公开(公告)号：US07601051B2

公开(公告)日：2009-10-13

申请号：US11905743

申请日：2007-10-03

申请人： Yasuo Tanaka

发明人： Yasuo Tanaka

IPC分类号： B24B1/00

CPC分类号： B24B7/228 ,  B24D7/06

摘要： A grinding machine for grinding a workpiece, including a chucking table having a chucking area and a grinder head. The grinder head includes a spinning disk rotating about a rotation axis and a plurality of grindstones, which are circularly arranged on a surface of the spinning disk, whereby a slit is created between the adjacent grindstones, wherein both of the adjacent grindstones is arranged to make contact with an edge of the workpiece while grinding the workpiece.

摘要翻译： 一种用于研磨工件的磨床，包括具有夹紧区域的夹紧台和研磨头。 研磨头包括围绕旋转轴线旋转的旋转盘和多个磨石，其圆形地布置在旋转盘的表面上，由此在相邻的砂轮之间形成狭缝，其中两个相邻的磨石被布置成 在磨削工件时与工件的边缘接触。

公开(公告)号：US07436073B2

公开(公告)日：2008-10-14

申请号：US11523657

申请日：2006-09-20

申请人： Yasuo Tanaka

发明人： Yasuo Tanaka

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/16 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/351 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/3463 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/00

摘要： A junction structure, and a semiconductor device including the same, for a junction of a terminal pad and solder, including an underlying base on which said terminal pad is formed; a nickel layer disposed on the terminal pad; a palladium layer or a gold layer disposed on the nickel layer; the solder; and a zinc system material layer provided between the palladium layer or the gold layer and the solder. The terminal pad and the solder may be provided in a semiconductor device in which the terminal pad lies inside the semiconductor device, and the zinc system material layer is formed between the terminal pad and the solder. The terminal pad may be provided over a substrate, the solder may be provided in the semiconductor device, and the zinc system material layer is then formed between the terminal pad of the substrate and the solder of the semiconductor device.

摘要翻译： 一种结构结构及包括该结结构的半导体器件，用于端子焊盘和焊料的接合处，包括形成有所述端子焊盘的基底; 设置在所述端子焊盘上的镍层; 设置在镍层上的钯层或金层; 焊料; 以及设置在钯层或金层与焊料之间的锌系材料层。 端子焊盘和焊料可以设置在其中端子焊盘位于半导体器件内部的半导体器件中，并且在端子焊盘和焊料之间形成锌系材料层。 端子焊盘可以设置在衬底上，焊料可以设置在半导体器件中，然后在衬底的端子焊盘和半导体器件的焊料之间形成锌系材料层。

公开(公告)号：US20080124843A1

公开(公告)日：2008-05-29

申请号：US12007874

申请日：2008-01-16

申请人： Shinji Ohuchi ,  Yasuo Tanaka

发明人： Shinji Ohuchi ,  Yasuo Tanaka

IPC分类号： H01L21/56

CPC分类号： H01L24/11 ,  H01L21/56 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A resin sealed semiconductor device includes a semiconductor chip having a main surface, a plurality of surface electrodes formed on the main surface of the chip, a plurality of projection electrodes formed the main surface, each projection electrode being connected to respective one surface electrodes, and a resin shield covering the main surface, the surface electrodes and side surfaces of the projection electrodes, the resin having a thermal expansion coefficient in the range of 8-10 ppm/° C. and a Young's modulus in the range of 1.8-2.0 Gpa.

