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200 条记录 (耗时 0.038 秒)

    Semiconductor device including combed bond pad opening, assemblies and methods
    41.
    发明授权
    Semiconductor device including combed bond pad opening, assemblies and methods 有权
    半导体器件包括精梳接合焊盘开口，组件和方法

    公开(公告)号：US6144560A

    公开(公告)日：2000-11-07

    申请号：US464992

    申请日：1999-12-16

    申请人： Warren M. Farnworth ,  Walter L. Moden ,  Larry D. Kinsman

    发明人： Warren M. Farnworth ,  Walter L. Moden ,  Larry D. Kinsman

    IPC分类号： H01L23/32 ,  H01L23/48 ,  H05K7/10

    CPC分类号： H01L23/32 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/3011

    摘要： A semiconductor device including bond pads disposed proximate an edge thereof, and an overcoat layer. The overcoat layer defines notches around each of the bond pads. The overcoat layer may be formed from a photoimageable material such as a photoimageable epoxy. The invention also includes an alignment device that secures the semiconductor device perpendicularly upon a carrier substrate. The alignment device includes intermediate conductive elements which correspond to the bond pads of the semiconductor device. Upon insertion of the semiconductor device into the alignment device, the notches facilitate alignment of the bond pads with their corresponding intermediate conductive elements. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate.

    摘要翻译： 一种半导体器件，包括靠近其边缘的接合焊盘和外涂层。 外涂层在每个接合焊盘周围形成凹口。 外涂层可以由可光成像的材料例如可光成像的环氧树脂形成。 本发明还包括将半导体器件垂直地固定在载体衬底上的对准装置。 对准装置包括对应于半导体器件的接合焊盘的中间导电元件。 在将半导体器件插入到对准装置中时，凹口有助于键合焊盘与其对应的中间导电元件的对准。 中间导电元件在半导体器件和载体衬底之间建立电连接。

    Semiconductor device socket, assembly and methods
    42.
    发明授权
    Semiconductor device socket, assembly and methods 有权

    公开(公告)号：US6088237A

    公开(公告)日：2000-07-11

    申请号：US207646

    申请日：1998-12-08

    申请人： Warren M. Farnworth ,  Larry D. Kinsman ,  Walter L. Moden

    发明人： Warren M. Farnworth ,  Larry D. Kinsman ,  Walter L. Moden

    IPC分类号： H01R12/89 ,  H05K7/10

    CPC分类号： H05K7/1007 ,  H01R12/89

    摘要： A socket that secures bare and minimally packaged semiconductor devices substantially perpendicularly relative to a carrier substrate. The socket includes intermediate conductive elements and a member which moves the intermediate conductive elements between an insertion position and a biased position. After placement of the intermediate conductive elements into an insertion position, a semiconductor device may be inserted into a receptacle of the socket with minimal insertion force. Movement of the member to a biased position facilitates biasing of the intermediate conductive elements against a bond pad of the semiconductor device. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate. A first embodiment of the socket includes a member which moves transversely relative to the remainder of the socket. In a second embodiment of the socket, the member moves vertically relative to the socket body.

    Vertical surface mount assembly and methods
    43.
    发明授权
    Vertical surface mount assembly and methods 有权
    垂直表面安装组件及方法

    公开(公告)号：US07871859B2

    公开(公告)日：2011-01-18

    申请号：US10202359

    申请日：2002-07-23

    申请人： Larry D. Kinsman ,  Jerry M. Brooks ,  Warren M. Farnworth ,  Walter L. Moden ,  Terry R. Lee

    发明人： Larry D. Kinsman ,  Jerry M. Brooks ,  Warren M. Farnworth ,  Walter L. Moden ,  Terry R. Lee

    IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

    CPC分类号： H05K3/301 ,  H01L2924/0002 ,  Y10T29/4913 ,  H01L2924/00

    摘要： A vertically mountable semiconductor device assembly including a semiconductor device and a mechanism for attaching the semiconductor device to a carrier substrate. The semiconductor device has each of its bond pads disposed proximate a single edge thereof. Preferably, at least a portion of the semiconductor device is exposed. An alignment device is attached to a carrier substrate. A mounting element on the vertically mountable semiconductor device package engages the alignment device to interconnect the semiconductor device and the alignment device. Preferably, the alignment device secures the vertically mountable semiconductor device package perpendicular relative to the carrier substrate. The distance between the bond pads and corresponding terminals on the carrier substrate is very small in order to reduce impedance. The vertically mountable semiconductor device package may also be readily user-upgradable.

