and a ground electrode provided on another surface, wherein the multimode waveguide has a length such that 3(n+1) bright spots arise at a central portion and at both side edge portions due to incident light, the individual electrodes are provided at positions corresponding to an upstream-most one pair of the bright spots, and the emitting waveguides are connected to positions corresponding to a downstream-most one pair of the bright spots.

摘要翻译： 光分路器/耦合器具有：具有电光效应的多模波导和多模传播光; 一个入射波导以单一模式传播光，并将光输入到多模波导; 一对发射波导在单一模式中引导已经通过多模波导传播的光; 至少一对单独的电极被设置成位于多模波导的一个表面上的相应侧边缘附近; 以及设置在另一个表面上的接地电极，其中所述多模波导具有使得由于入射光而在中心部分和两个侧边缘部分处出现3（n + 1）个亮点的长度，所述各个电极设置在相应的位置处 到最上游的一对亮点，并且发射波导连接到对应于最下游一对亮点的位置。

公开(公告)号：US20080032103A1

公开(公告)日：2008-02-07

申请号：US11587771

申请日：2005-04-27

申请人： Takashi Kikuchi ,  Hiroyuki Tsuji ,  Takashi Itoh ,  Shigeru Tanaka ,  Eiichiro Kuribayashi ,  Greg Clements

发明人： Takashi Kikuchi ,  Hiroyuki Tsuji ,  Takashi Itoh ,  Shigeru Tanaka ,  Eiichiro Kuribayashi ,  Greg Clements

IPC分类号： H05K1/03 ,  H05K3/46

CPC分类号： H05K1/0346 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/0129 ,  H05K2201/0154 ,  Y10T428/24959 ,  Y10T428/31725

摘要： A multilayer printed circuit board can be used in high-frequency applications, is not easily affected by environmental changes, and has stable dielectric characteristics. A multilayer printed circuit board suitable for use in the high-frequency range includes at least two printed wiring sheets laminated with an interlayer bonding member therebetween. At least one of the at least two printed wiring sheets includes an insulating film, an adhesive layer containing a thermoplastic polyimide disposed on at least one surface of the insulating film, and a metal wiring layer disposed on the adhesive layer. The interlayer bonding member contains a thermoplastic polyimide.

摘要翻译： 多层印刷电路板可用于高频应用，不易受环境变化的影响，具有稳定的介电特性。 适用于高频范围的多层印刷电路板包括至少两层印刷布线片，其间夹有层间接合构件。 所述至少两个印刷布线板中的至少一个包括绝缘膜，包含设置在所述绝缘膜的至少一个表面上的热塑性聚酰亚胺的粘合剂层和设置在所述粘合剂层上的金属布线层。 层间结合部件含有热塑性聚酰亚胺。

公开(公告)号：US20070179271A1

公开(公告)日：2007-08-02

申请号：US11698656

申请日：2007-01-26

申请人： Hisayasu Kaneshiro ,  Hiroyuki Tsuji ,  Takashi Kikuchi

发明人： Hisayasu Kaneshiro ,  Hiroyuki Tsuji ,  Takashi Kikuchi

IPC分类号： C08G69/08

CPC分类号： C08G73/1007 ,  C08G73/10 ,  C08G73/1042 ,  C09D179/08 ,  C09J179/08 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/0154 ,  Y10T428/31721

摘要： A non-thermoplastic polyimide film exhibits high adherability without expensive surface treatment and is made from a precursor solution having high storage stability. The non-thermoplastic polyimide film comprises a non-thermoplastic polyimide resin having a block component derived from a thermoplastic polyimide. Preferably, the block component of the thermoplastic polyimide is present in an amount of 20 to 60 mol % of the entire polyimide so that the precursor solution thereof exhibits high storage stability and that the film can exhibit high adherability, in particular, high adherability to polyimide adhesives.

摘要翻译： 非热塑性聚酰亚胺膜表现出高附着性，而不需要昂贵的表面处理，并由具有高储存稳定性的前体溶液制成。 非热塑性聚酰亚胺膜包括具有衍生自热塑性聚酰亚胺的嵌段组分的非热塑性聚酰亚胺树脂。 优选地，热塑性聚酰亚胺的嵌段组分的存在量为整个聚酰亚胺的20至60摩尔％，使得其前体溶液表现出高的储存稳定性，并且该膜可以表现出高的可粘合性，特别是对聚酰亚胺的高粘合性 粘合剂。

公开(公告)号：US20070144669A1

公开(公告)日：2007-06-28

申请号：US10582884

申请日：2004-12-20

申请人： Takashi Kikuchi ,  Hiroyuki Tsuji

发明人： Takashi Kikuchi ,  Hiroyuki Tsuji

IPC分类号： C09J5/00 ,  B32B37/10 ,  B32B37/20 ,  B32B37/26

CPC分类号： B29C66/00441 ,  B29C65/02 ,  B29C65/18 ,  B29C65/26 ,  B29C65/30 ,  B29C65/5057 ,  B29C66/1122 ,  B29C66/45 ,  B29C66/71 ,  B29C66/72321 ,  B29K2995/0016 ,  B29L2009/001 ,  B29L2009/003 ,  B32B37/0007 ,  B32B37/08 ,  B32B37/12 ,  B32B37/26 ,  B32B2311/00 ,  H05K1/0393 ,  H05K3/022 ,  H05K2203/1383 ,  B29K2079/08

摘要： A method for producing a heat-resistant flexible laminate in which appearance defects, such as wrinkles and waviness, can be prevented and dimensional stability can be improved is provided. A method for producing a flexible laminate including a heat-resistant adhesive film (A) and a metal foil (B) bonded to at least one surface of the heat-resistant adhesive film (A) includes a step of performing thermal lamination by passing the heat-resistant adhesive film (A) and the metal foil (B) between at least one pair of metal rollers through a protective film; a step of slowly cooling a laminate including the heat-resistant adhesive film (A), the metal foil (B), and the protective film; and a step of separating the protective film. The slow cooling step is preferably performed by providing a heating mechanism, in particular, a slow-cooling roller, of which temperature is set lower than the surface temperature of the metal rollers. The surface temperature of the slow-cooling roller is preferably set lower than the surface temperature of the metal rollers by 50° C. to 250° C.

摘要翻译： 提供了可以防止诸如褶皱和波纹等外观缺陷并且可以提高尺寸稳定性的耐热柔性层压体的制造方法。 一种制造粘合到耐热粘合膜（A）的至少一个表面上的耐热粘合剂膜（A）和金属箔（B）的柔性层压体的方法包括通过使耐热粘合膜 耐热粘合膜（A）和金属箔（B）通过保护膜在至少一对金属辊之间; 缓慢冷却包含耐热粘合膜（A），金属箔（B）和保护膜的层压体的步骤; 以及分离保护膜的步骤。 缓慢冷却步骤优选通过提供加热机构，特别是将其设定为低于金属辊的表面温度的缓慢冷却辊来进行。 缓慢冷却辊的表面温度优选设定为低于金属辊的表面温度50℃至250℃。