摘要翻译： 树脂密封半导体器件包括具有主表面的半导体芯片，形成在芯片的主表面上的多个表面电极，形成主表面的多个突起电极，每个突起电极连接到相应的一个表面电极，以及 覆盖主表面，表面电极和突起电极的侧表面的树脂屏蔽，该树脂的热膨胀系数在8-10ppm /℃的范围内，杨氏模量在1.8-2.0Gpa的范围内 。

公开(公告)号：US07172162B2

公开(公告)日：2007-02-06

申请号：US11126317

申请日：2005-05-11

申请人： Suguru Mizukoshi ,  Tomio Shibuya ,  Yasuo Tanaka ,  Shunya Jinnai ,  Masato Kanbe

发明人： Suguru Mizukoshi ,  Tomio Shibuya ,  Yasuo Tanaka ,  Shunya Jinnai ,  Masato Kanbe

IPC分类号： F16L3/22

CPC分类号： B60H1/00557 ,  F16L3/2235

摘要： A clamp device for mounting elongated components such as pipes on a support such as a car body comprises a first clamp to be mounted on the support and a second clamp to be mounted in a recess in the first clamp. The clamp device is constructed to permit limited transverse movement of the second clamp in the recess, to accommodate bending or curving of elongated components held by the second clamp. The first clamp may also hold elongated components.

摘要翻译： 用于将细长部件（例如管道）安装在诸如车体的支撑件上的夹紧装置包括要安装在支撑件上的第一夹具和要安装在第一夹具中的凹部中的第二夹具。 夹持装置被构造成允许第二夹具在凹部中的有限的横向移动，以适应由第二夹具保持的细长部件的弯曲或弯曲。 第一夹具还可以保持细长部件。

公开(公告)号：US07140103B2

公开(公告)日：2006-11-28

申请号：US10170614

申请日：2002-06-14

申请人： Morio Gaku ,  Nobuyuk Ikeguchi ,  Katsuji Komatsu ,  Yasuo Tanaka ,  Keiichi Iwata ,  Ken-ichi Shimizu

发明人： Morio Gaku ,  Nobuyuk Ikeguchi ,  Katsuji Komatsu ,  Yasuo Tanaka ,  Keiichi Iwata ,  Ken-ichi Shimizu

IPC分类号： H01K3/10

CPC分类号： H05K3/025 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2203/0723 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Process for producing a high-density printed wiring board, comprising: providing an ultrathin-copper-foil-clad board having a hole and outermost copper foil thickness of 5 μm or less, plating the surface by electroless copper plating to form a layer of 0.1 to 1 μm thickness, forming an electrolytic copper plating layer of 0.5 to 3 μm thickness using the electroless copper plating layer as electrode, forming a plating resist layer on a portion of the copper plating layer, forming a pattern copper plating layer of 6 to 30 μm thickness on the copper surface in where the plating resist layer is not formed, by electrolytic plating, removing the plating resist layer, and etching the entire surface to remove the thin electrolytic copper layer, the electroless copper layer and ultrathin copper foil layer at least where the pattern copper plating layer is not formed.

摘要翻译： 一种制造高密度印刷电路板的方法，包括：提供一种具有孔和最外铜箔厚度为5μm或更小的超薄铜箔包覆板，通过无电镀铜将表面镀覆以形成0.1层 使用无电镀铜层作为电极，形成0.5〜3μm厚的电解镀铜层，在铜镀层的一部分上形成电镀抗蚀剂层，形成6〜30μm的图案镀铜层 通过电解电镀，去除电镀抗蚀剂层，并蚀刻整个表面以除去薄的电解铜层，化学镀铜层和超薄铜箔层至少在铜表面上形成的电镀抗蚀剂层的厚度 其中未形成图案铜镀层。

公开(公告)号：US20060086269A1

公开(公告)日：2006-04-27

申请号：US11243973

申请日：2005-10-06

申请人： Yasuo Tanaka

发明人： Yasuo Tanaka

IPC分类号： B41M1/12

CPC分类号： H05K3/1233 ,  H01L51/0022 ,  H05K2203/0264 ,  H05K2203/074

摘要： Conductive ink is printed onto a wafer held on a vertically movable stage by using a squeegee to force the conductive ink through a stencil. The stencil is supported from below by a supporting member adjacent to the periphery of the stage. After the conductive ink has been printed through the stencil, pneumatic pressure is applied to the stencil from above, and the stage is lowered to separate the wafer from the stencil. The supporting member holds the stencil taut while the stage is being lowered, so that the stencil does not warp downward and the printed conductive ink leaves the stencil at substantially the same time at all points on the wafer surface, preventing the premature escape of air and loss of pneumatic pressure.