    摘要翻译： 一种可垂直安装的半导体器件组件，包括半导体器件和用于将半导体器件附着到载体衬底的机构。 半导体器件的每个接合焊盘都设置在其单个边缘附近。 优选地，半导体器件的至少一部分被暴露。 对准装置附接到载体基板。 可垂直安装的半导体器件封装上的安装元件与对准装置接合以使半导体器件和对准器件互连。 优选地，对准装置将垂直安装的半导体器件封装相对于载体衬底垂直固定。 接合焊盘和载体基板上的对应端子之间的距离非常小以减少阻抗。 垂直安装的半导体器件封装也可以容易地用户升级。

    Vertical surface mount assembly and methods
    45.
    发明授权
    Vertical surface mount assembly and methods 有权

    公开(公告)号：US06611058B2

    公开(公告)日：2003-08-26

    申请号：US09819452

    申请日：2001-03-27

    申请人： Larry D. Kinsman ,  Jerry M. Brooks ,  Warren M. Farnworth ,  Walter L. Moden ,  Terry R. Lee

    发明人： Larry D. Kinsman ,  Jerry M. Brooks ,  Warren M. Farnworth ,  Walter L. Moden ,  Terry R. Lee

    IPC分类号： H01L2334

    CPC分类号： H05K3/301 ,  H01L2924/0002 ,  Y10T29/4913 ,  H01L2924/00

    摘要： A vertically mountable semiconductor device assembly including a semiconductor device and a mechanism for attaching the semiconductor device to a carrier substrate. The semiconductor device has each of its bond pads disposed proximate a single edge thereof. Preferably, at least a portion of the semiconductor device is exposed. An alignment device is attached to a carrier substrate. A mounting element on the vertically mountable semiconductor device package engages the alignment device to interconnect the semiconductor device and the alignment device. Preferably, the alignment device secures the vertically mountable semiconductor device package perpendicular relative to the carrier substrate. The distance between the bond pads and corresponding terminals on the carrier substrate is very small in order to reduce impedance. The vertically mountable semiconductor device package may also be readily user-upgradable.

    Vertical surface mount assembly
    46.
    发明授权
    Vertical surface mount assembly 有权
    垂直表面安装组件

    公开(公告)号：US06492728B2

    公开(公告)日：2002-12-10

    申请号：US09837310

    申请日：2001-04-18

    申请人： Larry D. Kinsman ,  Jerry M. Brooks ,  Warren M. Farnworth ,  Walter L. Moden ,  Terry R. Lee

    发明人： Larry D. Kinsman ,  Jerry M. Brooks ,  Warren M. Farnworth ,  Walter L. Moden ,  Terry R. Lee

    IPC分类号： H01L2332

    CPC分类号： H05K3/301 ,  H01L2924/0002 ,  Y10T29/4913 ,  H01L2924/00

    摘要： A vertically mountable semiconductor device assembly including a semiconductor device and a mechanism for attaching the semiconductor device to a carrier substrate. The semiconductor device has each of its bond pads disposed proximate a single edge thereof. Preferably, at least a portion of the semiconductor device is exposed. An alignment device is attached to a carrier substrate. A mounting element on the vertically mountable semiconductor device package engages the alignment device to interconnect the semiconductor device and the alignment device. Preferably, the alignment device secures the vertically mountable semiconductor device package perpendicular relative to the carrier substrate. The distance between the bond pads and corresponding terminals on the carrier substrate is very small in order to reduce impedance. The vertically mountable semiconductor device package may also be readily user-upgradable.

    摘要翻译： 一种可垂直安装的半导体器件组件，包括半导体器件和用于将半导体器件附着到载体衬底的机构。 半导体器件的每个接合焊盘都设置在其单个边缘附近。 优选地，半导体器件的至少一部分被暴露。 对准装置附接到载体基板。 可垂直安装的半导体器件封装上的安装元件与对准装置接合以使半导体器件和对准器件互连。 优选地，对准装置将垂直安装的半导体器件封装相对于载体衬底垂直固定。 接合焊盘和载体基板上的对应端子之间的距离非常小以减少阻抗。 垂直安装的半导体器件封装也可以容易地用户升级。