摘要翻译： 通过使用刮板将导电油墨印刷在保持在垂直移动台上的晶片上，以迫使导电油墨通过模板。 模板通过邻近台周边的支撑构件从下方支撑。 在通过模板印刷导电油墨之后，气动压力从上方施加到模板，并且阶段被降低以将晶片与模板分离。 支撑构件在台阶下降时保持模板拉紧，使得模板不向下翘曲，并且印刷的导电油墨在晶片表面上的所有点处基本上同时离开模板，防止空气过早逸出，并且 气动压力损失。

公开(公告)号：US06969562B2

公开(公告)日：2005-11-29

申请号：US10220471

申请日：2001-03-02

申请人： Qingquan Su ,  Kazuo Kinoshita ,  Yasuo Tanaka ,  Tomohiro Togo

发明人： Qingquan Su ,  Kazuo Kinoshita ,  Yasuo Tanaka ,  Tomohiro Togo

IPC分类号： B01D53/52 ,  B01D19/00 ,  B01D53/14 ,  C01B3/38 ,  C01B3/48 ,  C02F3/28 ,  C02F11/04 ,  H01M8/04 ,  H01M8/06 ,  H01M8/10 ,  C01B3/26

CPC分类号： H01M8/0662 ,  C01B3/38 ,  C01B3/48 ,  C01B2203/0233 ,  C01B2203/0283 ,  C01B2203/044 ,  C01B2203/047 ,  C01B2203/066 ,  C01B2203/1241 ,  C01B2203/1258 ,  H01M8/0612 ,  H01M8/0618 ,  H01M8/086 ,  H01M8/1007 ,  Y02C10/06 ,  Y02E50/343 ,  Y02P20/129

摘要： A hydrogen-containing gas suitable for use in a fuel cell, especially in a proton exchange membrane fuel cell, is produced from a digestion gas (b) yielded in methane fermentation of organic matter (a), and is then supplied to the fuel cell to generate electricity. A fuel cell power generation method comprises a methane fermentation step (A) for subjecting organic matter to methane fermentation, a pretreatment step (B) for pretreating digestion gas yielded in the methane fermentation step, a hydrogen production step (C) for producing hydrogen-containing gas (c) from the gas which has been pretreated in the pretreatment step, and a fuel cell power generation step (D) for supplying the hydrogen-containing gas produced in the hydrogen production step to a fuel cell to generate electricity. The pretreatment step comprises an alkaline absorption step (B1) for absorbing carbon dioxide or carbon dioxide and hydrogen sulfide contained in the digestion gas yielded in the methane fermentation step into an alkaline absorbent solution.

摘要翻译： 适用于燃料电池，特别是质子交换膜燃料电池中的含氢气体，由有机物（a）的甲烷发酵产生的消解气体（b）产生，然后供给燃料电池 发电。 一种燃料电池发电方法，其特征在于，包括：甲烷发酵工序（A），甲烷发酵用有机物的甲烷发酵工序（A），用于前处理甲烷发酵工序产生的消化气体的前处理工序（B） 在预处理步骤中已经预处理的气体含有气体（c），以及用于将在氢气制备步骤中产生的含氢气体供应到燃料电池以产生电力的燃料电池发电步骤（D）。 预处理步骤包括将在甲烷发酵步骤中产生的消化气体中所含的二氧化碳或二氧化碳和硫化氢吸收到碱性吸收剂溶液中的碱性吸收步骤（B1）。

公开(公告)号：US06933179B1

公开(公告)日：2005-08-23

申请号：US09660484

申请日：2000-09-12

申请人： Yasuo Tanaka

发明人： Yasuo Tanaka

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L23/31 ,  H01L23/485

CPC分类号： H01L24/10 ,  H01L21/56 ,  H01L23/3114 ,  H01L24/13 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/274 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00014

摘要： When a wafer, which has completed a wafer process and has a main surface on which a plurality of bumps respectively connected to a plurality of electrode pads are formed, is brought into a resin molded type package to thereby manufacture a semiconductor device, a method of manufacturing such a semiconductor device includes placing a sheet encapsulating material containing a thermosetting resin over the wafer so as to cover the main surface of the wafer and, heating and curing the sheet encapsulating material by a heating apparatus to thereby form an encapsulating resin layer.

摘要翻译： 当已经完成了晶片工艺并且具有分别连接到多个电极焊盘的多个凸块的主表面的晶片被引入到树脂模制型封装中，从而制造半导体器件， 制造这样的半导体器件包括将包含热固性树脂的片材封装材料放置在晶片上以覆盖晶片的主表面，并且通过加热装置加热和固化片状封装材料，从而形成封装树脂层。

公开(公告)号：US20050165905A1

公开(公告)日：2005-07-28

申请号：US10938570

申请日：2004-09-13

申请人： Tadao Michimura ,  Yasuo Tanaka ,  Tomonari Yamauchi

发明人： Tadao Michimura ,  Yasuo Tanaka ,  Tomonari Yamauchi

IPC分类号： G06F15/16 ,  G06F13/00 ,  G06F15/00 ,  H04L29/06 ,  H04L29/08 ,  G06F7/38

CPC分类号： H04L29/06 ,  H04L67/02 ,  H04L67/10 ,  H04L69/329

摘要： The present invention provides a device for changing instruction description. The device includes: a receiving unit that receives an instruction description instructing a processing to be executed by an executing unit and a location of the executing unit; a judging unit that judges whether or not the location instructed by the instruction description indicates a location of a predetermined utilizable executing unit; and a changing unit that changes the location instructed by the instruction description to the location of the predetermined utilizable executing unit which can execute the processing instructed by the instruction description, when the location instructed by the instruction description is not judged to indicate the location of the predetermined utilizable executing unit.

摘要翻译： 本发明提供一种用于改变指令描述的装置。 该装置包括：接收单元，其接收指示由执行单元执行的处理和执行单元的位置的指令描述; 判断单元，判断由指示描述指示的位置是否指示预定的可利用执行单元的位置; 以及改变单元，其将指示描述指示的位置改变为能够执行由指令描述指示的处理的预定可利用执行单元的位置，当指示描述指示的位置未被判断为指示该位置时 预定可利用的执行单元。

公开(公告)号：US06899533B2

公开(公告)日：2005-05-31

申请号：US10093397

申请日：2002-03-11

申请人： Yasuo Tanaka ,  Jiro Matsumoto

发明人： Yasuo Tanaka ,  Jiro Matsumoto

IPC分类号： B29C45/26 ,  B29C45/02 ,  B29C45/14 ,  B29C45/53 ,  H01L21/56 ,  B29C70/72

CPC分类号： B29C45/14655 ,  B29C45/02

摘要： A system for manufacturing a semiconductor device, comprises first and second metal molds (100a, 100b) to form a cavity; a pair of plungers (102, 103) provided in cylinder holes (102a, 103b) of the second metal mold (100b); a pressure supplying unit for pushing the plungers (102, 103) under a pressure lower than the injection pressure applied to the plunger (101) to form debris cavities (DC1, DC2) which absorb an excess resin, thereby reducing the height of a projection produced on the enclosing resin layer.

摘要翻译： 一种用于制造半导体器件的系统，包括形成空腔的第一和第二金属模具（100a，100b） 设置在第二金属模具（100b）的气缸孔（102a，103b）中的一对柱塞（102,103）; 压力供应单元，用于在低于施加到柱塞（101）的注射压力的压力下推动柱塞（102,103），以形成吸收多余树脂的碎屑空腔（DC 1，DC 2），从而降低 在封闭树脂层上产生的突起。